Abstract: A plurality of discrete SMT pins are carried in bandoleer fashion. Each SMT pin has a base formed on its underside with solder flux vapor venting channels and a shaft with a longitudinal axis connected to the base. A consecutive series of identical pin holding segments are arranged in side-by-side or end-to-end fashion to provide a flexible strip windable about a reel. The strip is continuously injection molded of plastic as a plurality of strings each made up of a predetermined number of part holding segments with a forward portion of each string, except for leading string of the strip, being molded over a trailing portion of a preceding string. Each pin holding segment has a receptacle formed by a pair of opposing resilient fingers for frictionally removably holding a shaft of a corresponding SMT pin so that the pin can be inserted and removed in a direction substantially normal to the longitudinal axis of its shaft.

Abstract: A unitary metal clip is stamped from a flat strip of sheet metal which is bent to provide two pairs of generally V-shaped fingers which extend upwardly from a base and have opposing apexes. An L-shaped arm also extends upwardly from the base between the pairs of fingers and has a horizontal pick-up tab that is located at a height above the opposing apexes of the fingers. A pneumatic head of an automatic pick and place machine grabs the pick-up tab and removes the clip from a pocket of a supply tape unrolled from a reel. The base of the clip is positioned on a solder pad of a PC board before solder re-flow. The lower edge of the sidewall of an EMI shield may be pressed down to bend the pick-up tab downwardly and squeeze the sidewall between the apexes of the fingers.

Abstract: A continuous molded electronic component assembly process in which a continuous line of components are supplied on reels for assembly and insertion. The supply reels of electronic components are made by an injection molding process, reeled and supplied to assembly and insertion machines. The assembly and insertion machines provide the means for removing, assembling and inserting the electronic components. Examples of the process, but not limited to, are shunts, wire end terminals and pilot posts.

Abstract: A continuous molded electronic component assembly process in which a continuous line of components are supplied on reels for assembly and insertion. The supply reels of electronic components are made by an injection molding process, reeled and supplied to assembly and insertion machines. The assembly and insertion machines provide the means for removing, assembling and inserting the electronic components. Examples of the process, but not limited to, are shunts, wire end terminals and pilot posts.

Abstract: A method and apparatus for surface mounting terminals on a substrate, in particular, pin terminals on a printed circuit board, having solder applied therein. In the first step of the method, a plurality of terminals are inserted in a holding fixture and held in alignment with each other. The holding fixture is then rotated to bring the terminals into contact with the solder on the substrate. In the next step of the method, the area of contact is heated, for example, by infra-red radiation, until reflow of the solder occurs. After heating, the heated solder is allowed to cool, i.e. solidify, thereby forming a secure connection between the terminals and the surface of the substrate.

Abstract: An endless electrical connector has a continuous header manufactured by forming axial segments in sequence. In the case of continuous extrusion, the axial segments are infinitesimal in length, whereas in the case of semicontinuous injection molding, the segments have discrete length.

Abstract: A method for bending and inserting a pin in one sequential operation includes the steps of feeding an end of a pre-notched pin wire, shearing a connector terminal from the end of the wire, clamping one part of the terminal between jaws, displacing the jaws toward a hole in a printed circuit board, displacing a bending sheet at a rate faster than the rate at which the jaws are displaced whereby the bending shoe bends the connector terminal pin while the jaws are moving, and inserting the bent terminal in the hole in the printed circuit board. The apparatus for carrying out the method includes a bending shoe ram and an insertion ram driven at different speeds and with different stroke lengths by an eccentric pin mounted on the end of a drive shaft.