Abstract: A lid for a blister package has a continuous pattern of wire on an adhesive surface of a substrate. The continuous pattern has multiple detector segments, and the detector segments have respective destructible portions of wire at locations on the substrate corresponding to cavities of a blister sheet. Each detector segment has an outer connector portion and an inner connector portion. The outer connector portion and the inner connector portion of each detector segment are adjacent, and pairs of successive detector segments are connected by the inner connector portion of the one detector segment and the outer connector portion of the next detector segment. The continuous pattern of wire is severed at the outer connector portions and inner connector portions of the plurality of detector segments in order to disconnects the detector segments one from another, and form terminal ends of the detector segments.

Abstract: A lighting apparatus includes a light-diffusive panel that has opposing first and second faces bounded by one or more sides. A first conductor is disposed on the first face of the light-diffusive panel and proximate a first side of the one or more sides. A second conductor is disposed on the second face of the light-diffusive panel and proximate the first side. A first plurality of solid-state lighting (SSL) elements have light emitting portions that face a second side that is adjacent to the first side of the light-diffusive panel. The first plurality of SSL elements are electrically coupled to the first conductor and to the second conductor.

Abstract: A disclosed circuit arrangement includes adhesive transfer tape, and an electronic device attached to adhesive of the adhesive transfer tape. First and second cross wires are attached to the adhesive and are disposed proximate the electronic device. One or more wire segments are attached to the adhesive and have first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire, respectively. The first and second cross wires and the one or more wire segments have round cross sections, the first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. First and second bond wires are connected to the electronic device and to the first and second portions of the one or more wire segments, respectively.

Abstract: A disclosed circuit arrangement includes an adhesive layer on a water soluble backing, antenna wire adhered to the adhesive layer, an RF transponder disposed on the adhesive layer, and first and second cross wires attached to the adhesive layer and disposed proximate the RF transponder. The antenna wire has first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire. The first and second cross wires and the antenna wire have round cross sections. The first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. A first bond wire is connected to the RF transponder and to the first portion of the antenna wire, and a second bond wire is connected to the RF transponder and to the second portion of the antenna wire.

Abstract: The disclosed transponder arrangement includes adhesive transfer tape and an RF transponder. The adhesive transfer tape includes an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. An antenna is adhered directly to the adhesive layer, and an RF transponder is disposed on the adhesive layer and coupled to the antenna. A layer of ink is disposed directly on one of the first adhesive surface or the second adhesive surface.

Abstract: A disclosed cable includes a roll of flexible substrate. The substrate has opposing first and second surfaces and the roll is structured around an axis. A plurality of electrically conductive wires are attached to the first surface of the substrate, and the roll of flexible substrate and attached plurality of wires have alternating layers of wires and substrate.

Abstract: A disclosed circuit arrangement includes a support structure having first and second posts. Electrically conductive round wire has a round cross-section, and a first portion is wrapped at least partially around the first post. A second portion of the wire extends in a straight line from a point on a perimeter of the first post to a point on a perimeter of the second post, and a third portion of the wire is wrapped at least partially around the second post. The second portion of the round wire defines one or more bond sites. An electronic device is electrically connected to the round wire at one of the one or more bond sites.

Abstract: A disclosed RF tag includes a substrate and an integrated circuit (IC) package disposed on the substrate. The IC package has an integrated antenna element coupled to circuitry of the IC package. The RF tag also includes an external antenna element of round wire having at least one half turn disposed against two or more surfaces of the IC package. The external antenna element is inductively coupled to the integrated antenna element, and the IC package laterally supports the at least one half turn of the external antenna element.

Abstract: The disclosure describes a lighting apparatus that includes a light-diffusive panel having opposing first and second faces and two or more side portions. A side portion has a curved surface and a third surface. Solid-state lighting (SSL) elements are disposed proximate the third surface of the side portion and are arranged to emit light at the third surface. A first reflector is disposed on the curved surface of the side portion and has a reflective surface to reflect light from the SSL elements into the light-diffusive panel. A plurality of disruptions are formed on the second face of the light-diffusive panel and are arranged to disperse internally reflected light. A second reflector is disposed on the second face of the light-diffusive panel and is arranged to reflect light emitted from the second surface into the light-diffusive panel.

Abstract: A disclosed lighting apparatus includes a light-diffusive plate having opposing first and second faces bounded by one or more sides. A first electrically conductive sheet is disposed on the first face of the light-diffusive plate, and an electrically insulative sheet is disposed on the first electrically conductive sheet. A second electrically conductive sheet is disposed on the electrically insulative sheet. A plurality of solid-state lighting (SSL) elements have light emitting portions that face a portion of the light-diffusive plate. The SSL elements are electrically coupled to the first electrically conductive sheet and to the second electrically conductive sheet.

