Patents Assigned to Automated Assembly Corporation
  • Patent number: 9652705
    Abstract: RFID tag structures are disclosed. In one embodiment, the RFID tag includes a flexible substrate, a strap attached to the substrate, an RFID IC mounted on the strap, and an antenna. The strap has a first surface, a second surface, and first and second terminals exposed on the first surface. The second surface of the strap is attached to the substrate. The RFID IC is electrically coupled to the first and second terminals. The antenna is attached to the first surface of the flexible substrate and connected to the first and second terminals on the first surface of the strap.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: May 16, 2017
    Assignee: Automated Assembly Corporation
    Inventors: Scott Lindblad, David Neuman
  • Patent number: 9606285
    Abstract: A disclosed lighting apparatus includes a light-diffusive plate having opposing first and second faces bounded by one or more sides. A first electrically conductive sheet is disposed on the first face of the light-diffusive plate, and an electrically insulative sheet is disposed on the first electrically conductive sheet. A second electrically conductive sheet is disposed on the electrically insulative sheet. A plurality of light-emitting diodes (LEDs) have light emitting portions that face a portion of the light-diffusive plate. The LEDs are electrically coupled to the first electrically conductive sheet and to the second electrically conductive sheet.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: March 28, 2017
    Assignee: Automated Assembly Corporation
    Inventors: Scott Lindblad, David Neuman, Matthew Odden
  • Patent number: 9595501
    Abstract: A disclosed circuit arrangement includes a flexible substrate. A layer of pressure sensitive adhesive (PSA) is directly adhered to a first major surface of the substrate. One or more metal foil pads and electrically conductive wire are attached directly on a surface of the PSA layer. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly on the surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: March 14, 2017
    Assignee: Automated Assembly Corporation
    Inventor: Robert Neuman
  • Patent number: 9565752
    Abstract: A disclosed circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, first and second cross wires attached to the substrate and disposed proximate the electronic device, and one or more wire segments attached to the substrate. The one or more wire segments have first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire, respectively. The first and second cross wires and the one or more wire segments are round wires having round cross sections. The first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. A first bond wire is connected to the electronic device and to the first portion of the one or more wire segments, and a second bond wire is connected to the electronic device and to the second portion of the one or more wire segments.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: February 7, 2017
    Assignee: Automated Assembly Corporation
    Inventors: Robert Neuman, Scott Lindblad
  • Patent number: 9431363
    Abstract: A circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, and one or more round wire segments attached to the substrate. The one or more round wire segments have first and second portions for connecting to the IC component, and each first and second portion has a planar landing area extending longitudinally along the wire. The circuit arrangement further includes bond wires connecting the landing areas to the IC component.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: August 30, 2016
    Assignee: Automated Assembly Corporation
    Inventors: Scott Lindblad, David Neuman, Robert Neuman
  • Patent number: 9379289
    Abstract: The disclosed lighting arrangement includes adhesive transfer tape. The adhesive transfer tape has an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. Power wires are adhered directly to the adhesive layer, and one or more light-emitting diodes (LEDs) are disposed on the adhesive layer and coupled to the power wires.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: June 28, 2016
    Assignee: Automated Assembly Corporation
    Inventors: Scott Lindblad, David Neuman, Robert Neuman
  • Patent number: 9151454
    Abstract: A lighting module is disclosed and includes a light emitting diode (LED) panel having a plurality of LEDs and two or more conductive contacts. A boxlike member has a base and sidewalls. The sidewalls have passages that provide ingress to and egress from the boxlike member for power wires. One or more mounting members are attached to the boxlike member for removably attaching the LED panel. A circuit board is disposed in the boxlike member, and the circuit board includes two or more insertion force connectors for connecting to power wires. The circuit board further includes two or more board connectors that engage the conductive contacts of the LED panel and electrically couple the conductive contacts of the LED panel to the insertion force connectors.
