Abstract: In a representative embodiment, a multiple mode power amplifier that is operable in a first power mode and a second power mode. The multiple mode power amplifier comprises a first amplifying unit; a second amplifying unit; a first impedance matching network connected to an output port of the first amplifying unit; a second impedance matching network connected to an output port of the second amplifying unit and to the first impedance matching network; and a third impedance matching network connected to the output ports of the first and the second amplifying units. The third impedance matching network reduces a phase difference between signals amplified by the first and the second amplifying units in the first mode.

Abstract: An apparatus for controlling a power amplifier configured to amplify radio frequency (RF) signal includes a detector and a controller. The detector is configured to detect a power level of the RF signal with respect to a predetermined power threshold and to generate a corresponding detection signal. The controller is configured to provide a control voltage to an output transistor of the amplifier based on the detection signal. The control voltage has a low voltage value, which is substantially the same as a value of a supply voltage, when the detection signal indicates that the power level is below the power threshold, and the control voltage has a high voltage value when the detection signal indicates that the power level is above the power threshold. The controller generates the high voltage value by boosting the supply voltage.

Abstract: A transducer apparatus comprises a package substrate and a transducer disposed over a die substrate. The die substrate is disposed over the package substrate. The transducer apparatus also comprises a voltage source connected between the die substrate and the package substrate, and configured to selectively apply an electrostatic attractive force between the die substrate and the package substrate.

Abstract: A method of forming an acoustic resonator includes forming a seed layer on a first electrode layer, forming a piezoelectric layer directly on a surface of the seed layer, and forming a second electrode layer on the piezoelectric layer. The piezoelectric layer includes multiple crystals of piezoelectric material, and the seed layer causes crystal axis orientations of the crystals to be substantially perpendicular to the surface of the seed layer.

Abstract: A semiconductor package comprises: a substrate comprising a semiconductor device; a cap comprising a seal ring disposed over a surface of the cap; and a gap between the substrate and the surface of the cap. The seal ring comprises a tread comprising at least two columns.

Abstract: A device includes: a base substrate having a bonding pad and a peripheral pad, the peripheral pad encompassing the bonding pad; an acoustic resonator on the base substrate; a cap substrate having a bonding pad seal and a peripheral pad seal, the bonding pad seal bonding around the perimeter of the bonding pad and the peripheral pad seal bonding with the peripheral pad to define a hermetically sealed volume between the cap substrate and the base substrate, the cap substrate having a through hole therein over the bonding pad providing access for a connection to the bonding pad; a low-resistivity material layer region disposed on a portion of a surface of the cap substrate disposed inside the hermetically sealed volume, the material layer region being isolated from the bonding pad seal; and electronic circuitry disposed in the material layer region and electrical connected with the acoustic resonator.

Abstract: A single integrated wafer package includes a micro electromechanical system (MEMS) wafer, an active device wafer, and a seal ring. The MEMS wafer has a first surface and includes at least one MEMS component on its first surface. The active device wafer has a first surface and includes an active device circuit on its first surface. The seal ring is adjacent the first surface of the MEMS wafer such that a seal is formed about the MEMS component. An external contact is provided on the wafer package. The external contact is accessible externally to the wafer package and is electrically coupled to the active device circuit of the active device wafer.

Abstract: A navigation device for navigating a user interface of a processor-controlled device includes an acoustic transmitter adapted to transmit an acoustic signal, an acoustic receiver adapted to receive the acoustic signal and located at a fixed position with respect to the acoustic transmitter, and a measurement circuit coupled to an output of the acoustic receiver and adapted to determine a distance traversed by the navigation device as a function of time.

Abstract: An improved semiconductor seal ring and method therefore is described. The seal ring comprises a thick layer wherein at least a portion of the thick layer is removed from a singulation street prior to singulation, thereby avoiding damage to the thick layer during the singulation process. A thin moisture-proof barrier layer is preferably deposited over at least a portion of the thick layer to seal at least an edge of the thick layer. A thick nonmetallic layer preferably used for fabrication of active circuit elements may advantageously be employed as the thick layer (for example, an aluminum nitride (AlN) layer in, for example, a bulk acoustic wave (BAW) filter device). A thin amorphous nonmetallic layer (e.g., a silicon nitride (SiN) layer) may preferably be deposited over the thick layer. Alternatively, other materials may be used.

Abstract: A method of fabricating an apparatus including a sealed cavity and an apparatus embodying the method are disclosed. To fabricate the apparatus, a device chip including a substrate and at least one circuit element on the substrate is fabricated. Also, a cap is fabricated. Next, the device chip and the cap are bonded such that a sealed cavity is formed by the device chip and the cap. The bond is accomplished using thermo compression technique. Gold or other suitable metal can be used as a bonding agent. Then or at the same time, caulking agent is reflowed over the bonding agent, over portions of the cap, or both to further seal the cavity. In the resultant device, the sealed cavity is sealed by the bonding agent, the caulking agent, or both. The caulking agent increases hermeticity of the cavity and provides for even higher level of protection of the cavity against adverse environmental conditions.

