Abstract: A device serves for controlling temperature of an optical element provided in vacuum atmosphere. The device has a cooling apparatus having a radiational cooling part, arranged apart from the optical element, for cooling the optical element by radiation heat transfer. A controller serves for controlling temperature of the radiational cooling part. Further, the device comprises a heating part for heating the optical element. The heating part is connected to the controller for controlling the temperature of the heating part. The resulting device for controlling temperature in particular can be used with an optical element in a EUV microlithography tool leading to a stable performance of its optics.

Abstract: A projection exposure method is disclosed which includes exposing an exposure area of a radiation-sensitive substrate, arranged in an image surface of a projection objective, with at least one image of a pattern of a mask arranged in an object surface of the projection objective in a scanning operation. The scanning operation includes moving the mask relative to an effective object field of the projection objective and simultaneously moving the substrate relative to an effective image field of the projection objective in respective scanning directions. The projection exposure method also includes changing imaging properties of the projection objective actively during the scanning operation according to a given time profile to change dynamically at least one aberration of the projection objective between a beginning and an end of the scanning operation.

Abstract: An illumination system for a microlithography projection exposure installation is used to illuminate an illumination field with the light from a primary light source (11). The illumination system has a light distribution device (25) which receives light from the primary light source and, from this light, produces a two-dimensional intensity distribution which can be set variably in a pupil-shaping surface (31) of the illumination system. The light distribution device has at least one optical modulation device (20) having a two-dimensional array of individual elements (21) that can be controlled individually in order to change the angular distribution of the light incident on the optical modulation device. The device permits the variable setting of extremely different illuminating modes without replacing optical components.

Abstract: A projection objective is disclosed. The projection objective can include a plurality of optical elements arranged to image a pattern from an object field in an object surface of the projection objective to an image field in an image surface of the projection objective with electromagnetic operating radiation from a wavelength band around an operating wavelength ?. The plurality of optical elements can include an optical correction plate that includes a body comprising a material transparent to the operating radiation, the body having a first optical surface, a second optical surface, a plate normal substantially perpendicular to the first and second optical surfaces, and a thickness profile defined as a distance between the first and second optical surfaces measured parallel to the plate normal. The first optical surface can have a non-rotationally symmetric aspheric first surface profile with a first peak-to-valley value PV1>?.

Abstract: An optical system is disclosed that includes a plurality of elements arranged to image radiation at a wavelength ? from an object field in an object surface to an image field in an image surface. The elements include mirror elements having a reflective surface formed by a reflective coating positioned at a path of radiation. At least one of the mirror elements has a rotationally asymmetrical reflective surface deviating from a best-fit rotationally symmetric reflective surface by about ? or more at one or more locations. The elements include an apodization correction element effective to correct a spatial intensity distribution in an exit pupil of the optical system relative to the optical system without the apodization correcting element. The apodization correction element can be effective to increase symmetry of the spatial intensity distribution in the exit pupil relative to the optical system without the apodization correcting element.

Abstract: An optical membrane element for an optical device in lithography, especially EUV (extreme ultraviolet) lithography, includes at least one membrane layer and a frame, which at least partially surrounds the membrane layer and at which at least part of the rim of the membrane layer is mounted. At least one tautening element is provided, which facilitates tautening of the membrane layer and wherein the optical membrane element can be used in a projection exposure system, especially for EUV lithography, such that the membrane layer of the membrane element can be adjustably tautened, such that the membrane layer is flat. A method for manufacturing a corresponding optical membrane element includes generating a tautening element lithographically together with the membrane layer.

Abstract: In some embodiments, the disclosure relates to an optical assembly that includes an optical element and a structure element. A gap runs between the optical element and the structure element. A sealing element may be present to seal the gap. At least one liquid layer may be arranged between the structure element and/or the optical element, and the sealing element so that a relative displacement of the sealing element with respect to the structure element and/or the optical element is possible in the direction of the layer plane.

Abstract: The invention relates to a method for processing the surfaces of optical workpieces (3) such as optical or eye glass lenses carried out with the aid of a tool (5) and consisting in holding at least one workpiece (3) in a work piece receiving support (4) which is rotatable around the axis of a workpiece spindle (1?). The invention is characterized in that the workpiece (3) is received in the receiving support (4) in such a way that the axis of rotation (2) of the workpiece spindle is placed remotely from the axis (8) of at least one workpiece (3) and the axis (18) of the workpiece support is at least partially in a parallel position to the axis of rotation of the workpiece spindle.

Abstract: A replacement apparatus for an optical element mounted between two adjacent optical elements in a lithography objective has a holder for the optical element to be replaced, which holder can be moved into the lithography objective through a lateral opening in a housing of the same.

Abstract: The present invention relates to an optical imaging device, in particular for microscopy, with a first optical element group and a second optical element group, wherein the first optical element group and the second optical element group, on an image plane, form an image of an object point of an object plane. The first optical element group comprises a first optical element with a reflective first optical surface and a second optical element with a reflective second optical surface. The second optical element group comprises a third optical element with a reflective third optical surface. The first optical element and the second optical element are formed and arranged such that on formation of the image of the object point, in each case a multiple reflection of at least one imaging beam takes place on the first optical surface and the second optical surface.

Abstract: An optical system for radiation in the EUV wavelength range, in particular a projection exposure apparatus, having at least one vacuum vessel, including: at least one EUV-reflective optical element arranged in an optical path, and a holder which includes at least one sample element, the sample element having an optical surface which is exposed to incident EUV-radiation outside of the optical path, the sample element being sensitive to chemical alterations under influence of the incident EUV-radiation which also affect the optical element. The optical system further includes at least one detection unit for online detection of the contamination status of the sample element during exposure of the sample element to the incident EUV-radiation.

Abstract: An optical system, such as, for example, an illumination system or a projection lens of a microlithographic exposure system. The optical system can have an optical axis and include at least one optical element that includes an optically uniaxial material having, for an operating wavelength of the optical system, an ordinary refractive index no and an extraordinary refractive index ne. The extraordinary refractive index ne can be larger than the ordinary refractive index no. The optical element can absorb, at least for light rays of the operating wavelength entering the optical element with respect to the optical axis under an angle of incidence that lies within a certain angle region, a p-polarized component of the light rays significantly stronger than a s-polarized component of the light rays.

Abstract: A method for examining at least one wafer (13) with regard to a contamination limit, in which the contamination potential of the resist (13a) of the wafer (13), which resist (13a) outgasses contaminating substances, is examined with regard to a contamination limit before the wafer (13) is exposed in an EUV projection exposure system (1). The method preferably includes: arranging the wafer (13) and/or a test disc coated with the same resist (13a) as the resist (13a) of the wafer (13) in a vacuum chamber (19), evacuating the vacuum chamber (19), and measuring the contamination potential of the contaminating substances outgassed from the wafer (13) in the evacuated vacuum chamber (19), and also comparing the contamination potential of the wafer (13) with a contamination limit. An EUV projection exposure system (1) for carrying out the method is also disclosed.

Abstract: A method for producing an optical element or part of an optical element having a base body, including:—providing a mold body (21, 1000, 2000) which has a surface corresponding to the geometry of the optical element;—depositing a layer system (7) including at least one separation layer system (15, 1010, 2010) on the surface of the mold body (21, 1000, 2000);—electroforming a base body (4, 1030, 2030) on the layer system (7); and—detaching at least the base body from the mold body (21, 1000, 2000) at the separation layer system (15, 1010, 2010).

Abstract: There is provided an optical element comprising an optical element body, a reflecting area and an optical passageway. The optical element body defines an axis of rotational symmetry. The reflecting area is disposed on the optical element body and adapted to be optically used in an exposure process. The optical passageway is arranged within the optical element body and allows light to pass the optical element body, the optical passageway being arranged eccentrically with respect to the axis of rotational symmetry.

Abstract: A catadioptric objective includes a plurality of optical elements arranged along an optical axis to image a pattern from an object field in an object surface of the objective to an image field in an image surface region of the objective at an image-side numerical aperture NA with electromagnetic radiation from a wavelength band around a central wavelength ?. The optical elements include a concave mirror and a plurality of lenses. The projection objective forms an image of the pattern in a respective Petzval surface for each wavelength ? of a wavelength band, the Petzval surfaces deviating from each other for different wavelengths. In embodiments, a longitudinal departure p of the Petzval surface at a given wavelength from a planar reference surface at an edge field point of the image field (at maximum image height y?), measured parallel to the optical axis in the image surface region, varies with the wavelength ? according to dp/d?<(0.2?/NA2)/nm.

Abstract: A method and an apparatus for determining at least one optical property of an imaging optical system which is designed to image an object disposed in an object plane of the optical system into an assigned image plane. The method includes disposing at least one test structure in the object plane of the optical system, disposing an image recording device in at least two different positions relative to the image plane of the optical system, in each of the at least two relative positions the image recording device being offset in relation to the image plane to such an extent that an image of the pupil of the optical system is produced respectively on the image recording device by the optical system by means of the test structure, and recording an image produced on the image recording device by the optical system by means of the test structure in each of the at least two relative positions by means of the image recording device.

Abstract: A measuring system for the optical measurement of an optical imaging system, which is provided to image a pattern arranged in an object surface of the imaging system in an image surface of the imaging system, comprises an object-side structure carrier having an object-side measuring structure, to be arranged on the object side of the imaging system; an image-side structure carrier having an image-side measuring structure, to be arranged on the image side of the imaging system; the object-side measuring structure and the image-side measuring structure being matched to each other in such a way that, when the object-side measuring structure is imaged onto the image-side measuring structure with the aid of the imaging system, a superposition pattern is produced; and a detector for the locally resolving acquisition of the superposition pattern. The imaging system is designed as an immersion system for imaging with the aid of an immersion liquid.

Abstract: A method of aligning at least two wave shaping elements, a method of measuring a deviation of an optical surface from a target shape and a measuring apparatus for interferometrically measuring a deviation of an optical surface from a target shape.

Abstract: A polarization-modulating optical element consisting of an optically active crystal material has a thickness profile where the thickness, as measured in the direction of the optical axis, varies over the area of the optical element. The polarization-modulating optical element has the effect that the plane of oscillation of a first linearly polarized light ray and the plane of oscillation of a second linearly polarized light ray are rotated, respectively, by a first angle of rotation and a second angle of rotation, with the first angle of rotation and the second angle of rotation being different from each other.