Abstract: A disclosed lighting apparatus includes a first dielectric sheet disposed on the first electrically conductive sheet and a second electrically conductive sheet disposed on the first dielectric sheet. A plurality of solid-state lighting (SSL) elements are electrically coupled to the first electrically conductive sheet and to the second electrically conductive sheet. The first electrically conductive sheet, first dielectric sheet, and second electrically conductive sheet have bends that configure the first electrically conductive sheet, first dielectric sheet, and second electrically conductive sheet in a three-dimensional shape.

Abstract: The disclosed transponder arrangement includes adhesive transfer tape and an RF transponder. The adhesive transfer tape includes an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. An antenna is adhered directly to the adhesive layer, and an RF transponder is disposed on the adhesive layer and coupled to the antenna.

Abstract: A disclosed circuit arrangement includes a flexible substrate. A layer of pressure sensitive adhesive (PSA) is directly adhered to a first major surface of the substrate. One or more metal foil pads and electrically conductive wire are attached directly on a surface of the PSA layer. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly on the surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.

Abstract: A transponder arrangement includes a substrate, an RF transponder, and first, second, and third antenna elements. The substrate has a first surface and an opposing second surface. The RF transponder is disposed on the first surface of the substrate and has a first connection pad and a second connection pad. The first antenna element is disposed on the first surface of the substrate and is connected to the first connection pad. The second antenna element is disposed on the first surface of the substrate and is connected to the second connection pad. The third antenna element is disposed on the second surface of the substrate and is inductively coupled to the first and second antenna elements.

Abstract: A disclosed lighting apparatus includes a support structure having a sheet metal member. The sheet metal member has a first surface. An adhesive layer is directly attached to the first surface of the sheet metal member. A plurality of light-emitting diode (LED) components are attached to the sheet metal member by the adhesive layer. A plurality of wires are attached to the sheet metal member by the adhesive layer and are coupled to the plurality of LED components for providing power to the LED components.

Abstract: The disclosed lighting arrangement includes adhesive transfer tape. The adhesive transfer tape has an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. Power wires are adhered directly to the adhesive layer, and solid state lighting elements are disposed on the adhesive layer and coupled to the power wires.

Abstract: A disclosed circuit arrangement includes adhesive transfer tape having a layer of pressure sensitive adhesive (PSA) having a first major surface and a second major surface opposite the first major surface. One or more metal foil pads are attached directly to the second major surface of the layer of PSA. Electrically conductive round wire is attached directly to the second major surface of the layer of PSA. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly to the second major surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.

Abstract: A disclosed transponder arrangement includes a water soluble backing having first and second major surfaces. A layer of pressure sensitive adhesive (PSA) has a third major surface and a fourth major surface. The fourth major surface is directly adhered to the first major surface of the water soluble backing. One or more metal foil pads are attached directly on the third major surface of the layer of PSA. Electrically conductive round wire is attached directly on the third major surface of the layer of PSA. The wire has a round cross-section and one or more portions directly connected to the metal foil pad(s) with weld joint(s). An RF transponder is attached directly on the third major surface of the first layer of PSA and is electrically connected to the one or more portions of the round wire by bond wire(s).

Abstract: A disclosed circuit arrangement includes a substrate having first bond pads coupled to a pattern of conductors. The first bond pads and the pattern of conductors are disposed on a first surface of the substrate. A first layer of adhesive is directly disposed on the first surface of the substrate and the pattern of conductors and has openings at the first bond pads. An electronic device has opposing first and second surfaces and is attached to the first surface of the substrate by the first surface of the electronic device in contact with the first layer of adhesive. The second surface of the electronic device has second bond pads. Bond wires are connected at the first bond pads through the openings in the first layer of adhesive and connected at the second bond pads.

Abstract: A method of attaching wire to an exposed surface of an adhesive layer includes guiding wire from a wire source through a payout head and through a foot of a write head. A first portion of the wire extends from the foot toward the adhesive layer. The write head is positioned such that a gap between the foot and the exposed surface of the adhesive layer is greater than a diameter of the wire. The write head is moved in a motion parallel to the adhesive layer, and the first portion of the wire adheres to the adhesive layer. Wire is pulled from the wire source by the payout head as the write head is moving in order to maintain slack in a second portion of the wire between the payout head and the write head as the wire is attached to the exposed surface of the adhesive layer.