Abstract: A lithographic apparatus has an assembly to exchange optical elements in a pupil plane of its projection system. The optical elements may be pupil filters and may conform to the physical dimensions specified for a reticle standard, e.g. having sides substantially equal to 5, 6 or 9 inches.

Abstract: In general, in a first aspect, the invention features a system that includes a microlithography projection optical system. The microlithography projection optical system includes a plurality of elements arranged so that during operation the plurality of elements image radiation at a wavelength ? from an object plane to an image plane. At least one of the elements is a reflective element that has a rotationally-asymmetric surface positioned in a path of the radiation. The rotationally-asymmetric surface deviates from a rotationally-symmetric reference surface by a distance of about ? or more at one or more locations of the rotationally-asymmetric surface.

Abstract: Imaging system of a microlithographic projection exposure apparatus, with a projection objective (200, 300, 500, 600) that serves to project an image of a mask which can be set into position in an object plane onto a light-sensitive coating layer which can be set into position in an image plane, and with a liquid-delivery device (205) serving to fill immersion liquid (202, 310, 507) into an interstitial space between the image plane and a last optical element (201, 309, 506) on the image-plane side of the projection objective; wherein the last optical element on the image-plane side of the projection objective is arranged so that, seen in the direction of gravity, it follows the image plane; and wherein the projection objective is configured in such a way that when the system is operating with immersion, the immersion liquid has at least in some areas a convex-curved surface facing in the direction away from the image plane.

Abstract: Optimization of a projection system is performed to obtain a starting configuration that is at a local minimum of the merit function or simply a previously known minimum system is used as the starting configuration. A zero-thickness meniscus lens is inserted at a surface in the local minimum starting configuration with N surfaces to construct a saddle point with Morse Index=1 having N+2 surfaces. The saddle point is perturbed and optimization is performed on both sides of the saddle, and the distances at the two surfaces that have been introduced are increased, to generate two new configurations, m1 and m2, that are new minima in the merit function. Each resulting configuration is output, e.g., as a table of parameters specifying the projection system or as a computer file for use in making an actual projection system.

Abstract: An optical element for correcting aberrations in an optical apparatus has a casing. The casing is filled with liquid and has a support layer and a cover layer designed to pass light of a predetermined wavelength range. The casing accommodates several actuators. Each actuator has a first end supporting the cover layer and a second end supporting the support layer. Each actuator is able to locally change a local distance between the support layer and the cover layer to correct for local aberrations in a light beam directed to the optical element by providing local phase shifts. The optical element may be used in a lithographic apparatus.

Abstract: An illumination system for a microlithography projection exposure installation is used to illuminate an illumination field with the light from a primary light source (11). The illumination system has a light distribution device (25) which receives light from the primary light source and, from this light, produces a two-dimensional intensity distribution which can be set variably in a pupil-shaping surface (31) of the illumination system. The light distribution device has at least one optical modulation device (20) having a two-dimensional array of individual elements (21) that can be controlled individually in order to change the angular distribution of the light incident on the optical modulation device. The device permits the variable setting of extremely different illuminating modes without replacing optical components.

Abstract: An imaging system for imaging an off-axis object field arranged in an object surface of the imaging system onto an off-axis image field arranged in an image surface of the imaging system while creating at least one intermediate image has: an optical axis; an in-line mirror group having an object side mirror group entry, an image side mirror group exit and a mirror group plane aligned transversely to the optical axis and arranged geometrically between the mirror group entry and the mirror group exit, the mirror group including: a first mirror having a first mirror surface for receiving radiation coming from the object surface in a first reflecting area asymmetric to the optical axis; at least one second mirror having a second mirror surface facing the first mirror surface for receiving radiation coming from the first mirror in a second reflecting area asymmetric to the optical axis; at least one of the first and second mirrors being a concave mirror having a concave mirror surface defining a mirror axis on the

Abstract: An apparatus and method for measuring an outgassing in a EUV lithography apparatus. The method includes activating a surface within the EUV lithography apparatus, inducing the outgassing, analyzing a residual gas. Defining a maximum partial pressure, recording a mass spectrum of the residual gas, converting the highest-intensity peaks of the mass spectrum into sub-partial pressures, summing the sub-partial pressures, and comparing the summed result with the defined maximum partial pressure. An EUV lithography apparatus includes a residual gas analyzer and a stimulation unit comprised of at least on of an electron source, an ion source, a photon source, and a plasma source. A measurement setup for measuring the outgassing from components by analyzing the residual gas includes a residual gas analyzer, a vacuum chamber, and a stimulation unit comprised of at least on of an electron source, an ion source, a photon source, and a plasma source.

Abstract: The disclosure relates to an optical arrangement for three-dimensionally patterning a radiation-sensitive material layer, such as a projection exposure apparatus for microlithography. The optical arrangement includes a mask for forming a three-dimensional radiation pattern, a substrate with the radiation-sensitive material layer, and a projection optical unit for imaging the three-dimensional radiation pattern from the mask into the radiation-sensitive material layer. The optical arrangement is designed to compensate for spherical aberrations along the thickness direction of the radiation-sensitive material layer in order to generate a stigmatic image of the three-dimensional radiation pattern.

