Abstract: A heating element includes a flexible substrate, a layer of adhesive disposed on a surface of the substrate, and a continuous strand of electrically conductive wire disposed on the adhesive in a pattern of coil structures. Each coil structure includes a first coiled part and a second coiled part. The wire in the first coiled part forms a counterclockwise pattern from an outermost turn to an innermost turn of the first coiled part, and the second coiled part has an innermost turn beginning at an end of the innermost turn of the first coiled part. The wire in the second coiled part forms a clockwise pattern from the innermost turn of the second coiled part to an outermost turn. A connector segment of wire connects outermost turns of adjacent ones of the coil structures.

Abstract: Approaches for use in making a lid for a blister package include forming a continuous pattern of electrically conductive wire on an adhesive surface of a substrate. The continuous pattern has a plurality of detector segments, and each detector segment has an outer connector portion and an inner connector portion. The outer connector portion and the inner connector portion of each detector segment are adjacent to one another, and pairs of successive first and second detector segments of the plurality of detector segments are connected by the inner connector portion of the first detector segment and the outer connector portion of the second detector segment. The forming includes forming an arced segment between the inner connector portion of the first detector segment and the outer connector portion of the second detector segment.

Abstract: A lighting apparatus includes an elongate substrate, a supply rail disposed on one surface of the substrate, and first and second ground rails disposed on the other surface. SSL packages are disposed parallel to the longitudinal axis of the substrate and between the first and second ground rails. Each package has SSL elements disposed on a first side and pairs of contact pads disposed on a second side. The SSL packages are serially coupled from the first package to the last package. One contact pad of each pair of the contact pads of the first package is coupled to the supply rail through the substrate, one contact pad of a first pair of the pairs of contact pads of the last package is coupled to the first ground rail at the first surface of the substrate, and one contact pad of a second pair of the pairs of contact pads of the last package is coupled to the second ground rail at the first surface of the substrate.

Abstract: A lighting apparatus includes a flexible elongate substrate, a supply rail disposed on one surface of the substrate, and first and second ground rails disposed on the other surface. Groups of SSL packages are disposed parallel to the longitudinal axis of the substrate and between the first and second ground rails. Each package has SSL elements disposed on a first side and pairs of contact pads disposed on a second side. The SSL packages in each group are serially coupled from the first package to the last package of the group. One contact pad of each pair of the contact pads of the first package of each group is coupled to the supply rail through the substrate, one contact pad of a first pair of the pairs of contact pads of the last package of each group is coupled to the first ground rail at the first surface of the substrate, and one contact pad of a second pair of the pairs of contact pads of the last package of each group is coupled to the second ground rail at the first surface of the substrate.

Abstract: A blister package lid includes a substrate, a layer of adhesive, and a continuous pattern of electrically conductive wire disposed directly on the adhesive layer. The continuous pattern of wire has a plurality of detector segments, and the plurality of detector segments have respective destructible portions of wire at locations on the substrate corresponding to cavities of a blister sheet. Each detector segment has an outer connector portion and an inner connector portion. The outer connector portion and the inner connector portion of each detector segment are adjacent to one another, and pairs of successive first and second detector segments of the plurality of detector segments are connected by an arced segment between the inner connector portion of the first detector segment and the outer connector portion of the second detector segment.

Abstract: A transponder arrangement includes a flexible substrate having a first portion configured to engage a first structure and a second portion configured to engage a second structure, and a transponder integrated circuit (IC). Detection wiring is disposed on the first portion of the flexible substrate and coupled to the transponder IC, and an antenna disposed on the second portion of the flexible substrate and coupled to the transponder IC. The transponder IC is configured to generate an RF data signal that encodes different data values in response to the antenna resonating and different electricity levels on the detection wiring.

Abstract: A disclosed apparatus and related method are directed to engagement of a tool with a workpiece, utilizing a first platen having a first axis of rotation and a workpiece mount and a second platen having a second axis of rotation and a tool mount. The first platen moves the workpiece mount along a first arc by rotating about the first axis of rotation, and the second platen moves the tool mount along a second arc by rotating about the second axis of rotation. The first and second platens rotate relative to one another such that a tool-workpiece intersection point (e.g., a tool endpoint), which is offset from and fixed relative to the second platen, follows a tool path that is offset from and fixed relative to the first platen as the first and second platens rotate.

Abstract: A transponder arrangement includes a frame and a RF transponder tag. The frame has a transponder bed. A raised edge at least partially surrounds the transponder bed and forms a recessed surface on the transponder bed. The frame includes a plurality of support members attached to the transponder bed. The support members provide a ventilated air-space and separation between the transponder bed and surfaces for attachment to the target article. The RF transponder tag is attached to the frame on the recessed surface of the transponder bed.

Abstract: The disclosed lighting apparatus has a light-diffusive panel having opposing first and second faces bounded by one or more sides and having one or more channels extending inward from one of the one or more sides. A first conductor is disposed on the first face of the light-diffusive panel and is proximate a first side. The first conductor has a concave section disposed within a channel of the one or more channels. A second conductor is disposed on the second face of the light-diffusive panel and is proximate the first side. The second conductor has a concave section disposed within a channel. Solid-state lighting (SSL) elements have light emitting portions that face a second side that is adjacent to the first side of the light-diffusive panel, and the SSL elements are electrically coupled to the first conductor and to the second conductor.

