Abstract: A photocurable composition which has excellent storage stability and is cured rapidly in bonding an opaque material, and a product. The photocurable composition contains (A) a compound having an unsaturated double bond, (B) at least one compound selected from the group consisting of compounds represented by the general formulae (1), (2), and (3), and (C) a sensitizer. In the general formulae (1), (2), and (3), R1 to R3 are each independently a substituent containing at least one group selected from the group consisting of a nitro group, a cyano group, a hydroxy group, an acetyl group, a carbonyl group, a substituted or unsubstituted allyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkoxy group, an unsubstituted or substituted aryl group, an unsubstituted or substituted aryloxy group, a heterocyclic ring structure-containing group, and a group having a plurality of rings.

Abstract: Provided is a curable composition which forms a cured product that has excellent fireproof performance, while having excellent shape retainability even in cases where the expansion ratio of the cured product after firing is set to a high value. This curable composition includes a shape retention agent, while having fluidity when applied; and if a cured product that is obtained by curing this curable composition is fired in 600° C. air atmosphere for 30 minutes, the cured product after firing has shape retainability.

Abstract: Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.

Abstract: Provided are: a structure adhesive composition which exhibits favorable thread breakage and improves shower resistance, and prevents stringiness when stitch-coating is performed; a method for producing a vehicle structure using the same; and a vehicle structure. A structure adhesive composition exhibiting favorable thread breakage, the structure adhesive composition being a structure adhesive composition containing no liquid rubber component, the structure adhesive composition contains: (A) an epoxy resin in which rubber particles are dispersed as primary particles; and (B) an epoxy resin latent curing agent; a compounded proportion of the rubber particles in the structure adhesive composition is from 10 to 45 mass %; and a viscosity at 50° C. of the structure adhesive composition is from 190 to 380 (Pa·s) when a shearing speed is 5 (sec?1) and is from 1 to 30 (Pa·s) when the shearing speed is 200 (sec?1).

Abstract: Provided are a photocurable composition which has excellent storage stability and is cured rapidly in bonding an opaque material, and a product. The photocurable composition contains (A) a compound having an unsaturated double bond, (B) at least one compound selected from the group consisting of compounds represented by the general formulae (1), (2), and (3), and (C) a sensitizer. In the general formulae (1), (2), and (3), R1 to R3 are each independently a substituent containing at least one group selected from the group consisting of a nitro group, a cyano group, a hydroxy group, an acetyl group, a carbonyl group, a substituted or unsubstituted allyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkoxy group, an unsubstituted or substituted aryl group, an unsubstituted or substituted aryloxy group, a heterocyclic ring structure-containing group, and a group having a plurality of rings.

Abstract: Provided are: a structure adhesive composition which exhibits favorable thread breakage and improves shower resistance, and prevents stringiness when stitch-coating is performed; a method for producing a vehicle structure using the same; and a vehicle structure. A structure adhesive composition exhibiting favorable thread breakage, the structure adhesive composition being a structure adhesive composition containing no liquid rubber component, the structure adhesive composition contains: (A) an epoxy resin in which rubber particles are dispersed as primary particles; and (B) an epoxy resin latent curing agent; a compounded proportion of the rubber particles in the structure adhesive composition is from 10 to 45 mass %; and a viscosity at 50° C. of the structure adhesive composition is from 190 to 380 (Pa·s) when a shearing speed is 5 (sec?1) and is from 1 to 30 (Pa·s) when the shearing speed is 200 (sec?1).

Abstract: Provided are a photocurable composition which has excellent storage stability and is cured rapidly in bonding an opaque material, and a product. The photocurable composition contains (A) a compound having an unsaturated double bond, (B) at least one compound selected from the group consisting of compounds represented by the general formulae (1), (2), and (3), and (C) a sensitizer. In the general formulae (1), (2), and (3), R1 to R3 are each independently a substituent containing at least one group selected from the group consisting of a nitro group, a cyano group, a hydroxy group, an acetyl group, a carbonyl group, a substituted or unsubstituted allyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkoxy group, an unsubstituted or substituted aryl group, an unsubstituted or substituted aryloxy group, a heterocyclic ring structure-containing group, and a group having a plurality of rings.

