Patents Assigned to Cascade Microtech, Inc.
  • Patent number: 7449899
    Abstract: A high frequency probe has contact tips located within the periphery of a terminal section of a coaxial cable and shielded by a ground conductor of the coaxial cable.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: November 11, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: Richard L. Campbell, Michael Andrews, Lynh Bui
  • Patent number: 7443186
    Abstract: A test structure for characterizing integrated circuits on a wafer includes a differential cell outputting a differential mode signal in response to a differential mode input signal. The probe pads of the test structure are arrayed linearly enabling placement of the test structure in a saw street between dies.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: October 28, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: Eric Strid, Richard Campbell
  • Patent number: 7436194
    Abstract: A probe measurement system having low, stable contact resistance for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
    Type: Grant
    Filed: October 24, 2007
    Date of Patent: October 14, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: K. Reed Gleason, Tim Lesher, Eric W. Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M. E. Safwat
  • Patent number: 7436170
    Abstract: A probe station for probing a test device has a chuck element for supporting the test device. An electrically conductive outer shield enclosure at least partially encloses such chuck element to provide EMI shielding therefor. An electrically conductive inner shield enclosure is interposed between and insulated from the outer shield enclosure and the chuck element, and at least partially encloses the chuck element.
    Type: Grant
    Filed: June 20, 2007
    Date of Patent: October 14, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: Ron A. Peters, Leonard A. Hayden, Jeffrey A. Hawkins, R. Mark Dougherty
  • Patent number: 7427868
    Abstract: A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may have a rigid probing member and include a flexible interconnection between the active circuit and a support structure. The active circuit may have a relatively low capacitance as seen by the device under test.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: September 23, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: Eric Strid, K. Reed Gleason
  • Patent number: 7423419
    Abstract: A chuck for a probe station.
    Type: Grant
    Filed: October 23, 2007
    Date of Patent: September 9, 2008
    Assignee: Cascade Microtech, Inc.
    Inventor: John Dunklee
  • Patent number: 7420381
    Abstract: A test configuration for double sided probing of a device under test includes a holder to secure the device under test in a first orientation, a calibration substrate secured in a second orientation and a probe capable of calibration using the calibration substrate and probing the device under test.
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: September 2, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: Terry Burcham, Peter McCann, Rod Jones
  • Patent number: 7417446
    Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.
    Type: Grant
    Filed: October 22, 2007
    Date of Patent: August 26, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: Leonard Hayden, Scott Rumbaugh, Mike Andrews
  • Patent number: 7403025
    Abstract: A membrane probing assembly includes a probe card with conductors supported thereon, wherein the conductors include at least a signal conductor located between a pair of spaced apart guard conductors. A membrane assembly includes a membrane with contacts thereon, and supporting at least a signal conductor located between a pair of spaced apart guard conductors. The guard conductors of the probe card are electrically interconnected proximate the interconnection between the probe card and the membrane assembly. The guard conductors of the membrane assembly are electrically interconnected proximate the interconnection between the probe card and the membrane assembly.
    Type: Grant
    Filed: August 23, 2006
    Date of Patent: July 22, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: Paul A. Tervo, Kenneth R. Smith, Clarence E. Cowan, Mike P. Dauphinais, Martin J. Koxxy
  • Patent number: 7403028
    Abstract: A test structure including a differential gain cell and a differential signal probe include compensation for the Miller effect reducing the frequency dependent variability of the input impedance of the test structure.
    Type: Grant
    Filed: February 22, 2007
    Date of Patent: July 22, 2008
    Assignee: Cascade Microtech, Inc.
    Inventor: Richard Campbell
  • Patent number: 7400155
    Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.
    Type: Grant
    Filed: February 3, 2004
    Date of Patent: July 15, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
  • Patent number: 7394269
    Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
    Type: Grant
    Filed: August 3, 2007
    Date of Patent: July 1, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: K. Reed Gleason, Tim Lesher, Mike Andrews, John Martin
  • Patent number: 7368927
    Abstract: A probe head including an elastic membrane capable of exerting a restoring force when one of the surfaces of the elastic membrane is distorted. A conductive probe includes a beam having a first end and a second end, with a probe tip proximate the first end for contacting a device under test. A beam contact proximate the second end of the beam. The beam being movable to deform at least one surface of the elastic membrane.
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: May 6, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: Kenneth Smith, Michael Jolley, Victoria Van Syckel
  • Patent number: 7368925
    Abstract: A probe station for testing a device under test. A first platen supporting an electrical probe. A chuck supporting the device under test. A second platen supporting an optical probe. The first platen and the second platen positioned above the device under test. A percentage of the top surface of the second platen terminating into free space.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: May 6, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: Peter Navratil, Brad Froemke, Craig Stewart, Anthony Lord, Jeff Spencer, Scott Runbaugh, Gavin Fisher, Pete McCann, Rod Jones
  • Patent number: 7362115
    Abstract: An improved chuck assembly with lift pins. The chuck assembly may have an outer periphery and an upper surface. The lift pins may be positioned within the periphery of the chuck assembly and may be capable of relative vertical movement with respect to the upper surface of the chuck assembly.
    Type: Grant
    Filed: January 19, 2007
    Date of Patent: April 22, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: Peter Andrews, Brad Froemke, John Dunklee
  • Patent number: 7355420
    Abstract: A membrane probing assembly includes a probe card with conductors supported thereon, wherein the conductors include at least a signal conductor located between a pair of spaced apart guard conductors. A membrane assembly includes a membrane with contacts thereon, and supporting at least a signal conductor located between a pair of spaced apart guard conductors. The guard conductors of the probe card are electrically interconnected proximate the interconnection between the probe card and the membrane assembly. The guard conductors of the membrane assembly are electrically interconnected proximate the interconnection between the probe card and the membrane assembly.
    Type: Grant
    Filed: August 19, 2002
    Date of Patent: April 8, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: Kenneth Smith, Reed Gleason
  • Patent number: 7352258
    Abstract: A probe assembly including a probe, a waveguide to transmission path transition, and a bias tee detachably connected to the probe.
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: April 1, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: Mike Andrews, Leonard Hayden, John Martin
  • Patent number: 7352168
    Abstract: A chuck for a probe station.
    Type: Grant
    Filed: August 15, 2005
    Date of Patent: April 1, 2008
    Assignee: Cascade Microtech, Inc.
    Inventor: John Dunklee
  • Patent number: 7348787
    Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: March 25, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
  • Patent number: 7330041
    Abstract: Wafers or other structures comprising a plurality of dies or devices are tested at non-ambient temperatures by inducing a first heat flux through a substantial portion of a surface of the structure to modify a temperature of the structure and inducing a second heat flux through a local area of a surface of the structure, proximate the device under test, to modify the temperature the device under test.
    Type: Grant
    Filed: March 21, 2005
    Date of Patent: February 12, 2008
    Assignee: Cascade Microtech, Inc.
    Inventor: Bruce McFadden