Abstract: A projection objective for a microlithographic projection exposure apparatus. The projection objective can project an image of a mask that can be set in position in an object plane onto a light-sensitive coating layer that can be set in position in an image plane. The projection objective can be designed to operate in an immersion mode, and it can produce at least one intermediate image. The projection objective can include an optical subsystem on the image-plane side which projects the intermediate image into the image plane with an image-plane-side projection ratio having an absolute value of at least 0.3.

Abstract: An imaging device in a projection exposure machine for microlithography has at least one optical element and at least one manipulator, having a linear drive, for manipulating the position of the optical element. The linear drive has a driven subregion and a nondriven subregion, which are movable relative to one another in the direction of a movement axis. The subregions are interconnected at least temporarily via functional elements with an active axis and via functional elements with an active direction at least approximately parallel to the movement axis.

Abstract: A method for the spatially resolved measurement of the birefringence distribution of a cylindrically symmetrical blank (2) made from an optical material transparent to at least one wavelength ?B between 180 nm and 650 nm, in particular at 193 nm, including: irradiating the blank (2), arranged in a container (4) with an immersion fluid (5), at a jacket-side measurement position (MP) using a measuring light beam (9) which runs in a measuring direction (Y) preferably perpendicular to the axis of symmetry (S) of the blank (2), as well as varying the jacket-side measurement position (MP) by moving the measuring light beam (9) and the blank (2) relative to one another in two directions (X, Z) perpendicular to the measuring direction (Y) for the purpose of spatially resolved measurement of the non-axial birefringence distribution of the blank (2).

Abstract: An illumination system of a microlithographic projection exposure apparatus comprises a pupil surface and an arrangement of individually drivable beam deviating elements. Each beam deviating element is configured to direct light impinging thereon onto different positions on the pupil surface in response to a control signal applied to the beam deviating element. According to the disclosure an attenuation unit is provided which is configured to reduce the intensity of light, which is directed by any arbitrary beam deviating element (onto the pupil surface, by more than 50%. This makes it possible to reduce the intensity of light in the pupil surface that has been reflected by defective beam deviating elements.

Abstract: The disclosure provides projection objectives which may be used in a microlithographic projection exposure apparatus to expose a radiation-sensitive substrate arranged in the region of an image surface of the projection objective with at least one image of a pattern of a mask arranged in the region of an object surface of the projection objective. The disclosure also provides projection exposure apparatus which include such projection objectives, as well as related components and methods.

Abstract: The present high positioning reproducible mirror-actuator interface disclosed herein overcomes the deficiencies associated with conventional interface systems and offer a number of advantages that are disclosed herein. Generally, the mirror mounts provide a reliable and robust interface between the mirrors and actuators, that serve to move and position the mirrors, as wells as providing an interface between the mirrors and gravity compensator pins. The mirror mount is characterized as having a body that has an outer peripheral wall that includes a plurality of flexible elements around the perimeter of the body, each having a high stiffness in plane and a high flexibility out of plane. The body is open at the first end to allow flexing of the flexible elements. The flexible elements providing a direct coupling interface between the mirror mount and the mirror.

Abstract: The invention features a system for microlithography that includes a mercury light source configured to emit radiation at multiple mercury emission lines, a projection objective positioned to receive radiation emitted by the mercury light source, and a stage configured to position a wafer relative to the projection objective. During operation, the projection objective directs radiation from the light source to the wafer, where the radiation at the wafer includes energy from more than one of the emission lines. Optical lens systems for use in said projection objective comprise four lens groups, each having two lenses comprising silica, the first and second lens groups on one hand and the third and fourth lens groups on the other hand are positioned symmetrically with respect to a plane perpendicular to the optical axis of said lens system.

Abstract: A catadioptric projection objective for projecting a pattern arranged in the object plane of the projection objective into the image plane of the projection objective, having: a first objective part for projecting an object field lying in the object plane into a first real intermediate image; a second objective part for generating a second real intermediate image with the radiation coming from the first objective part; a third objective part for generating a third real intermediate image with the radiation coming from the second objective part; and a fourth objective part for projecting the third real intermediate image into the image plane.

Abstract: A projection objective of a projection exposure apparatus for microlithography serves for imaging an object arranged in an object plane onto a light-sensitive wafer in an image plane. The projection objective has a plurality of optical elements which have at least one reflective element and at least one refractive element. The plurality of optical elements lie, in the light propagation direction of the useful light, downstream of the reflective element on a common straight optical axis. The at least one reflective element has a substrate having at least one opening through which light beams can pass. The at least one reflective element is at least partly made from a material which suppresses stray light impinging on the reflective element rearward.

Abstract: A structure for mounting an assembly of optical elements disposed within a housing, in particular of a projection lens assembly of a projection exposure system for manufacturing semiconductor elements includes a plurality of supporting elements, each respective one of which forms part of a respective one of a plurality of connections though which the housing of the assembly is connected to said supporting structure through which the weight of the assembly is transferred to the supporting structure in such a way that supporting forces generated by said supporting structure are taken up by pressure forces and shear forces which act on at least one of the supporting elements.

Abstract: Projection objectives, as well as related components, systems and methods, are disclosed. In general, a projection objective is configured to image radiation from an object plane to an image plane. A projection objective can include a plurality of optical elements along the optical axis. The plurality of optical elements can include a group of optical elements and a last optical element which is closest to the image plane, and a positioning device configured to move the last optical element relative to the image plane. Typically, a projection objective is configured to be used in a microlithography projection exposure machine.