Abstract: Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.

Abstract: Provided is a novel curable composition that is a two-pack type curable composition that includes an epoxy resin and a crosslinkable silicon group-containing organic polymer, excels in storage stability, and does not experience curing delays, an increase in viscosity of the base material, or the deterioration of the base material such as gelation or the deposition of insoluble material. Also provided is a novel curable composition that excels in storage stability even when water is added to improve deep portion curability. A two-pack type epoxy composition according to the present invention contains: a base material that includes (A) an epoxy resin, (B) a compound having an Si—F bond, and (C) an alkoxysilane not having at least one group selected from the group consisting of a primary amino group, a secondary amino group, and a mercapto group; and a curing agent that includes (D) a crosslinkable silicon group-containing organic polymer, and (E) a tertiary amine compound.

Abstract: Provided is a method of producing a pressure-sensitive adhesive containing a cured product of a curable composition containing a crosslinkable silicon group-containing organic polymer and an adhesion-imparting resin as a pressure-sensitive adhesive layer; curing of the curable composition does not proceed when heated during production, i.e., the curable composition has excellent stability when heated, and the crosslinking reaction of the curable composition proceeds by some sort of trigger. The pressure-sensitive adhesive contains, as a pressure-sensitive adhesive layer, a cured product of a curable composition containing (A) a crosslinkable silicon group-containing organic polymer, (B) an adhesion-imparting resin, (C) a Si—F bond-containing silicon compound, and (D) a photobase generator.

Abstract: Provided is a curable composition which forms a cured product that has excellent fireproof performance, while having excellent shape retainability even in cases where the expansion ratio of the cured product after firing is set to a high value. This curable composition includes a shape retention agent, while having fluidity when applied; and if a cured product that is obtained by curing this curable composition is fired in 600° C. air atmosphere for 30 minutes, the cured product after firing has shape retainability.

Abstract: Provided is a one-part water-based adhesive composition which suffers no yellowing and is excellent in adhesiveness and durability. The one-part water-based adhesive composition includes (A) an aqueous dispersion of a polyurethane resin and (B) a silane compound obtained by reacting a specific epoxysilane compound with an aminosilane compound represented by the following Formula (2), the amount of the epoxysilane compound being in the range of 1.5 to 10 mol per 1 mol of the aminosilane compound, at a reaction temperature of 40 to 100° C. (In Formula (2), R7 to R12 are each a hydrogen atom or an alkyl group, R13 is a monovalent hydrocarbon group, R14 is an alkyl group, and b is 0 or 1.

Abstract: Provided are: a structure adhesive composition which changes color when heat-cured; a method for producing a vehicle structure using the same; and a vehicle structure. The structure adhesive composition which changes color when heat-cured is a structure adhesive composition including: (A) an epoxy resin; (B) an epoxy resin latent curing agent; and (C) a monoazo pigment, wherein a compounded proportion of the monoazo pigment in the structure adhesive composition constitutes 0.01-10 mass %. It is preferable for the structure adhesive composition to also contain (D) a curing accelerator.

Abstract: Provided is a novel curable composition that is a two-pack type curable composition that includes an epoxy resin and a crosslinkable silicon group-containing organic polymer, excels in storage stability, and does not experience curing delays, an increase in viscosity of the base material, or the deterioration of the base material such as gelation or the deposition of insoluble material. Also provided is a novel curable composition that excels in storage stability even when water is added to improve deep portion curability. A two-pack type epoxy composition according to the present invention contains: a base material that includes (A) an epoxy resin, (B) a compound having an Si—F bond, and (C) an alkoxysilane not having at least one group selected from the group consisting of a primary amino group, a secondary amino group, and a mercapto group; and a curing agent that includes (D) a crosslinkable silicon group-containing organic polymer, and (E) a tertiary amine compound.

