Patents Assigned to AVICENATECH CORP.
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Publication number: 20240137132Abstract: Integrated circuit chips may be optically interconnected using microLEDs. Some interconnections may be vertically-launched parallel optical links. Some interconnections may be planar-launched parallel optical links.Type: ApplicationFiled: October 25, 2023Publication date: April 25, 2024Applicant: AvicenaTech Corp.Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
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Publication number: 20240085622Abstract: A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Applicant: AvicenaTech Corp.Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
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Publication number: 20240072895Abstract: An LED may have structures optimized for speed of operation of the LED. The LED may be a microLED. The LED may have a p-doped region with one or more quantum wells instead of an intrinsic region. The LED may have etched vias therethrough.Type: ApplicationFiled: September 12, 2023Publication date: February 29, 2024Applicant: AvicenaTech Corp.Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
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Patent number: 11914200Abstract: Optical interconnect topologies may be provided using microLEDs. The topologies may interconnect ICs. The optical interconnect topologies may be used in some instances in place of electrical busses.Type: GrantFiled: January 8, 2021Date of Patent: February 27, 2024Assignee: AvicenaTech Corp.Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
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Patent number: 11916598Abstract: Coupling of light from large angular distribution microLEDs into smaller angular acceptance distribution of transmission channels is performed using optical elements.Type: GrantFiled: April 13, 2021Date of Patent: February 27, 2024Assignee: AvicenaTech Corp.Inventors: Robert T. Weverka, Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
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Patent number: 11906779Abstract: A microLED may be used to generate light for intra-chip or inter-chip communications. The microLED, or an active layer of the microLED, may be embedded in a waveguide. The waveguide may include a lens.Type: GrantFiled: March 8, 2023Date of Patent: February 20, 2024Assignee: AvicenaTech Corp.Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
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Publication number: 20240053558Abstract: Optical interconnects for IC chips may include optical sources and receivers integrated with the IC chips. MicroLEDs may be mounted on an interconnect layer of the IC chip, and embedded within a waveguide. Photodetectors to receive light from the waveguide may be fabricated in a top surface of a semiconductor substrate, below a level of the interconnect layer, but with a passageway for light through the interconnect layer.Type: ApplicationFiled: October 24, 2023Publication date: February 15, 2024Applicant: AvicenaTech Corp.Inventors: Robert Kalman, Bardia Pezeshki, Cameron Danesh, Alexander Tselikov
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Publication number: 20240045155Abstract: An optical interconnect may provide for optical communications between two IC chips. The optical interconnect may include an array of optoelectronic elements, for example microLEDs and photodetectors, with the array including a plurality of sub-arrays. A fiber bundle of optical fibers may couple the optoelectronic elements, and the fiber bundle may include a plurality of sub-bundles, with for example one sub-bundle for coupling pairs of sub-arrays. Fibers of each sub-bundle may be accurately positioned with respect to one another.Type: ApplicationFiled: October 18, 2023Publication date: February 8, 2024Applicant: AvicenaTech Corp.Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov
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Publication number: 20240036246Abstract: A multi-layer planar waveguide may be used in providing an interconnect for inter-chip and/or intra-chip signal transmission. Various embodiments to transmit optical signals are disclosed, along with designs of microLED optical assemblies, photodetector optical assemblies, waveguides, and multi-layer planar waveguides.Type: ApplicationFiled: October 12, 2023Publication date: February 1, 2024Applicant: AvicenaTech Corp.Inventors: Robert Kalman, Bardia Pezeshiki, Alexander Tselikov, Cameron Danesh
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Publication number: 20240030377Abstract: A GaN based LED, with an active region of the LED containing one or more quantum wells (QWs), with the QWs separated by higher energy barriers, with the barriers doped, may be part of an optical communications system.Type: ApplicationFiled: September 29, 2023Publication date: January 25, 2024Applicant: AvicenaTech Corp.Inventors: Bardia Pezeshki, Cameron Danesh
