Abstract: Disclosed are methods of making a dielectric on a metal foil, and a method of making a large area capacitor that includes a dielectric on a metal foil. A first dielectric layer is formed over the metal foil by physical vapor deposition, and a dielectric precursor layer is formed over the first dielectric layer by chemical solution deposition. The metal foil, first dielectric layer and dielectric precursor layer are prefired at a prefiring temperature in the range of 350 to 650° C. The prefired dielectric precursor layer, the first dielectric layer and the base metal foil are subsequently fired at a firing temperature in the range of 700 to 1200° C.
Type:
Grant
Filed:
September 25, 2008
Date of Patent:
November 4, 2014
Assignee:
CDA Processing Limited Liability Company
Inventors:
Seigi Suh, Esther Kim, William J. Borland, Christopher Allen Gross, Omega N. Mack, Timothy R. Overcash
Abstract: A printed wiring board semiconductor package or PWB power core comprising singulated capacitors embedded on multiple layers of the printed wiring board semiconductor package wherein at least a part of each embedded capacitor lies within the die shadow and wherein the embedded, singulated capacitors comprise at least a first electrode and a second electrode. The first electrodes and second electrodes of the embedded singulated capacitors are interconnected to the Vcc (power) terminals and the Vss (ground) terminals respectively of a semiconductor device. The size of the embedded capacitors are varied to produce different self-resonant frequencies and their vertical placements within the PWB semiconductor package are used to control the inherent inductance of the capacitor-semiconductor electrical interconnections so that customized resonant frequencies of the embedded capacitors can be achieved with low impedance.
Type:
Grant
Filed:
December 3, 2007
Date of Patent:
October 22, 2013
Assignee:
CDA Processing Limited Liability Company
Inventors:
Daniel Irwin Amey, Jr., William J. Borland
Abstract: Methods for fabricating a capacitor are provided. In the methods, a dielectric may be formed on a metal (e.g. nickel) substrate, and a copper electrode is formed thereon, followed by the thinning of the metal substrate from its non-coated face, and subsequently forming a copper electrode on the thinned, non-coated face of the substrate.
Type:
Grant
Filed:
December 16, 2011
Date of Patent:
March 19, 2013
Assignee:
CDA Processing Limited Liability Company
Inventors:
Juan Carlos Figueroa, Damien Francis Reardon
Abstract: This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.
Type:
Grant
Filed:
June 18, 2008
Date of Patent:
January 22, 2013
Assignee:
CDA Processing Limited Liability Company
Abstract: This disclosure relates to compositions and methods for using such compositions to provide protective coatings, particularly of electronic components. Fired-on-foil ceramic capacitors coated with a polybenzoxazole encapsulant which may be embedded in printed wiring boards are disclosed.
Type:
Grant
Filed:
December 4, 2007
Date of Patent:
September 18, 2012
Assignee:
CDA Processing Limited Liability Company
Inventors:
Thomas Eugene Dueber, Frank Leonard Schadt, III, John D. Summers
Abstract: This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns a fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.
Type:
Grant
Filed:
December 11, 2007
Date of Patent:
July 31, 2012
Assignee:
CDA Processing Limited Liability Company
Abstract: A method of making dense dielectrics layers via chemical solution deposition by adding inorganic glass fluxed material to high dielectric constant compositions, depositing the resultant mixture onto a substrate and annealing the substrate at temperatures between the softening point of the inorganic glass flux and the melting point of the substrate. A method of making a capacitor comprising a dense dielectric layer.
Type:
Grant
Filed:
June 15, 2006
Date of Patent:
May 22, 2012
Assignee:
CDA Processing Limited Liability Company
Inventors:
William J. Borland, Seigi Suh, Jon-Paul Maria, Jon Fredrick Ihlefeld, Ian Burn