Abstract: Apparatus and methods for filament crimping. The apparatus includes a filament crimp element. The filament crimp element includes a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Interlock features configured for cold welding are also included. Methods for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: Apparatus and methods for selectively providing or preventing access to areas, enclosed spaces or volumes, or for controlling the position of a pivot or hinge assembly. In one exemplary embodiment, the apparatus includes a selectively actuated or actuate-able hinge which is controlled at least in part by a shaped memory alloy (SMA) filament or filaments. Application of electrical current to the filament causes changes in the physical properties thereof, thereby allowing “ratcheted” rotation of a portion of the hinge relative to other portions. In one variant, the hinge can be remotely operated, such as via wireless or wireline communication with a remote entity such as a computer or smartphone.

Abstract: Improved actuator apparatus and methodologies for manufacturing and using the same. In one exemplary embodiment, the actuator apparatus includes an SMA filament that: (1) minimizes size and increases stroke length via a serpentine-like routing of the SMA filament within the device itself; (2) reduces power consumption as a result of a relatively flat stroke force as a function of stroke displacement operating profile; (3) enables the actuator assembly to remain in a fully actuated state, at a consistent stroke force, for longer periods of time; and (4) is also fully reversible so as to be capable of use in both push-based and pull-based actuator applications. Methods of operation and manufacturing associated with the aforementioned actuator apparatus are also disclosed.

Abstract: Improved actuator apparatus and methodologies for manufacturing and using the same. In one exemplary embodiment, the actuator apparatus includes an SMA filament that: (1) minimizes size and increases stroke length via a serpentine-like routing of the SMA filament within the device itself; (2) reduces power consumption as a result of a relatively flat stroke force as a function of stroke displacement operating profile; (3) enables the actuator assembly to remain in a fully actuated state, at a consistent stroke force, for longer periods of time; and (4) is also fully reversible so as to be capable of use in both push-based and pull-based actuator applications. Methods of operation and manufacturing associated with the aforementioned actuator apparatus are also disclosed.

Abstract: Power-efficient actuator apparatus and methods. In one exemplary embodiment, the actuator assembly utilizes a shape memory alloy (SMA) filament driven by an electronic power source to induce movement in the underlying assembly to actuate a load (e.g., water valve). In addition, a circuit board is included which allows the actuator assembly to be readily incorporated or retrofit into a wide range of systems such that the signal characteristics of the supply line can, among other applications, be conditioned in order to protect the SMA filament. Furthermore, the circuit board can also readily be adapted for use with “green” power sources such as photovoltaic systems and the like. Methods for manufacturing and utilizing the aforementioned actuator assembly are also disclosed.

Abstract: Low-cost connector apparatus for passing electrical signals from one device over another via a cable. In one embodiment, the connector apparatus comprises a coaxial type connector that mates with a host device, such as via the motherboard thereof. In one variant, the connector further comprises a plurality of electrical components including an integrated circuit adapted to condition (e.g., equalize) the signals being transmitted over the cable. The connector (and hence internal electrical components) is shielded so as to mitigate the effects of EMI or RFI on the host device circuitry itself. In another variant, the signals comprise IEEE-Std. 1394 “FireWire” high speed data signals, and the use of the shielded connector in the signal pathway allows the use of lower cost cabling than would otherwise be required with a non-shielded (non-integrated) connector.

Abstract: Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: Actuator apparatus having a multi-stable element actuated by memory alloy actuating elements. In one embodiment, the multi-stable actuator comprises a bistable (two-state) diaphragm element adapted to alternate between two stable configurations via forces exerted on the diaphragm by more than one memory alloy filaments in response to thermal activation. The bistable diaphragm element is coupled to a magnetic actuator element resident on a dry portion of a valve fitting, while a plunger actuated by the magnetic actuator element is resident on a wet portion of a valve fitting. Methods for making and using the bistable actuator apparatus are also disclosed.

Abstract: Actuator apparatus having a multi-stable element actuated by memory alloy actuating elements. In one embodiment, the multi-stable actuator comprises a bistable (two-state) diaphragm element adapted to alternate between two stable configurations via forces exerted on the diaphragm by more than one memory alloy filaments in response to thermal activation. In another embodiment, the bistable diaphragm of the multi-stable actuator transitions from a first to a second stable configuration via forces exerted by a single filament in response to direct or indirect thermal activation. A portion of the assembly is displaced when the assembly is in the second configuration. The bistable diaphragm transitions back to the first stable configuration via application of mechanical force on a portion of the assembly which was displaced. Methods for making and using the bistable actuator apparatus are also disclosed.

Abstract: Improved actuator apparatus and methodologies for manufacturing and using the same. In one exemplary embodiment, the actuator apparatus includes an SMA filament that: (1) minimizes size and increases stroke length via a serpentine-like routing of the SMA filament within the device itself; (2) reduces power consumption as a result of a relatively flat stroke force as a function of stroke displacement operating profile; (3) enables the actuator assembly to remain in a fully actuated state, at a consistent stroke force, for longer periods of time; and (4) is also fully reversible so as to be capable of use in both push-based and pull-based actuator applications. Methods of operation and manufacturing associated with the aforementioned actuator apparatus are also disclosed.