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Publication number: 20240022330Abstract: A coherent fiber bundle may be used to optically connect an array of microLEDs to an array of photodetectors in an optical communication system.Type: ApplicationFiled: September 29, 2023Publication date: January 18, 2024Applicant: AVICENATECH CORP.Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
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Publication number: 20240012215Abstract: Light from one or more microLEDs may be coupled into multiple waveguide cores. Parabolic reflectors, truncated parabolic reflectors, and encapsulants may be used to increase fraction of emitted light coupled into the waveguide cores.Type: ApplicationFiled: September 22, 2023Publication date: January 11, 2024Applicant: AvicenaTech Corp.Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
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Publication number: 20230412282Abstract: Multi-chip modules in different semiconductor packages may be optically data coupled by way of LEDs and photodetectors linked by a multicore fiber. The multicore fiber may pass through apertures in the semiconductor packages, with an array of LEDs and photodetectors in the semiconductor package providing and receiving, respectively, optical signals comprised of data passed between the multi-chip modules.Type: ApplicationFiled: September 1, 2023Publication date: December 21, 2023Applicant: AvicenaTech Corp.Inventors: Bardia Pezeshki, Robert Kalman, Alexander Tselikov, Cameron Danesh
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Patent number: 11835758Abstract: A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.Type: GrantFiled: November 28, 2022Date of Patent: December 5, 2023Assignee: AvicenaTech Corp.Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
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Patent number: 11824590Abstract: Integrated circuit chips may be optically interconnected using microLEDs. Some interconnections may be vertically-launched parallel optical links. Some interconnections may be planar-launched parallel optical links.Type: GrantFiled: April 13, 2021Date of Patent: November 21, 2023Assignee: AvicenaTech Corp.Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
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Patent number: 11822138Abstract: Optical interconnects for IC chips may include optical sources and receivers integrated with the IC chips. MicroLEDs may be mounted on an interconnect layer of the IC chip, and embedded within a waveguide. Photodetectors to receive light from the waveguide may be fabricated in a top surface of a semiconductor substrate, below a level of the interconnect layer, but with a passageway for light through the interconnect layer.Type: GrantFiled: October 8, 2021Date of Patent: November 21, 2023Assignee: AvicenaTech Corp.Inventors: Robert Kalman, Bardia Pezeshki, Cameron Danesh, Alexander Tselikov
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Patent number: 11815712Abstract: A multi-layer planar waveguide may be used in providing an interconnect for inter-chip and/or intra-chip signal transmission. Various embodiments to transmit optical signals are disclosed, along with designs of microLED optical assemblies, photodetector optical assemblies, waveguides, and multi-layer planar waveguides.Type: GrantFiled: October 1, 2021Date of Patent: November 14, 2023Assignee: AvicenaTech Corp.Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
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Patent number: 11810995Abstract: A GaN based LED, with an active region of the LED containing one or more quantum wells (QWs), with the QWs separated by higher energy barriers, with the barriers doped, may be part of an optical communications system.Type: GrantFiled: December 3, 2021Date of Patent: November 7, 2023Assignee: AvicenaTech Corp.Inventors: Bardia Pezeshki, Cameron Danesh
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Publication number: 20230344518Abstract: Optical chip-to-chip interconnects may use microLEDs as light sources. The interconnected chips may be on a same substrate. A pair of endpoint chips may each have associated optical transceiver subsystems, with transceiver circuitry in transceiver chips. Optical communications may be provided between the optical transceiver subsystems, with the optical transceiver subsystems in communication with their associated endpoint chips by way of metal layers in the substrate.Type: ApplicationFiled: June 27, 2023Publication date: October 26, 2023Applicant: AvicenaTech Corp.Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
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Patent number: 11791901Abstract: A coherent fiber bundle may be used to optically connect an array of microLEDs to an array of photodetectors in an optical communication system.Type: GrantFiled: September 27, 2022Date of Patent: October 17, 2023Assignee: AvicenaTech Corp.Inventors: Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh