Abstract: Calcitic and/or siliceous architectural and construction materials are provided with increased resistance to damage from water, oil, grease and weather by a process which comprises treating said materials with an aqueous composition containing: (A) from about 0.1 to 4% by weight on a 100% solids basis of an aqueous solution or self-dispersed emulsion or dispersion of a copolymer which is a reaction product of monomers containing fluorinated groups, cationic groups and nonionic groups, (B) an effective amount of a penetration assistant, and (C) water to make up 100%.

Abstract: A method of producing a curable prepreg which comprises (i) sandwiching a multi-ply fabric layer comprising at least two superposed sheets of woven reinforcing fabric between solid films of a curable resin composition and (ii) heating the resulting sandwich under pressure so that the resin composition impregnates the sheets of woven reinforcing fabric to form a coherent curable structure.

Abstract: 1. A reactive resin composition, which is a fusible, solid optionally foamable, heat curable, epoxy functional reaction prouct with a Kofler Heat Bank melting point of not less than 55.degree. C., formed by mixing together(A) epoxy resins of epoxy group containing compounds(B) an amine solidifying system present in insufficient quantities to cause gelation after all the amino hydrogen atoms are consumed by epoxy groups, under the reaction conditions chosen for (A) and (B), and which yields a product with a Kofler Heat Bank melting point of greater than 55.degree. C. and less than 120.degree. C.

Abstract: An apparatus for the treatment of flat-form material, especially of coated printed circuit boards, wherein the printed circuit boards are subjected to various treatment processes in succession, such as airflow treatment, drying, and cooling, while they are being transported through a housing in which treatment processes are carried out, there are provided in the housing, for the purpose controlling of the process and increasing the adaptability of the treatment installation, individual treatment zones separate from one another, and the printed circuit boards are conveyed into the individual treatment zones in groups, a separate treatment process being carried out in each treatment zone.

Abstract: A powder coating composition comprising(A) a solid epoxy resin mixture that comprises at least one epoxy resin component (A1) and one epoxy resin component (A2) and(B) a free-carboxyl-group-containing polyester in an amount sufficient for the full cure of the composition,in which the epoxy resin component (A1) consists of one or more epoxy resins and has overall a mean epoxy functionality that is greater than 2,wherein the epoxy resin component (A2) consists of one or more advanced epoxy resins each of which has a mean epoxy functionality of at least 1.2 but less than 1.95 and is the product of a reaction in which (i) at least one diglycidyl compound is simultaneously reacted with (ii) at least one bisphenol compound and (iii) at least one monophenol as starting materials, and the difference between the mean epoxy functionality of the epoxy resin mixture (A) and the mean epoxy functionality of component (A2) of the mixture is at least 0.05 but less than 0.8.

Abstract: The present invention is directed to a transport apparatus for thin, board-shaped substrates, for example printed circuit boards, which are conveyed through a coating installation and the like. In order to simplify manipulation during conveying, there is provided a frame (1) for holding a substrate (7), tensioning elements (4) being arranged spaced from one another on frame members (2), lying opposite one another, of the frame (1), which tensioning elements (4) engage the edge of the substrate and tension the substrate, the frame (1) being provided with a device (16) which serves to provide connection to a conveyor belt or the like. The tension springs (4) exert a tension away from the substrate (7) in the direction of the plane of the thin substrate to avoid sagging of the substrate. FIG. (1) illustrates the transport apparatus.

Abstract: Curable suspensions of an epoxy resin formulation comprisinga) a storage-stable suspension of an epoxy resin and a toughener suspended therein which contains no groups that react with a curable epoxy resin system,b) dicyandiamide, a polycarboxylic acid, a polycarboxylic anhydride, a polyamine, a polyaminoamide, an amino group-containing adduct of an amine and a polyepoxide, a polyol or a catalytically curing hardener, and, as optional components,c) a curing catalyst, conventional fillers or reinforcing materials,are particularly suitable for use as casting resins, laminating resins or adhesives.

