Patents Assigned to Ball Semiconductor, Inc.
  • Patent number: 6303517
    Abstract: An apparatus and method for depositing thin films on the surface of a device such as a spherical shaped devices. The apparatus includes an enclosure containing a plurality of apertures and a conductor coil. The apertures connect to conduits for inputting and outputting the devices as well as injecting and releasing different gases and/or processing constituents. A chamber is formed within the enclosure and is configured to be coaxial with the conductor coil. Devices move through the input conduit where they are preheated by a resistance-type furnace. The preheated devices then move into the chamber where chemical precursors are added and the devices are further heated to a predefined temperature associated with the chemical precursors by radio frequency energy from the conductor coil. At this time, the gases and/or processing constituents react with the heated device thereby growing a thin film on its outer surface.
    Type: Grant
    Filed: July 27, 1999
    Date of Patent: October 16, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventors: Changfeng Xia, Lixin Wu
  • Patent number: 6300245
    Abstract: An apparatus and method for performing material deposition on semiconductor devices. The apparatus provides an enclosure for defining a chamber. The chamber includes a metallic portion such as a conductor coil powered by a voltage generator. A gas, having a suspension of particles for treating the semiconductor devices, is introduced into the chamber and the powered conductor coil converts the gas to inductively coupled plasma and vaporizes the particles. The particles can then be deposited on the semiconductor devices.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: October 9, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventors: Ivan Herman Murzin, Ram K. Ramamurthi
  • Patent number: 6295466
    Abstract: A wireless electrocardiogram monitor utilizing a cooperative association of miniature semiconductor balls. A side view of a surface mount cardiac monitor system (200) shows three semiconductor electrode balls (202), (204), and (206) contacting a central communication ball (208) for electrical communication therebetween. Each of the electrode balls (202), (204), and (206) have fabricated thereon a respective electrode (210), (212), and (214) for receiving electrical signals from the heart. The electrode signals are passed to the central communication ball (208) for processing, filtering, digital conversion, and transmission therefrom to a remote control system being operated by a medical technician. The data can then be displayed to medical personnel.
    Type: Grant
    Filed: January 6, 2000
    Date of Patent: September 25, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventors: Akira Ishikawa, Nabuo Takeda, Suzanne I. Ahn, Samuel S. Ahn, Steven R. Hays, F. Andrew Gaffney
  • Patent number: 6271145
    Abstract: A method for making a micromachine, which includes a spherical body and a spherical shell surrounding said spherical body, comprising forming a victim layer on said spherical body to coat said spherical body, forming a function layer on said victim layer, said function layer including at least one conductive material pattern and/or insulating material layer, forming a structure layer of insulating material to coat said spherical body on which said function layer is formed, forming etching bores extending from the outer surface of said structure layer to said victim layer, and introducing gaseous etchant into said etching bores to remove said victim layer.
    Type: Grant
    Filed: November 30, 1999
    Date of Patent: August 7, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventor: Risaku Toda
  • Patent number: 6264611
    Abstract: A ball-shaped semiconductor monitoring device (150) having one or more transducer functions for use with an instrument that is insertable into a human body. In one disclosed embodiment, a needle (130) and modified stylet (140) are inserted into intraluminal body cavities for measuring fluid pressure. The modified stylet (140) has the monitoring device (150) attached to one end. The stylet (140) has a metal annulus (142) extending throughout its length and a communication wire (144) disposed therein. The wire (144) is surrounded by an insulator (146) to electrically isolate it from the stylet (140). A recessed cavity (148) is provided at the distal end of the stylet (140) to accommodate the ball monitoring device (150). A transducer (152) is integrated on the ball device (150) to measure such quantitative conditions as pressure. The ball (150) has a ground terminal (154) and a data terminal (156).
