Abstract: A coherent fiber bundle may be used to optically connect an array of microLEDs to an array of photodetectors in an optical communication system.
Type:
Application
Filed:
March 21, 2024
Publication date:
September 12, 2024
Applicant:
AVICENATECH CORP.
Inventors:
Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
Abstract: Optical interconnect topologies may be provided using microLEDs. The topologies may interconnect ICs. The optical interconnect topologies may be used in some instances in place of electrical busses.
Type:
Application
Filed:
February 8, 2024
Publication date:
September 12, 2024
Applicant:
AvicenaTech Corp.
Inventors:
Bardia Pezeshki, Robert Kalman, Alex Tselikov
Abstract: In package intra-chip and/or inter-chip optical communications are provided using microLEDs and photodetectors mounted to integrated circuit (IC) chips and/or to transceiver dies associated with the IC chips. Light from the LEDs may pass through waveguides on or in a substrate to which the IC chips are mounted or which couple the IC chips.
Abstract: Integrated circuit chips may be optically interconnected using microLEDs. Some interconnections may be vertically-launched parallel optical links. Some interconnections may be planar-launched parallel optical links.
Type:
Application
Filed:
October 26, 2023
Publication date:
July 11, 2024
Applicant:
AvicenaTech Corp.
Inventors:
Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
Abstract: An LED may be optimized for high speed operation for optical communication systems in a variety of ways. The LED, which may be a microLED, may include dopants and dopant levels allowing for increased speed of operation, the LED may include interlayers, and the LED may include other features.
Type:
Grant
Filed:
August 3, 2021
Date of Patent:
July 9, 2024
Assignee:
AvicenaTech Corp.
Inventors:
Bardia Pezeshki, Robert Kalman, Alexander Tselikov, Cameron Danesh
Abstract: Integrated circuit chips may be optically interconnected using microLEDs. Some interconnections may be vertically-launched parallel optical links. Some interconnections may be planar-launched parallel optical links.
Type:
Application
Filed:
October 25, 2023
Publication date:
April 25, 2024
Applicant:
AvicenaTech Corp.
Inventors:
Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
Abstract: A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.
Type:
Application
Filed:
November 21, 2023
Publication date:
March 14, 2024
Applicant:
AvicenaTech Corp.
Inventors:
Bardia Pezeshki, Robert Kalman, Alex Tselikov
Abstract: An LED may have structures optimized for speed of operation of the LED. The LED may be a microLED. The LED may have a p-doped region with one or more quantum wells instead of an intrinsic region. The LED may have etched vias therethrough.
Type:
Application
Filed:
September 12, 2023
Publication date:
February 29, 2024
Applicant:
AvicenaTech Corp.
Inventors:
Bardia Pezeshki, Robert Kalman, Alex Tselikov
Abstract: Coupling of light from large angular distribution microLEDs into smaller angular acceptance distribution of transmission channels is performed using optical elements.
Type:
Grant
Filed:
April 13, 2021
Date of Patent:
February 27, 2024
Assignee:
AvicenaTech Corp.
Inventors:
Robert T. Weverka, Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
Abstract: Optical interconnect topologies may be provided using microLEDs. The topologies may interconnect ICs. The optical interconnect topologies may be used in some instances in place of electrical busses.
Type:
Grant
Filed:
January 8, 2021
Date of Patent:
February 27, 2024
Assignee:
AvicenaTech Corp.
Inventors:
Bardia Pezeshki, Robert Kalman, Alex Tselikov
Abstract: A microLED may be used to generate light for intra-chip or inter-chip communications. The microLED, or an active layer of the microLED, may be embedded in a waveguide. The waveguide may include a lens.
Type:
Grant
Filed:
March 8, 2023
Date of Patent:
February 20, 2024
Assignee:
AvicenaTech Corp.
Inventors:
Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
Abstract: Optical interconnects for IC chips may include optical sources and receivers integrated with the IC chips. MicroLEDs may be mounted on an interconnect layer of the IC chip, and embedded within a waveguide. Photodetectors to receive light from the waveguide may be fabricated in a top surface of a semiconductor substrate, below a level of the interconnect layer, but with a passageway for light through the interconnect layer.
Type:
Application
Filed:
October 24, 2023
Publication date:
February 15, 2024
Applicant:
AvicenaTech Corp.
Inventors:
Robert Kalman, Bardia Pezeshki, Cameron Danesh, Alexander Tselikov
Abstract: An optical interconnect may provide for optical communications between two IC chips. The optical interconnect may include an array of optoelectronic elements, for example microLEDs and photodetectors, with the array including a plurality of sub-arrays. A fiber bundle of optical fibers may couple the optoelectronic elements, and the fiber bundle may include a plurality of sub-bundles, with for example one sub-bundle for coupling pairs of sub-arrays. Fibers of each sub-bundle may be accurately positioned with respect to one another.
Type:
Application
Filed:
October 18, 2023
Publication date:
February 8, 2024
Applicant:
AvicenaTech Corp.
Inventors:
Robert Kalman, Bardia Pezeshki, Alexander Tselikov
Abstract: A multi-layer planar waveguide may be used in providing an interconnect for inter-chip and/or intra-chip signal transmission. Various embodiments to transmit optical signals are disclosed, along with designs of microLED optical assemblies, photodetector optical assemblies, waveguides, and multi-layer planar waveguides.
Type:
Application
Filed:
October 12, 2023
Publication date:
February 1, 2024
Applicant:
AvicenaTech Corp.
Inventors:
Robert Kalman, Bardia Pezeshiki, Alexander Tselikov, Cameron Danesh
Abstract: A GaN based LED, with an active region of the LED containing one or more quantum wells (QWs), with the QWs separated by higher energy barriers, with the barriers doped, may be part of an optical communications system.
Abstract: A coherent fiber bundle may be used to optically connect an array of microLEDs to an array of photodetectors in an optical communication system.
Type:
Application
Filed:
September 29, 2023
Publication date:
January 18, 2024
Applicant:
AVICENATECH CORP.
Inventors:
Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
Abstract: Light from one or more microLEDs may be coupled into multiple waveguide cores. Parabolic reflectors, truncated parabolic reflectors, and encapsulants may be used to increase fraction of emitted light coupled into the waveguide cores.
Type:
Application
Filed:
September 22, 2023
Publication date:
January 11, 2024
Applicant:
AvicenaTech Corp.
Inventors:
Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh
Abstract: Multi-chip modules in different semiconductor packages may be optically data coupled by way of LEDs and photodetectors linked by a multicore fiber. The multicore fiber may pass through apertures in the semiconductor packages, with an array of LEDs and photodetectors in the semiconductor package providing and receiving, respectively, optical signals comprised of data passed between the multi-chip modules.
Type:
Application
Filed:
September 1, 2023
Publication date:
December 21, 2023
Applicant:
AvicenaTech Corp.
Inventors:
Bardia Pezeshki, Robert Kalman, Alexander Tselikov, Cameron Danesh
Abstract: A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.
Type:
Grant
Filed:
November 28, 2022
Date of Patent:
December 5, 2023
Assignee:
AvicenaTech Corp.
Inventors:
Bardia Pezeshki, Robert Kalman, Alex Tselikov
Abstract: Integrated circuit chips may be optically interconnected using microLEDs. Some interconnections may be vertically-launched parallel optical links. Some interconnections may be planar-launched parallel optical links.
Type:
Grant
Filed:
April 13, 2021
Date of Patent:
November 21, 2023
Assignee:
AvicenaTech Corp.
Inventors:
Robert Kalman, Bardia Pezeshki, Alexander Tselikov, Cameron Danesh