Abstract: Base-soluble release layer compositions for microlithographic processing, comprising nonamic acid functionalized polyamic acid/imide resins are disclosed. These materials permit concurrent lithographic development of photoresist and release layers. They also afford effective lift-off, by alkaline media, even after high imidization.

Abstract: Soluble conducting polymers from substituted polyanilines and large organic counterions are disclosed and used directly from solution in the manufacture of electronic devices.

Abstract: A composition and a method for forming an anti-reflective layer for DUV microlithographic processes is disclosed. The compositions of the present invention includes a polymer dissolved in a suitable solvent. The polymers are polysulfone and polyurea polymers which possess inherent light absorbing properties at deep ultraviolet wavelengths. In accordance with the method of the present invention, these compositions are applied to a substrate to form an anti-reflective coating, and thereafter a photoresist material that is compatible with the anti-reflective coating is applied.

Abstract: Positive working polyamic acid photoresist compositions are disclosed having improved high resolution upon image development and exhibiting stable photosensitivity and superior dielectric performance. The compositions comprise polyamic acid condensation products of an aromatic dianhydride and an aromatic di-primary amine wherein a percentage of the diamine comprises special dissolution inhibiting monomers. The compositions may be further improved by the presence of particular supplemental additives.

Abstract: A photolithographic composition having improved processability and which eliminates the need for inter layering multiple special purpose coatings in the production of micro-electronic devices is surprisingly made possible by selective dissolution of poly(vinylpyridine) and an effective light attenuating material in critical solvents.

Abstract: An improved method of promoting the adhesion of microelectronic coatings to substrates uses new adhesion promoters, catalysts for adhesion promoters and adjuvant polymers.

Abstract: A light absorbing medium to be interposed under photosensitive layers, such as a photo-resist for integrated circuit "chips" to eliminate defects caused by reflected light, has a polymer vehicle which can penetrate into small depressions of a substrate and form a thin, smooth and uniform coating. The coating includes a light absorbing dye. This light absorbing layer is imageable in the process. The light absorbing material eliminates many of the defects caused by reflected light resulting in increased sharpness of the images in the photo-resist. The material reduces the losses due to defects and increases the yield of useable product.

Abstract: Filters suitable for microelectronic uses and the like may be prepared directly on substrates either as monolithically integrated filters or as hybrid filters using a soluble dye material in a resin. The resin may be applied to microelectronic substrates and patterned by conventional microphotolithographic processes.

Abstract: A broad spectrum light absorbing medium to be coated over photosensitive layers, such as a photoresist for integrated circuit "chips" to act as a true surface for autofocus of the camera used to expose the photoresist. The product may also be used where a light impermeable, high contrast or black coating is needed, such as, in liquid crystal displays and light emitting diodes, photodiodes, solid state lasers, or patterning apertures on light-wave modulators. The coating absorbs light from 200 to 1000 nanometers. The coating has a polymer vehicle which can form a tightly adhering, thin, smooth and uniform coating. The coating includes a light absorbing dye. This light absorbing layer may be imageable.

Abstract: An improved method for improving the adhesion of microelectronic coatings to substrates uses a new silane adhesion promoter and hydroxylic solvent combination. An improved silane adhesion promoter contains an aqueous solvent composition containing a hydroxylic solvent.