    Type: Grant
    Filed: November 24, 1999
    Date of Patent: July 24, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventors: Akira Ishikawa, Nabuo Takeda, Suzanne I. Ahn, Samuel S. Ahn, Steven R. Hays, F. Andrew Gaffney
  • Patent number: 6266567
    Abstract: An implantable epicardial lead (13) is provided which is comprised of two spherical ICs (25) and (26) disposed at opposite ends of a supporting structure and separated by a predetermined distance. These spherical ICs comprise an anode and a cathode, each having connections thereto. The epicardial lead (13) includes circuitry for allowing inductive coupling of power into the epicardial lead (13) for storage in a capacitor (926). A switch (928) allows for selective discharge of the capacitor (926) to the surrounding myocardium into which it is implanted. The epicardial lead (13) also includes a receive/transmit device (942) for receiving command information for storage in a memory (939) to provide operation information therefor and also for receiving sensed information therefrom. The sensed information is sent via a switch (930).
    Type: Grant
    Filed: June 1, 1999
    Date of Patent: July 24, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventors: Akira Ishikawa, Nabuo Takeda, Suzanne I. Ahn, Steven R. Hays
  • Patent number: 6265234
    Abstract: Method and apparatus are described for aligning a spherical-shaped semiconductor having an alignment mark, the device comprising a housing having a bore for receiving the spherical-shaped semiconductor; an optical sensing system and controller for ascertaining the position and orientation of the alignment mark; and rotatable vacuum rods for rotating the spherical-shaped semiconductor along at least two axes thereof, thereby rotating the alignment mark into a predetermined orientation.
    Type: Grant
    Filed: January 25, 2000
    Date of Patent: July 24, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventor: Wenhui Mei
  • Patent number: 6264742
    Abstract: A system and method for processing crystals is disclosed. The system includes a receiver tube for receiving semiconductor granules. The granules are then directed to a chamber defined within an enclosure. The chamber maintains a heated, inert atmosphere with which to melt the semiconductor granules into a molten mass. A nozzle, located at one end of the chamber, creates droplets from the molten mass, which then drop through a long drop tube. As the droplets move through the drop tube, they form spherical shaped semiconductor crystals. The drop tube is heated and the spherical shaped semiconductor crystals may be single crystals. An inductively coupled plasma torch positioned between the nozzle and the drop tube melts the droplets, but leaving a seed in-situ, or the droplets may be melted and a seed injected in-situ. The seed can thereby facilitate crystallization.
    Type: Grant
    Filed: July 29, 1999
    Date of Patent: July 24, 2001
    Assignee: Ball Semiconductor Inc.
    Inventors: Evangellos Vekris, Nainesh J. Patel, Murali Hanabe
  • Patent number: 6261247
    Abstract: An anatomical position sensing system (100) using one or more substantially spherical transponders for measuring relative positions and distances. Transponders (P) and (S) are capable of receiving and transmitting RF signals, and communicating between themselves and with a separate CPU (112). The CPU (112) is controlled by an operator at an operator control panel (114), interacts with an alarm (120) for providing audible alerts to the operator, and a display for displaying information to the operator. The CPU (112) controls a broadband antenna (118) to transmit, at a frequency f1, a low-frequency RF power signal (122) across a wide field to energize the transponders (P) and (S). Directional components (122a) and (122b) intercept and energize the transponders (P) and (S). Once energized, transponder (P) transmits a range signal in all directions including component (124) at a very high RF frequency f2, extending from transponder (P) to transponder (S).
    Type: Grant
    Filed: December 30, 1999
    Date of Patent: July 17, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventors: Akira Ishikawa, Nabuo Takeda, Suzanne I. Ahn, Samuel S. Ahn, Steven R. Hays, F. Andrew Gaffney
  • Patent number: 6262791
    Abstract: The present invention provides an apparatus and a method for reshaping the best focus surface to more closely match the surface geometry of a nonplanar surface, such as a sphere. The apparatus includes a complex phase plate located between a mask for generating an image and an elliptical mirror. The mirror has a unique wavefront error and an aspheric image focus surface which is corrected by the complex phase plate, thereby shifting the focus surface to correspond to the nonplanar surface. The apparatus may be used for various shaped substrates, such as a spherical shaped semiconductor device. The complex phase plate includes a variable focal length optical element. The variable focal length optical element may include a diffractive optical element with a plurality of complex phase grating sections repeated over a surface of thereof, located in immediate proximity to the mask.