Abstract: Provided is a method of producing a pressure-sensitive adhesive containing a cured product of a curable composition containing a crosslinkable silicon group-containing organic polymer and an adhesion-imparting resin as a pressure-sensitive adhesive layer; curing of the curable composition does not proceed when heated during production, i.e., the curable composition has excellent stability when heated, and the crosslinking reaction of the curable composition proceeds by some sort of trigger. The pressure-sensitive adhesive contains, as a pressure-sensitive adhesive layer, a cured product of a curable composition containing (A) a crosslinkable silicon group-containing organic polymer, (B) an adhesion-imparting resin, (C) a Si—F bond-containing silicon compound, and (D) a photobase generator.

Abstract: Provided is a curable composition which realizes compatibility between curability and toughness, shows rapid curability and excellent storage stability, and does not require any tin catalyst. The curable composition comprises: (A) a vinyl-based resin obtained by causing a compound (I) represented by the following general formula (1) and a compound (II) represented by the following general formula (2) to react with each other; (B) a urethane-based resin obtained by causing a hydroxyl group-containing organic polymer, a polyisocyanate compound, a compound (III) represented by the following general formula (3), and an amine compound to react with one another; and (C) a curing catalyst.

Abstract: The present invention provides a curable composition containing an organic polymer having a crosslinkable silicon group, the composition having sufficient usable life and having adhesive properties with respect to an adherend (substrate) that are equivalent to those of the case where aminosilane is included. The composition comprises: (A) a crosslinkable silicon group-containing organic polymer; and (B) a crosslinkable silicon group-containing compound that forms, by means of light, at least one type of amino group selected from the group consisting of primary amino groups and secondary amino groups. The crosslinkable silicon group-containing organic polymer (A) is preferably at least one type selected from the group consisting of crosslinkable silicon group-containing polyoxyalkylene polymers and crosslinkable silicon group-containing (meth)acrylic-based polymers.

Abstract: The present invention provides a curable composition containing an organic polymer having a crosslinkable silicon group, the composition having sufficient usable life and having adhesive properties with respect to an adherend (substrate) that are equivalent to those of the case where aminosilane is included. The composition comprises: (A) a crosslinkable silicon group-containing organic polymer; and (B) a crosslinkable silicon group-containing compound that forms, by means of light, at least one type of amino group selected from the group consisting of primary amino groups and secondary amino groups. The crosslinkable silicon group-containing organic polymer (A) is preferably at least one type selected from the group consisting of crosslinkable silicon group-containing polyoxyalkylene polymers and crosslinkable silicon group-containing (meth)acrylic-based polymers.

Abstract: Disclosed is a curable composition including an organic polymer containing a crosslinkable silyl group, an ultraviolet ray absorbing agent having a triazine skeleton and a hindered amine based light stabilizer. The composition exhibits improved weather resistance in a thin layer and thick layer portion. Further, disclosed is a curable composition including an organic polymer containing a crosslinkable silyl group, a (meth)acrylic polymer containing an epoxy group, a divalent tin organic carboxylate and an organic amine compound. The composition exhibits excellent properties. Also, disclosed is a curable composition and sealing material including a reactive organic polymer containing at least one crosslinkable silyl group in one molecule thereof, a reactive organic polymer containing less than one crosslinkable silyl group in one molecule thereof, and thermally expandable hollow spheres. The composition has good physical properties. Also, disclosed is a fire-resistant structure forming method.

Abstract: Disclosed herein is a curable composition excellent in workability, adhesion properties, rubber-like properties, storage stability, and quick curability. The curable composition comprises (A) a crosslinkable silyl group-containing organic polymer and (B) a (meth)acrylic polymer obtained by polymerizing a (meth)acrylic monomer having a polymerizable unsaturated bond in the presence of a metallocene compound and a crosslinkable silyl group-containing thiol compound, at least one end of the (meth)acrylic polymer being bonded to a residue, —S—R3 (where R3 represents a group having a crosslinkable silyl group) obtained by removing a hydrogen atom from the crosslinkable silyl group-containing thiol compound.