Abstract: A testing system that includes an plural imaging devices capturing plural video sequences from a single optical path and concurrently displaying the video sequences for effectively positioning a probe for testing a semiconductor wafer.

Abstract: A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test probe is displaceable via a manipulator connected to a probe holder, and a substrate carrier fixedly supports the substrate. Testing of devices, which are situated in a repeat structure on a substrate, in sequence without a substrate movement and avoiding individual manipulation of the test probes in relation to the contact islands on the devices, is achieved in that the probe holders are fastened on a shared probe holder plate and the probe holder plate is moved in relation to the test substrate.

Abstract: A method of compensating a calibration for a vector network analyzer includes performing calibrations on at least a pair of ports to determine error terms associated with each port wherein at least one of the error terms is based upon selecting the reactance of the load standard from a set of potential values in a manner such that the reference reactance errors are reduced.

Abstract: An apparatus and method for making a compliant interconnect assembly adapted to electrically couple a first circuit member to a second circuit member. The first dielectric layer has a first major surface and a plurality of through openings. A plurality of electrical traces are positioned against the first major surface of the first dielectric layer. The electric traces include a plurality of conductive compliant members having first distal ends aligned with a plurality of the openings in the first dielectric layer. The first distal ends are adapted to electrically couple with the first circuit member. The second dielectric layer has a first major surface positioned against the electric traces and the first major surface of the first dielectric layer. The second dielectric layer has a plurality of through openings through which the electric traces electrically couple with the second circuit member.

Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

Abstract: A membrane probing assembly includes a support element having an incompressible forward support tiltably coupled to a rearward base and a membrane assembly, formed of polyimide layers, with its central region interconnected to the support by an elastomeric layer. Flexible traces form data/signal lines to contacts on the central region. Each contact comprises a rigid beam and a bump located in off-centered location on the beam, which bump includes a contacting portion. After initial touchdown of these contacting portions, further over-travel of the pads causes each beam to independently tilt locally so that different portions of each beam move different distances relative to the support thus driving each contact into lateral scrubbing movement across the pad thereby clearing away oxide buildup. The elastomeric member backed by the incompressible support ensures sufficient scrub pressure and reliable tilt recovery of each contact without mechanical straining of the beam.

Abstract: In a membrane probing apparatus, the impedance of the interface between coaxial cables connected to the test instrumentation and the membrane supported co-planar waveguide that conductively connects to the probe's contacts is optimized by eliminating a ground plane in the interface board.

Abstract: A wafer probe comprises a contact conductively interconnected with the wall of a waveguide channel and supported by a substrate that projects from an end of a waveguide channel.

Abstract: A chuck includes a conductive element that contacts a device under test in a location on the chuck. The chuck includes an upper surface for supporting a device under test and a conductive element that extends through the chuck to the upper surface of the chuck. The conductive element is electrically isolated from the upper surface of the chuck, and makes electrical contact with any device under test supported by the chuck.

Abstract: A socket assembly includes a housing with a plurality of through openings that extend between opposite surfaces of the housing. First and second plurality of contact members are positioned in a plurality of the through openings. The contact members each include major beams and minor beams with proximal ends attached to a center portion, and distal ends extending away from the center portion. The major beams preferably have a length greater than the minor beams. When the first circuit member is engaged with the socket assembly the ball grid array displaces the distal ends of the major beams to create a plurality of first and second forces. The first plurality of forces generally oppose the second plurality of forces. The first and second plurality of forces also generate an engagement force that biases the first circuit member toward the housing. The minor beams on the first and second plurality of contact members do not contribute to the engagement force.

Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

Abstract: A probe measurement system comprises a probe with a linear array of probe tips enabling a single probe to be used when probing a test structure with a differential signal

Abstract: A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may include a flexible interconnection between the active circuit and a support structure. The probe may impose a relatively low capacitance on the device under test.

Abstract: The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.

Abstract: A test structure including a differential gain cell and a differential signal probe include compensation for the Miller effect reducing the frequency dependent variability of the input impedance of the test structure.

Abstract: A method of probing an electrical device using a membrane probing system having an improved contact. A membrane probe forms a contact having a ridge with a pair of inclined surfaces defining an acute angle such that, when pressed into an electrical pad of a device to be tested, the ridge penetrates into the electrical pad, shearing away any oxide on the surface of the pad. The device may then be tested.

Abstract: A probe measurement system comprises a probe with a linear array of probe tips enabling a single probe to be used when probing a test structure with a differential signal.

Abstract: The present invention relates to a method of assembling a probe for testing of integrated circuits or other microelectronic devices.

Abstract: A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may include a flexible interconnection between the active circuit and a support structure. The probe may impose a relatively low capacitance on the device under test.

Abstract: A test structure including a differential gain cell and a differential signal probe include compensation for the Miller effect reducing the frequency dependent variability of the input impedance of the test structure.