    Type: Grant
    Filed: June 28, 1999
    Date of Patent: July 17, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventor: Karlton Powell
  • Patent number: 6254548
    Abstract: A miniature spherical-shaped internal temperature transponder. A temperature sensor (25) is fabricated in a spherical integrated transponder circuit (15) which may be placed in the human body by ingestion, implantation, or injection. In one aspect of the invention, a passive system is disclosed whereby an external monitoring station (13) generates an energy field using a magnetic field generator (19) which is coupled to a power coil (21) of the transponder (15). The power coil (21) passes power to a power regulator (23) to provide regulated power to all transponder (15) circuits. Temperature data obtained by the temperature sensor (25) is passed to a voltage controlled oscillator (27) for conversion into an RF signal. A mixing circuit (31) receives the RF temperature signal and modulates the temperature data signal onto an oscillator frequency from an RF oscillator (29).
    Type: Grant
    Filed: November 24, 1999
    Date of Patent: July 3, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventors: Akira Ishikawa, Nabuo Takeda, Suzanne I. Ahn, Samuel S. Ahn, Steven R. Hays, F. Andrew Gaffney
  • Patent number: 6251765
    Abstract: A system and method for forming solder bumps on a surface of a semiconductor device, such as a spherical-shaped semiconductor integrated circuit, is disclosed. Multiple devices are first aligned so that a vacuum chuck can hold all of the devices with an appropriate orientation. The vacuum chuck can then dip the devices into different molten metal compounds to form a plurality of solder bumps. Metal solder materials of different melting points are chosen so that the thickness of the solder bumps are partially controlled by the number of layers of solder metal sequentially grow on the metal pads. Once the solder bumps are grown on the devices, the vacuum chuck can immediately transfer the devices to a tape and reel assembly for further transportation thereof. It can also be easily fed into a tube assembly which protects the spherical shaped semiconductor device with the solder bumps during the shipping process.
    Type: Grant
    Filed: July 8, 1999
    Date of Patent: June 26, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventors: Atsuyuki Fukano, Nobuo Takeda
  • Patent number: 6251550
    Abstract: A maskless photolithography system for use in photolithography of a desired mask pattern on a photo resist coated subject includes a light source for projecting a collimated beam of light, a first lens system, and a pattern generator. The pattern generator is for generating the desired mask pattern according to prescribed mask pattern information. Upon receipt of the prescribed mask pattern information, the pattern generator generates a resident mask pattern therein to be imaged upon the photo resist coated subject. A mask pattern design system is provided for outputting the prescribed mask pattern information corresponding to the desired mask pattern to the pattern generator. The maskless photolithography system further includes a second lens system and a subject stage.
    Type: Grant
    Filed: July 7, 1999
    Date of Patent: June 26, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventor: Akira Ishikawa
  • Patent number: 6245630
    Abstract: A spherical shaped semiconductor integrated circuit (“ball”) and a system and method for manufacturing same. The ball replaces the function of the flat, conventional chip. The physical dimensions of the ball allow it to adapt to many different manufacturing processes which otherwise could not be used. Furthermore, the assembly and mounting of the ball may facilitates efficient use of the semiconductor as well as circuit board space.
    Type: Grant
    Filed: May 29, 1998
    Date of Patent: June 12, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventor: Akira Ishikawa
  • Patent number: 6240655
    Abstract: A method for treating a descending process flow and a spherical-shaped semiconductor integrated circuit manufacturing system incorporating the same. The manufacturing system includes a first processing station, a second processing station and first and second intermediate stations positioned between the first and second processing stations. The first processing station produces, at an output thereof, a first process flow comprised of a first process fluid and spherical-shaped semiconductors. The output of the first processing station is coupled to a first downwardly descending tube which forms an input tube of the first intermediate station. The first process flow enters a porous tube positioned inside an evacuation chamber.