Abstract: A feed-forward device is provided for a mixer including a diplexer having a radio frequency port, an intermediate frequency port, and a common port; and a mixing circuit receiving an in-phase local oscillator signal and an out-of-phase local oscillator signal and having an output coupled to the common port of the diplexer. The feed-forward device includes: a first signal sampler having an input adapted to sample the in-phase local oscillator signal and to output a sampled in-phase local oscillator signal; a second signal sampler having an input adapted to sample the out-of-phase local oscillator signal and to output a sampled out-of-phase local oscillator signal; and an arrangement for coupling the sampled in-phase local oscillator signal and the sampled out-of-phase local oscillator signal to the common port of the diplexer.

Abstract: A substrate comprising a plurality of layers, a first side and a second side; and a via extending through the substrate from the first side to the second side. The via comprises: a first substrate via extending through a first layer of the plurality of layers, the first substrate via having a first cross-sectional area; a first capture pad disposed under the first substrate via, wherein the first capture pad physically contacts the first substrate via; a second substrate via extending through a second layer of the plurality of layers, the second substrate via physically contacting the first capture pad, the second substrate via having a second cross-sectional area that is greater than the first cross-sectional area; and a second thermal and electrical contact pad disposed under the second dielectric layer, wherein the second contact pad physically contacts the second substrate via.

Abstract: A packaged device includes a package defining a well having a well top, a die positioned in the well of the package, and a retaining substrate attached to the package over the well top. The retaining substrate holds the die in direct contact with a portion of the package exposed at a well bottom opposite the well top.

Abstract: A micro-electromechanical systems (MEMS) transducer device comprises: a package substrate having a first coefficient of thermal expansion (CTE); and a transducer substrate comprising a transducer. The transducer substrate is disposed over the package substrate. The transducer substrate has a second CTE that substantially matches the first CTE.

Abstract: A semiconductor structure includes multiple semiconductor devices on a substrate and a metal layer disposed over the semiconductor devices, the metal layer comprising at least a first trace and a second trace. A conductive pillar is disposed directly on and in electrical contact with the first trace of the metal layer, and a dielectric layer is selectively disposed between the metal layer and the conductive pillar, where the dielectric layer electrically isolates the second trace from the pillar. A moisture barrier surrounds the semiconductor devices around a periphery of the semiconductor structure, and extends from the substrate through the dielectric layer to the conductive pillar.

Abstract: A semiconductor structure comprises a substrate and a metal layer disposed over the substrate. The metal layer comprises a first electrical trace and a second electrical trace. The semiconductor structure comprises a conductive pillar disposed directly on and in electrical contact with the first electrical trace; and a dielectric layer selectively disposed between the metal layer and the conductive pillar. The dielectric layer electrically isolates the second electrical trace from the pillar.

Abstract: A method of packaging electronics comprises providing a first wafer and providing a second wafer. The method also comprises depositing a polymer material over a surface of the first wafer; and selectively removing a portion of the polymer from the first wafer to create a void in the polymer. The method also comprises placing the first wafer over the second wafer and in contact with the polymer; and curing the polymer to bond the first wafer to the second wafer. A bonded wafer structure is also described.

Abstract: A device includes: a power amplifier, including a supply voltage terminal, an input port and an output port, and the power amplifier being configured to receive a supply voltage at the supply voltage terminal, an input signal through the input port, to amplify the received input signal, and to output an amplified output signal through the output port; a variable impedance matching circuit having an input terminal connected to the output port of the power amplifier, and having an output terminal for being connected to a load; and a controller including a voltage measuring unit configured to measure the supply voltage, to compare the measured supply voltage with a threshold voltage, and to control the variable impedance matching circuit based on a result of the comparison so as to adjust a load impedance seen by the power amplifier at its output port.

Abstract: A mirror for a piezoelectric resonator consisting of alternately arranged layers of high and low acoustic impedance is manufactured by at first producing a first layer on which a second layer is produced, so that the second layer partially covers the first layer. Then, a planarization layer is applied on the first layer and on the second layer. Subsequently, a portion of the second layer is exposed by structuring the planarization layer, wherein the portion is associated with an active region of the piezoelectric resonator. Finally, the resulting structure is planarized by removing the portions of the planarization layer remaining outside the portion.

Abstract: A transducer array on a common substrate includes a membrane and first and second transducer devices. The membrane is formed on the common substrate, and includes a lower layer and an upper layer. The first transducer device includes a first resonator stack formed on at least the lower layer in a first portion of the membrane, the upper layer having a first thickness in the first portion of the membrane. The second transducer device includes a second resonator stack formed on at least the lower layer in a second portion of the membrane, the upper layer having a second thickness in the second portion of the membrane, where the second thickness is different from the first thickness, such that a first resonant frequency of the first transducer device is different from a second resonant frequency of the second transducer device.