Abstract: A curable composition consisting of at least 2 components (a) and (b), wherein(a) is a liquid oligomer or polymer having a molecular weight of 200-50,000 and containing dicarboxylic anhydride groups, and(b) is a compound of formula I ##STR1## wherein A is linear or branched C.sub.2 -C.sub.20 alkylene, C.sub.5 -C.sub.7 cycloalkylene, C.sub.7 -C.sub.10 bicycloalkylene, or C.sub.1 -C.sub.30 alkylene containing one or more than one C.sub.5 -C.sub.7 cycloalkylene group or C.sub.7 -C.sub.30 bicycloalkylene group in the main or side chain, which cycloalkylene and bicycloalkylene groups can be unsubstituted or substituted by one or several C.sub.1 -C.sub.6 alkyl groups, and R.sub.1 and R.sub.2 are independently of each other C.sub.1 -C.sub.18 alkyl, C.sub.4 -C.sub.10 cycloalkyl or C.sub.7 -C.sub.24 -aralkyl, which cycloalkyl and aralkyl groups can be unsubstituted or substituted by one or more than one C.sub.1 -C.sub.

Abstract: A process for impregnating an electrical coil which comprises a winding comprising two or more layers consisting of more than one turn of an electrically conducting wire-form material with a polymer material which electrically insulates the individual turns of the wire-form material from one another with the aid of a thermally curable epoxy resin composition, which composition is solid at room temperature and comprises the following constituents:(a) an epoxy resin which is solid at room temperature, selected from(a1) polyglycidyl ethers based on novolaks;(a2) diglycidyl ethers based on bisphenols, and(a3) mixtures of more than one of components (a1) and (a2);(b) a crosslinking agent for component (a);(c) a suitable accelerator for the reaction of component (a) and component (b);(d) from 15 to 70 percent by weight, based on the overall weight of the composition, of filler selected from(d1) calcium carbonate,(d2) quartz flour,(d3) wollastonite whose particles have an average ratio of length to cross-section whi

Abstract: Epoxy resins which are obtainable by a process in which, first of all(a) by reacting(A1) at least one substance selected from the substances of the formula (I) and of the formula (II): ##STR1## in which Alc is the radical of a diol which has been freed fromI ts hydroxyl groups and comprises 2 to 20 carbon atoms,Ac is the radical of a dicarboxylic acid which has been freed from its carboxyl groups and comprises 2 to 20 carbon atoms,[Ph] is the radical of a difunctional phenolic compound which has been freed from its phenolic hydroxyl groups and has 6 to 20 carbon atoms, andc is a number greater than 1 but not more than 2, with(A2) at least one liquid diglycidyl ether based on a first bisphenol compound in an amount chosen so that there are more than two equivalents of glycidyl groups of component (A2) for a total of one equivalent of carboxyl and phenolic hydroxyl groups of component (A1),a pre-advanced diglycidyl ether resin is formed in dispersion in the liquid diglycidyl ether of which there is at least one

Abstract: A composition, comprising(a) a Diels-Alder-adduct of cyclopentadiene,(b) a catalyst for the ring-opening metathesis polymerisation, and(c) 2-95% by weight of a filler, based on the entire composition,the filler containing at least 0.5% by weight of a basic adsorbent, based on the entire composition,gives cured products having excellent mechanical and electrical properties and is particularly suitable as coating material for electrical and electronic components.

Abstract: The present invention relates to a process for the production of three-dimensional articles by stereolithography using a radiation-curable composition having at least one cationically polymerizable compound and/or at least one free radical polymerizable compound, at least one filler material and at least one photoinitiator for cationic and/or radical polymerization. An organic viscosity stabilizer material is brought into contact with the composition to substantially delay or prevent undesirable viscosity increase and subsequently premature polymerization. A filler material is added to the composition in an effective amount to at least delay or prevent a significant increase in viscosity and polymerization.

