Patents Assigned to Beijing Superstring Academy of Memory Technology
  • Publication number: 20230017764
    Abstract: A semiconductor structure and a method for preparing a semiconductor structure are provided. The semiconductor structure includes a substrate. A first active area, a second active area and an isolation structure are arranged on the substrate. The first active area and the second active area are isolated from one another by the isolation structure. The first active area includes a first doped region and a second doped region. The second active area includes a third doped region and a fourth doped region. The semiconductor structure further includes a gate structure. The gate structure is arranged above the second doped region and the third doped region, and the gate structure is connected to the second doped region and the third doped region.
    Type: Application
    Filed: September 19, 2022
    Publication date: January 19, 2023
    Applicants: CHANGXIN MEMORY TECHNOLOGIES, INC., BEIJING SUPERSTRING ACADEMY OF MEMORY TECHNOLOGY
    Inventors: Jie LUO, Deyuan XIAO
  • Publication number: 20220393034
    Abstract: A semiconductor device and a method of manufacturing the same, and an electronic apparatus including the semiconductor device are provided. The semiconductor device includes: an active region, on a substrate, extending substantially in a vertical direction; a gate stack formed around at least a part of a periphery of the active region, the active region including a channel region opposite to the gate stack, and a first source/drain region and a second source/drain region, and the gate stack including a gate dielectric layer, a work function tuning layer and a gate electrode material layer, and the work function tuning layer being between the gate electrode material layer and the channel region; and a first low-k dielectric layer extending from a first end of the work function tuning layer to surround a first corner of an end portion, on a side facing the channel region, of the gate electrode material layer.
    Type: Application
    Filed: June 6, 2022
    Publication date: December 8, 2022
    Applicants: Beijing Superstring Academy of Memory Technology, Institute of Microelectronics, Chinese Academy of Sciences
    Inventor: Huilong Zhu