Abstract: Methods for staining a selected tissue with a dye, stain or pigment that is attuned to absorb the energy from a radiant energy source are disclosed. The radiant energy source can be sufficient to destroy or combust radiated tissues. The dye or stain can enhance absorption of incoming radiant energy, which results in increased destruction of stained tissues and decreased destruction of underlying tissues. This method provides clinicians with the ability to selectively mark a tissue for destruction, while leaving wanted tissues generally intact. A clinician may dispense the stain with a pen and directly stain selected biological tissues, similar to the current practice of drawing current incision guides, followed by radiating the stained area with a laser that produces a wavelength that the stain readily absorbs. Optionally, a radiant energy opaque substance that can be applied adjacent the stained treatment area to protect against accidental or incidental exposure to wanted tissue.
Abstract: Present invention provides a method for treating periodontal disease. Periodontal disease is a pathogenic infection of the gums. The method comprises the use of a laser or radiant energy source that is capable of being absorbed by pathogens. Said Radiant energy is applied to infected periodontal pockets with the intention of destroying any susceptible pathogens. The periodontal pocket is then flushed with an anti-microbial substance with the intention to destroy any residual susceptible pathogens.
Abstract: The present invention provides methods whereby a thermally formable plastic is compounded with releasable active ingredients. The compounded plastic is then formed into a desired dental delivery device such as an anatomical membrane, tray or strip. The dental device is then placed in the oral environment where it will release or leach active ingredients. The dental device is intended to treat, alter, improve, or aid in various conditions that are often present in the oral environment.
Abstract: Light system useful for activating light-activated materials are disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them, and materials and structures usable therewith.
Abstract: A curing light system useful for curing light activated composite materials is disclosed. The system includes a light emitting semiconductor device, a primary heat sink and a secondary heat sink. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
Abstract: A curing light system useful for curing light activated composite materials is disclosed. The system includes a light emitting semiconductor device, a primary heat sink and a secondary heat sink. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
Abstract: A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
Abstract: A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
Abstract: A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
Abstract: A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
Abstract: A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
Abstract: A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
Abstract: Light system useful for activating light-activated materials are disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them, and materials and structures usable therewith.
Abstract: A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
Abstract: A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
Abstract: A curing light system useful for curing light activated composite materials is disclosed. The system includes a light emitting semiconductor device, a primary heat sink and a secondary heat sink. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
Abstract: Light system useful for activating light-activated materials are disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them, and materials and structures usable therewith.
Abstract: Light system useful for activating light-activated materials are disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them, and materials and structures usable therewith.
Abstract: Light system useful for activating light-activated materials are disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them, and materials and structures usable therewith.
Abstract: A semiconductor forensic light is disclosed. The forensic light may use a variety of semiconductor light sources to produce light that contrasts forensic evidence against its background for viewing, photographing and collection. Example semiconductor light sources for the forensic light include light emitting diodes and laser chips. A heat sink, thermoelectric cooler and fan may be included to keep the forensic light cool. A removable light source head may be included on the forensic light to provide for head swapping to give the user access to different wavelengths of light.
Type:
Grant
Filed:
February 7, 2003
Date of Patent:
October 11, 2005
Assignee:
Cao Group, Inc.
Inventors:
Calvin D. Ostler, Densen Cao, Hongyan Li, Zhaohui Lin