Abstract: The present invention relates to novel resin compositions containing at least one solid or liquid actinic radiation-curable and cationically polymerizable organic substance, an actinic radiation-sensitive initiator for cationic polymerization, an actinic radiation-curable and radical-polymerizable organic substance and an actinic radiation-sensitive initiator for radical polymerization. The actinic radiation-curable and cationically polymerizable organic substance is at least one glycidylether of a polyhydric aliphatic, alicyclic or aromatic alcohol having at least three epoxy groups with epoxy equivalent weight between 90 and 800 grams per equivalent, at least one solid or liquid alicyclic epoxide with an epoxy equivalent weight between 90 and 330 grams per equivalent having at least two epoxy groups and monomer purity greater than about 90% by weight, or at least a solid or liquid epoxycresol novolac or epoxyphenol novolac having epoxy equivalent weight between 130 and 350, or mixtures thereof.

Abstract: A method for the reactive coating or reactive encapsulation of fluidizable, organic or inorganic, anisotropic or isotropic substrates with a cross-linking, thermostable and insoluble thermoset by spraying onto substrates a cationically curing one-pot liquid resin system comprising a cationic initiator, which method comprises fluidizing the substrates in a fluidized-bed coater at a temperature above the activation temperature of the cationic initiator and then injecting the one-pot liquid resin system into the fluidized-bed coater through a spraying device, the one-pot liquid resin system having a gelling time of from 1 to 60 seconds at from 100 to 150.degree. C., results in unagglomerated substrates having a cross-linked, thermostable and homogeneous coating.

Abstract: Curable compositions, which comprise the following components:(A) a polymer component consisting of one or more than one of the following components:polymers based on acrylate monomers and/or methacrylate monomers containing free carboxyl groups, and carboxyl-terminated polyesters;(B) a crosslinker for component (A) selected from the group consisting of:(B1) one or more than one compound having a molecular weight of less than 800 and containing at least two (2-oxo-1,3-dioxolan-4-yl)methyl groups per molecule, and(B2) a mixture consisting of one or more than one compound having a molecular weight of less than 800 and containing at least two (2-oxo-1,3-dioxolan-4-yl)methyl groups per molecule, and of one or more than one epoxy resin, at least 60 percent of the total number of (2-oxo-1,3-dioxolan-4-yl)methyl groups and epoxy groups of the mixture being (2-oxo-1,3-dioxolan-4-yl)methyl groups;(C) a catalyst for accelerating the crosslinking reaction between the components (A) and (B), and(D) a solvent for the comp

Abstract: The present invention relates to adhesive compositions comprising at least one light emitting material and which are suitable for bonding substrates together and may be detected and measured via non-invasive techniques.

Abstract: A photosensitive composition which is liquid at room temperature and which comprisesa) 18 to 22% by weight of a binder polymer based on a styrene-maleic anhydride halfester copolymer,b) 10 to 15% by weight of at least one photocurable acrylate compound,c) 0.1 to 10% by weight of a photoinitiator, andd) 45 to 70% by weight of a propylene glycol halfester or propylene glycol halfester, the sum of the components a) to d) being 100% by weight,is suitable for the production of photostructured objects, preferably for the production of telephone cards.

Abstract: An apparatus for the coating of flat-form substrates, especially of printed circuit boards, solder masks and the like, wherein there is arranged between two coating stations a turning station for the printed circuit boards, which are conveyed on a transporter pathway through the coating stations and the turning station, wherein in the turning station (4) there are provided in the same plane as the incoming transporter pathway (2) receiving elements (5) located, spaced apart, opposite one another, which enter into engagement with the edge of a printed circuit board (11) or a holding element attached to the printed circuit board, it being possible to pivot those receiving elements (5) through 180.degree. so that, when the printed circuit board is discharged, they again lie in the plane of the onwards-leading transporter pathway (2').

Abstract: A multi-pack system which comprises two or more components which react together to form a thermosetting resin characterised in that one of the components contains up to 0.01% by weight of a pH indicator.

Abstract: The present invention provides pourable curable composition which comprises the product obtained by mixing (a) a liquid epoxy resin containing a sufficient amount of a thixotropic agent to induce thixotropic properties with (b) a hardener composition which contains a tertiary amine compound in an amount sufficient to at least cause the mixture to become pourable after mixing.