Abstract: Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: A shielding apparatus useful in the attenuation of electronic noise or spurious electric signals is disclosed. In one embodiment, the shielding apparatus is encapsulated with an electronic component such as an integrated circuit. At least parts of the apparatus are formed using a selective metal deposition process (e.g., electroforming) that increases manufacturing efficiency and provides enhanced mechanical and structural features, as well as reduced cost. In another embodiment, the shielding apparatus comprises an array. Methods of manufacturing and utilizing the shielding apparatus are also disclosed.

Abstract: Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Abstract: Upper and lower planar circuit boards are connected in spaced apart parallel relationship by a plurality of contacts each made of a conductive pin, insulative collar and solder ball. The upper ends of the pins are inserted in plated though holes in the upper circuit board and soldered thereto by wave soldering or re-flow. The pins have shoulders to establish the penetration of the pins into the upper circuit board. The lower ends of the pins are bonded to conductive pads on the lower circuit board via the solder balls that are maintained in substantially spherical configuration by the insulative collars and accommodate variations in board co-planarity or pin length. Where the lower ends of the pins do not contact their corresponding conductive pads the volume of solder in the solder balls allows reliable fillet solder joints to be formed.

Abstract: A surface mount connector for circuit board attachment is provided in the form of an elongate pin with a head or base formed at the lower end of the pin. The base has a bottom surface that extends substantially normal to the axis of the pin and is dimensioned to be positioned on, and soldered to, a pad on a primary circuit board. A solder bond is achieved by re-flowing a quantity of solder applied to the pad along with a quantity of flux before placing the base on top of the quantity of solder. The base is formed with a plurality of channels that open through the bottom surface and through a peripheral wall of the base for permitting gases generated by vaporizing the flux during solder re-flow to escape from underneath the base and to increase the strength of the solder bond between the pad and the base. Exhaustion of the gases prevents undesirable skating of the connector and misalignment and eliminates voids in the solder bond that would otherwise weaken the bond.

Abstract: Several pin transfer assemblies are disclosed that utilize the surface tension of liquids for picking up and dispensing minute volumes of liquid from wells in a first well plate to a flat substrate surface or into wells in a second well plate. In one embodiment, a plurality of pins reciprocate through complementary arrays of holes in a base plate and an overlying spring plate biased apart by coil springs located around the periphery of the base plate. A foam layer sits on top of the spring plate and a weight plate sits on top of the foam layer. A single coil spring is positioned between a center of the weight plate and the cover to push the weight plate downwardly. The periphery of the cover guides the vertical movement of the weight plate and is connected to the periphery of the base plate. The periphery of the base plate is supported by a frame used to register the pin assembly in a receptacle of a manual or automated liquid transfer apparatus.

Abstract: A pin replicator is disclosed for dispensing minute volumes of liquid onto a substrate surface in an array in connection with drug discovery, diagnostic analysis, and other applications. The pin replicator comprises a base plate, a plurality of pins reciprocable through corresponding holes in the base plate, and a free floating weight plate resting on top of the upper ends of the pins. The weight plate biases the pins toward their fully extended lowered positions. A cover attaches to the base plate, encloses the pins and weight plate and guides the weight plate during vertical movement thereof. The pin replicator can be moved downwardly toward a first micro titer plate so that a lower end of each of the pins contacts the sample liquid in the corresponding well a sufficient amount to pick up and retain a small quantity of the sample liquid due to surface tension.

Abstract: Upper and lower planar circuit boards are connected in spaced apart parallel relationship by a plurality of contacts each made of a conductive pin, insulative collar and solder ball. The upper ends of the pins are inserted in plated though holes in the upper circuit board and soldered thereto by wave soldering or re-flow. The pins have shoulders to establish the penetration of the pins into the upper circuit board. The lower ends of the pins are bonded to conductive pads on the lower circuit board via the solder balls that are maintained in substantially spherical configuration by the insulative collars and accommodate variations in board co-planarity or pin length. Where the lower ends of the pins do not contact their corresponding conductive pads the volume of solder in the solder balls allows reliable fillet solder joints to be formed.

Abstract: A circuit board interconnect system includes a carrier board with a hybrid solder ball and pin grid array. A plurality of electrically conductive pins extend through the carrier board and are arranged in rows and columns to form a grid array. A first circuit board such as a multi-chip module (MCM) board has a plurality of conductive pads or traces formed on a lower surface thereof that are arranged to form a complementary grid array, i.e. the spacing and location of the conductive pads or traces corresponds to the spacing and location of the pins. A plurality of solder balls are provided with each ball being positioned on top of a corresponding pin so that each solder ball forms a solder connection between a pin and a corresponding conductive pad or trace. A second circuit board such as a computer mother board has a pin connector mounted on an upper surface thereof for individually receiving and providing electrical connection with each of the pins.