Abstract: A disclosed transponder arrangement includes a transponder integrated circuit (IC), an inductive loop, and a dipole antenna. First and second wires are coupled to the transponder IC and have portions configured for different levels of electrical coupling between one another. Engagement of the inductive loop with an induction portion of the dipole antenna induces current flow in the inductive loop in response to the dipole antenna resonating from a radio frequency (RF) signal, and disengagement makes the transponder IC non-responsive to the RF signal. Depending on a level of electrical coupling between the first and second wires, the transponder IC generates an RF signal that encodes either a first value indicating partial engagement or a second value indicating full engagement in response to the current flow in the inductive loop.

Abstract: A lid for a blister package has a continuous pattern of wire on an adhesive surface of a substrate. The continuous pattern has multiple detector segments, and the detector segments have respective destructible portions of wire at locations on the substrate corresponding to cavities of a blister sheet. Each detector segment has an outer connector portion and an inner connector portion. The outer connector portion and the inner connector portion of each detector segment are adjacent, and pairs of successive detector segments are connected by the inner connector portion of the one detector segment and the outer connector portion of the next detector segment. The continuous pattern of wire is severed at the outer connector portions and inner connector portions of the plurality of detector segments in order to disconnects the detector segments one from another, and form terminal ends of the detector segments.

Abstract: A lighting apparatus includes a light-diffusive panel that has opposing first and second faces bounded by one or more sides. A first conductor is disposed on the first face of the light-diffusive panel and proximate a first side of the one or more sides. A second conductor is disposed on the second face of the light-diffusive panel and proximate the first side. A first plurality of solid-state lighting (SSL) elements have light emitting portions that face a second side that is adjacent to the first side of the light-diffusive panel. The first plurality of SSL elements are electrically coupled to the first conductor and to the second conductor.

Abstract: A disclosed circuit arrangement includes adhesive transfer tape, and an electronic device attached to adhesive of the adhesive transfer tape. First and second cross wires are attached to the adhesive and are disposed proximate the electronic device. One or more wire segments are attached to the adhesive and have first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire, respectively. The first and second cross wires and the one or more wire segments have round cross sections, the first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. First and second bond wires are connected to the electronic device and to the first and second portions of the one or more wire segments, respectively.

Abstract: A disclosed circuit arrangement includes an adhesive layer on a water soluble backing, antenna wire adhered to the adhesive layer, an RF transponder disposed on the adhesive layer, and first and second cross wires attached to the adhesive layer and disposed proximate the RF transponder. The antenna wire has first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire. The first and second cross wires and the antenna wire have round cross sections. The first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. A first bond wire is connected to the RF transponder and to the first portion of the antenna wire, and a second bond wire is connected to the RF transponder and to the second portion of the antenna wire.

Abstract: The disclosed transponder arrangement includes adhesive transfer tape and an RF transponder. The adhesive transfer tape includes an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. An antenna is adhered directly to the adhesive layer, and an RF transponder is disposed on the adhesive layer and coupled to the antenna. A layer of ink is disposed directly on one of the first adhesive surface or the second adhesive surface.

Abstract: A disclosed cable includes a roll of flexible substrate. The substrate has opposing first and second surfaces and the roll is structured around an axis. A plurality of electrically conductive wires are attached to the first surface of the substrate, and the roll of flexible substrate and attached plurality of wires have alternating layers of wires and substrate.

Abstract: A disclosed circuit arrangement includes a support structure having first and second posts. Electrically conductive round wire has a round cross-section, and a first portion is wrapped at least partially around the first post. A second portion of the wire extends in a straight line from a point on a perimeter of the first post to a point on a perimeter of the second post, and a third portion of the wire is wrapped at least partially around the second post. The second portion of the round wire defines one or more bond sites. An electronic device is electrically connected to the round wire at one of the one or more bond sites.

Abstract: A disclosed lighting apparatus includes a light-diffusive plate having opposing first and second faces bounded by one or more sides. A first electrically conductive sheet is disposed on the first face of the light-diffusive plate, and an electrically insulative sheet is disposed on the first electrically conductive sheet. A second electrically conductive sheet is disposed on the electrically insulative sheet. A plurality of solid-state lighting (SSL) elements have light emitting portions that face a portion of the light-diffusive plate. The SSL elements are electrically coupled to the first electrically conductive sheet and to the second electrically conductive sheet.

Abstract: A disclosed RF tag includes a substrate and an integrated circuit (IC) package disposed on the substrate. The IC package has an integrated antenna element coupled to circuitry of the IC package. The RF tag also includes an external antenna element of round wire having at least one half turn disposed against two or more surfaces of the IC package. The external antenna element is inductively coupled to the integrated antenna element, and the IC package laterally supports the at least one half turn of the external antenna element.

Abstract: A disclosed circuit arrangement includes a flexible substrate. A layer of pressure sensitive adhesive (PSA) is directly adhered to a first major surface of the substrate. One or more metal foil pads and electrically conductive wire are attached directly on a surface of the PSA layer. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly on the surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.