Abstract: A high frequency probe has contact tips located within the periphery of a terminal section of a coaxial cable and shielded by a ground conductor of the coaxial cable.
Type:
Grant
Filed:
April 24, 2006
Date of Patent:
November 11, 2008
Assignee:
Cascade Microtech, Inc.
Inventors:
Richard L. Campbell, Michael Andrews, Lynh Bui
Abstract: A test structure for characterizing integrated circuits on a wafer includes a differential cell outputting a differential mode signal in response to a differential mode input signal. The probe pads of the test structure are arrayed linearly enabling placement of the test structure in a saw street between dies.
Abstract: A probe measurement system having low, stable contact resistance for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
Type:
Grant
Filed:
October 24, 2007
Date of Patent:
October 14, 2008
Assignee:
Cascade Microtech, Inc.
Inventors:
K. Reed Gleason, Tim Lesher, Eric W. Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M. E. Safwat
Abstract: A probe station for probing a test device has a chuck element for supporting the test device. An electrically conductive outer shield enclosure at least partially encloses such chuck element to provide EMI shielding therefor. An electrically conductive inner shield enclosure is interposed between and insulated from the outer shield enclosure and the chuck element, and at least partially encloses the chuck element.
Type:
Grant
Filed:
June 20, 2007
Date of Patent:
October 14, 2008
Assignee:
Cascade Microtech, Inc.
Inventors:
Ron A. Peters, Leonard A. Hayden, Jeffrey A. Hawkins, R. Mark Dougherty
Abstract: A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may have a rigid probing member and include a flexible interconnection between the active circuit and a support structure. The active circuit may have a relatively low capacitance as seen by the device under test.
Abstract: A test configuration for double sided probing of a device under test includes a holder to secure the device under test in a first orientation, a calibration substrate secured in a second orientation and a probe capable of calibration using the calibration substrate and probing the device under test.
Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.
Type:
Grant
Filed:
October 22, 2007
Date of Patent:
August 26, 2008
Assignee:
Cascade Microtech, Inc.
Inventors:
Leonard Hayden, Scott Rumbaugh, Mike Andrews
Abstract: A membrane probing assembly includes a probe card with conductors supported thereon, wherein the conductors include at least a signal conductor located between a pair of spaced apart guard conductors. A membrane assembly includes a membrane with contacts thereon, and supporting at least a signal conductor located between a pair of spaced apart guard conductors. The guard conductors of the probe card are electrically interconnected proximate the interconnection between the probe card and the membrane assembly. The guard conductors of the membrane assembly are electrically interconnected proximate the interconnection between the probe card and the membrane assembly.
Type:
Grant
Filed:
August 23, 2006
Date of Patent:
July 22, 2008
Assignee:
Cascade Microtech, Inc.
Inventors:
Paul A. Tervo, Kenneth R. Smith, Clarence E. Cowan, Mike P. Dauphinais, Martin J. Koxxy
Abstract: A test structure including a differential gain cell and a differential signal probe include compensation for the Miller effect reducing the frequency dependent variability of the input impedance of the test structure.
Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.
Type:
Grant
Filed:
February 3, 2004
Date of Patent:
July 15, 2008
Assignee:
Cascade Microtech, Inc.
Inventors:
Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
Type:
Grant
Filed:
August 3, 2007
Date of Patent:
July 1, 2008
Assignee:
Cascade Microtech, Inc.
Inventors:
K. Reed Gleason, Tim Lesher, Mike Andrews, John Martin
Abstract: A probe head including an elastic membrane capable of exerting a restoring force when one of the surfaces of the elastic membrane is distorted. A conductive probe includes a beam having a first end and a second end, with a probe tip proximate the first end for contacting a device under test. A beam contact proximate the second end of the beam. The beam being movable to deform at least one surface of the elastic membrane.
Type:
Grant
Filed:
July 5, 2005
Date of Patent:
May 6, 2008
Assignee:
Cascade Microtech, Inc.
Inventors:
Kenneth Smith, Michael Jolley, Victoria Van Syckel
Abstract: A probe station for testing a device under test. A first platen supporting an electrical probe. A chuck supporting the device under test. A second platen supporting an optical probe. The first platen and the second platen positioned above the device under test. A percentage of the top surface of the second platen terminating into free space.
Type:
Grant
Filed:
January 16, 2004
Date of Patent:
May 6, 2008
Assignee:
Cascade Microtech, Inc.
Inventors:
Peter Navratil, Brad Froemke, Craig Stewart, Anthony Lord, Jeff Spencer, Scott Runbaugh, Gavin Fisher, Pete McCann, Rod Jones
Abstract: An improved chuck assembly with lift pins. The chuck assembly may have an outer periphery and an upper surface. The lift pins may be positioned within the periphery of the chuck assembly and may be capable of relative vertical movement with respect to the upper surface of the chuck assembly.
Type:
Grant
Filed:
January 19, 2007
Date of Patent:
April 22, 2008
Assignee:
Cascade Microtech, Inc.
Inventors:
Peter Andrews, Brad Froemke, John Dunklee
Abstract: A membrane probing assembly includes a probe card with conductors supported thereon, wherein the conductors include at least a signal conductor located between a pair of spaced apart guard conductors. A membrane assembly includes a membrane with contacts thereon, and supporting at least a signal conductor located between a pair of spaced apart guard conductors. The guard conductors of the probe card are electrically interconnected proximate the interconnection between the probe card and the membrane assembly. The guard conductors of the membrane assembly are electrically interconnected proximate the interconnection between the probe card and the membrane assembly.
Abstract: A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.
Type:
Grant
Filed:
December 22, 2005
Date of Patent:
March 25, 2008
Assignee:
Cascade Microtech, Inc.
Inventors:
Warren K. Harwood, Paul A. Tervo, Martin J. Koxxy
Abstract: Wafers or other structures comprising a plurality of dies or devices are tested at non-ambient temperatures by inducing a first heat flux through a substantial portion of a surface of the structure to modify a temperature of the structure and inducing a second heat flux through a local area of a surface of the structure, proximate the device under test, to modify the temperature the device under test.