    Type: Grant
    Filed: September 29, 1998
    Date of Patent: June 5, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventor: Dirk Fruhling
  • Patent number: 6235126
    Abstract: A system and method for cleaning very small spherical shaped semiconductor devices is disclosed. The system includes an enclosure for housing a pair of rollers. The enclosure also includes a fluid inlet for receiving a cleaning agent and a product inlet for receiving the spherical shaped semiconductor device. A motor rotates one or both of the rollers. In operation, the spherical shaped semiconductor device and the cleaning agent are provided into the enclosure. The device passes to the pair of rollers and is cleaned by the cleaning agent and the rotating rollers. Once cleaned, the spherical shaped device and cleaning agent pass into a separator and the device is fully cleaned.
    Type: Grant
    Filed: February 2, 1999
    Date of Patent: May 22, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventor: Shenchu Zhang
  • Patent number: 6221165
    Abstract: An apparatus and method for performing thermal diffusion on the substrate of a device such as a spherical shaped semiconductor. To this end, one embodiment provides an enclosure containing a plurality of apertures and a plasma chamber. A plasma generator for producing a plasma torch is incorporated with the plasma chamber, the plasma generator including a conductor coil electrically connected to a radio frequency energy generator. A first conduit registering with a first opening in the enclosure allows the semiconductor devices to be received into the plasma chamber. A second conduit registering with a second opening in the enclosure allows the semiconductor devices to exit the plasma chamber. Processing fluids are injected into the plasma chamber so that a doping material from the process fluid is ionized at an upper portion of the plasma torch to form a high density diffusion plasma.
    Type: Grant
    Filed: July 1, 1999
    Date of Patent: April 24, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventors: Yanwei Zhang, Changfeng Xia
  • Patent number: 6214110
    Abstract: An apparatus and method are provided for applying a uniform liquid coating on a spherical semiconductor device. The present invention includes a multi functional process tube having an end which is covered by a liquid processing material which remains in place due to its surface tension and viscosity. Spherical semiconductor substrates are then dropped through the liquid material and become encapsulated by the fluid. At a subsequent stage in the process tube, vibratory motion is induced in the spheres to cause random motion along a linear combination of the three axes (x, y, z) and distribute the fluid material evenly around the surface of the sphere. The uniformly coated spheres then encounter a heating stage which cause the distributed processing material to become hardened and allow easier handling of the spherical semiconductor substrates for subsequent processing.
    Type: Grant
    Filed: April 23, 1999
    Date of Patent: April 10, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventor: Karlton Powell
  • Patent number: 6203658
    Abstract: A spherical shaped semiconductor integrated circuit (“ball”) and a system and method for manufacturing same. The ball replaces the function of the flat, conventional chip. The physical dimensions of the ball allow it to adapt to many different manufacturing processes which otherwise could not be used. Furthermore, the assembly and mounting of the ball may facilitates efficient use of the semiconductor as well as circuit board space.
    Type: Grant
    Filed: March 8, 1999
    Date of Patent: March 20, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventor: Akira Ishikawa
  • Patent number: 6203623
    Abstract: An aerosol assisted chemical cleaning method to remove wall deposition from reaction chambers is provided. The method generates cleaning chemicals in an aerosol state, and then feeds them into the reaction chamber by a carrier gas. The cleaning chemicals interact quickly with unwanted deposits on all internal surfaces of the reaction chamber. By controlling the pressure in the closed reaction chamber, the deposits can be stripped off from the wall and fall into a waste acid collector. The acid collector can then process the waste to prevent contamination.
    Type: Grant
    Filed: December 28, 1999
    Date of Patent: March 20, 2001
    Assignee: Ball Semiconductor, Inc.
    Inventor: Chang Feng Xia