Abstract: Light system useful for activating light-activated materials are disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them, and materials and structures usable therewith.
Abstract: Light system useful for activating light-activated materials are disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them, and materials and structures usable therewith.
Abstract: Light system useful for activating light-activated materials are disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them, and materials and structures usable therewith.
Abstract: A curing light system useful for curing light activated composite materials is disclosed. The system includes a light emitting semiconductor device, a primary heat sink and a secondary heat sink. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
Abstract: A semiconductor light source for illuminating a physical space has been invented. In various embodiments of the invention, a semiconductor such as and LED chip, laser chip, LED chip array, laser array, an array of chips, or a VCSEL chip is mounted on a heat sink. The heat sink may have multiple panels for mounting chips in various orientations. The chips may be mounted directly to a primary heat sink which is in turn mounted to a multi-panel secondary heat sink. A TE cooler and air circulation may be provided to enhance heat dissipation. An AC/DC converter may be included in the light source fitting.
Abstract: A curing light system useful for curing light activated composite materials is disclosed. The system includes a light emitting semiconductor device, a primary heat sink and a secondary heat sink. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
Abstract: A curing light system useful for curing light activated composite materials is disclosed. The system may be a hand-held portable curing light system operated by batteries or a chair side curing light system operated by AC power. The curing light system includes a light source which may be one or more light emitting diode chips or one or more diode laser chips. The chips of the light source are located on a single heat sink for heat dissipation. The heat sink and chips are located in an encasement that may include a focus dome or transparent window through which light travels to reach light activated composite materials. In the preferred embodiment, the light travels from the light source directly to a curing surface without first going through a light guide or fiber optic cable. The light source is preferably located in a handle that is manipulated by a user in order to direct light emitted by the light source to composite materials to be cured.