    Type: Grant
    Filed: September 9, 2013
    Date of Patent: October 6, 2015
    Assignee: Automated Assembly Corporation
    Inventors: Scott Lindblad, David Neuman, Robert Neuman
  • Patent number: 9128222
    Abstract: A lighting apparatus includes a light-diffusive plate having opposing faces bounded by one or more sides. The plate has disruptions on a first face of the opposing faces and a first channel along at least a portion of a first side of the one or more sides. A first cover has first and second surfaces disposed over the first channel with the first surface facing the first side of the light-diffusive plate. A plurality of light-emitting diodes (LEDs) is disposed on the first surface of the first cover and within the first channel. The LEDs electrically coupled with wiring are integrated with the first cover.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: September 8, 2015
    Assignee: Automated Assembly Corporation
    Inventors: Scott Linblad, Matthew Odden
  • Patent number: 8940218
    Abstract: Approaches for making a light-transmitting panel are disclosed. A panel is positioned on a support structure, and a stencil is positioned between a surface of the panel and a laser head. The stencil includes a plurality of openings. A defocused laser beam generated by the laser head is scanned over the openings in the stencil. The width of the defocused laser beam at a location at which the laser beam strikes the panel is at least as large as a size of the desired disruption, and the laser head is powered at a level and moved at a rate that creates a disruption in the surface of the panel at each opening.
    Type: Grant
    Filed: August 20, 2012
    Date of Patent: January 27, 2015
    Assignee: Automated Assembly Corporation
    Inventors: Scott Lindblad, David Neuman
  • Patent number: 8893976
    Abstract: A tamper-resistant electronic system includes a destructible vinyl (DV) substrate having conductive wiring disposed on a first surface of the DV substrate. An RFID device has pins mechanically and electrically connected to the wiring on the first surface of the DV substrate. A plate has a first surface, and a portion of the first surface of the plate is adhered to a portion of the first surface of the DV substrate. The plate has a cavity that encompasses the RFID device. A backing is adhered to a second surface of the plate opposite the first surface of the plate.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: November 25, 2014
    Assignee: Automated Assembly Corporation
    Inventors: Scott Lindblad, David Neuman, Robert Neuman
  • Patent number: 8890692
    Abstract: Approaches for aiding in recovery of lost articles are disclosed. A computing arrangement is configured with a database that contains article identifiers of a plurality of articles and associated data that identify owners of the articles. A handheld computing device reads an article identifier from an identification tag attached to an article and transmits the article identifier to the computing arrangement. The computing arrangement reads the data associated with the identifier that identifies the owner of the article in response to the identifier received from the handheld computing device and outputs the data that identifies the owner of the device.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: November 18, 2014
    Assignee: Automated Assembly Corporation
    Inventors: Scott Lindblad, David Neuman
  • Patent number: 8779694
    Abstract: An LED lighting arrangement on a flexible substrate. The flexible substrate has an adhesive on a first surface. Straps are attached to the first surface of the flexible substrate by the adhesive. Each strap has a first surface, a second surface, and first and second terminals exposed on the first surface. The attachment of each strap to the substrate is with the second surface of the strap adhered to the substrate. LEDs are attached to the straps and coupled to the terminals on the straps. An arrangement of one or more wires is attached to the first surface of the flexible substrate by the adhesive. The wires are connected to the first and second terminals on the first surfaces of the plurality of straps to provide power to the LEDs.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: July 15, 2014
    Assignee: Automated Assembly Corporation
    Inventors: Scott Lindblad, David Neuman
  • Patent number: 6900608
    Abstract: An apparatus optimizes arm velocity when the arm is carrying a given payload. More specifically, the apparatus controls the performance of a motor so that the motor can move the arm at an arm maximum velocity when the arm is carrying the given payload. To that end, the apparatus includes an information input to receive motor performance information, and a controller operatively coupled with the information input. The controller is capable of determining the arm maximum velocity from the motor performance information. The controller also is capable of causing the motor to move the arm at the arm maximum velocity.
    Type: Grant
    Filed: April 17, 2003
    Date of Patent: May 31, 2005
    Assignee: Automated Assemblies Corporation
    Inventors: Norton Kaplan, David Lee