Abstract: The present invention provides a coating composition comprising one or more curable resins which contain, among the resins, free acrylic moieties and free or reacted epoxy moieties, and a ketone blocked polyamine type curing agent, the ingredients being chosen to provide in the coating after curing, more than 50% by weight of cured epoxy groups and less than 50% by weight of cured acrylic groups.

Abstract: Heterogeneous photoinitiator in microparticle form, which consists of a finely divided substrate material to which identical or different photoinitiators are covalently bonded. The photoinitiators are suitable for the radiation-induced polymerization of photopolymerizable or photocrosslinkable monomers for the production of moldings, protective coats and relief images.

Abstract: A composition, which comprises (a) a cycloaliphatic epoxy resin,(b) an OH-terminated polysiloxane,(c) a polysiloxane/polyether copolymer, and(d) a cyclic polysiloxane,has excellent hydrophobic properties and can be used as electric insulation composition.

Abstract: The claimed invention relates to a method for coating a substrate, preferably a printed circuit board, comprising the step of applying to said substrate surface a photopolymerizable water-borne aqueous-alkaline developable coating composition. The novel composition comprises a certain film-forming, acid group-containing acrylated derivative of an epoxy resin which is sufficiently neutralized with ammonia or an amine or an inorganic base to promote the formation of the corresponding ammonium or amine or inorganic base carboxylates by a neutralization reaction; a photoinitiator; water; and, optional components; as well as one or more additional optional (meth)acrylate monomer or (meth)acrylate oligomer or a vinyl compound that can be crosslinked with light. The method produces coated substrates that are non-tacky after drying and that have good edge coverage.

Abstract: Compounds of formulae (Ia) and (Ib) ##STR1## wherein the substituents R.sub.1 are each independently of the other hydrogen or methyl, R.sub.2 is an unsubstituted C.sub.1 -C.sub.20 alkyl group or a C.sub.1 -C.sub.20 alkyl group which is substituted by one or more than one substituent selected from the group consisting of hydroxy, C.sub.6 -C.sub.14 aryl and halogen, an unsubstituted phenyl group or a phenyl group which is substituted by one or more than one substituent selected from the group consisting of C.sub.1 -C.sub.6 alkyl, hydroxy or halogen, or is a radical of formula --CH.sub.2 --OR.sub.3, wherein R.sub.3 is an unsubstituted C.sub.1 -C.sub.20 alkyl group or a C.sub.1 -C.sub.20 alkyl group which is substituted by one or more than one substituent selected from the group consisting of hydroxy, C.sub.6 -C.sub.14 aryl and halogen, an unsubstituted phenyl group or a phenyl group which is substituted by one or more than one substituent selected from the group consisting of C.sub.1 -C.sub.

Abstract: Core/shell particles comprising a core comprising an elastomer having a T.sub.G value of <0.degree. C., onto which a shell of a crosslinked copolymer is grafted, where the proportion of the crosslinking component in the copolymer of the shell is from greater than 5 to 90% by weight, based on the total amount of the comonomers of the shell copolymer, are suitable as toughening agents for epoxy resins, with which they have good compatibility.

Abstract: Compositions for the simultaneous retanning and fatliquoring of leather are described which may include further leather treatment agents as well.

Abstract: A casting device with which, by introducing a thermocurable plastics into a heatable casting mould (1), the plastics is thermally cum in that casting mould at least to such a degree that a casting moulded in that manner can be released from the mould, comprises a reservoir for the thermocurable plastics and a feed means for feeding plastics from the reservoir into the casting mould (1), which mould has an inlet opening that extends at least along a substantial portion of the length of the casting to be moulded, wherein the casting device comprises a separate adapter (2) in which the feed means (20, 221, 23) for the plastics is arranged and which can be connected to the casting mould (1) in such a manner that, when the adapter (2) has been connected, an outlet opening (23) provided in the adapter (2) is arranged sealed to and substantially congruent with the inlet opening of the casting mould (1).

Abstract: Epoxy resin casting compositions comprising(a) a liquid aromatic glycidyl or .beta.-methylglycidyl ether or a liquid mixture of several aromatic glycidyl or .beta.-methylglycidyl ethers containing on average more than one glycidyl ether group per molecule,(b) one or more than one acid hardener for the glycidyl ether,(c) a curing accelerator,(d) a filler mixture containing calcite and wollastonite in an amount from 40 to 60% by weight, based on components (a), (b) and (d), and as optional components,(e) customary additives for epoxy resin casting compositions are suitable in particular for coating or encapsulating electrical or electronic components and, more particularly, electrical ignition coils.

Abstract: A curable epoxy resin mixture consisting ofa) 90 to 100% by weight of an aromatic glycidyl ether compound containing more than one glycidyl ether group in the molecule and 0 to 10% by weight of an epoxy resin other than aromatic polyglycidyl ethers, the sum of the epoxy resins being 100% by weight,b) 60 to 100% by weight of a polyoxyalkylenediamine or polyoxyalkylenetriamine and 0 to 40% by weight of a curing agent other than polyoxyalkyleneamines, the sum of the curing agents being 100% by weight,c) wollastonite or an inorganic filler containing more than 50% by weight of wollastonite, based on the total amount of the inorganic filler and, optionally,d) a curing accelerator, ande) glass fibres or customary additives for casting resins based on epoxy resins, is particularly suitable as casting resin composition for encapsulating, or casting in of, electrical or electronic components.

Abstract: A composition, comprising(a) at least one tight cycloolefin,(b) a catalyst for the ring-opening metathesis polymerisation,(c) a filler, and(d) a silane of formula I ##STR1## wherein R is a polyvalent organic group having 2 to 100 carbon atoms, where one or more than one carbon atom can be replaced by O, S, N or Si atoms and Y.sub.1, Y.sub.2 and Y.sub.3 are each independently of one another C.sub.1 -C.sub.20 alkyl, C.sub.5 -C.sub.20 aryl, C.sub.6 -C.sub.20 aralkyl, C.sub.5 -C.sub.12 cycloalkyl, C.sub.2 -C.sub.20 -alkoxyalkyl or C.sub.1 -C.sub.20 acyl, gives cured products having excellent mechanical and electrical properties and which is particularly suitable as encapsulating material for electrical and electronic components.

Abstract: 1. A solid composition comprising(a) a solid oligomeric, cationically polymerisable polyglycidyl ether or polyglycidyl ester, a mixture of a solid oligomeric, cationically polymerisable polyglycidyl ether or polyglycidyl ester and a liquid or crystalline monomeric mono-, di- or polyepoxy resin, or a mixture of a solid oligomeric, cationically polymerisable polyglycidyl ether or polyglycidyl ester and a cyclic acetal, said oligomeric polyglycidyl ether or polyglycidyl ester and the mixtures containing the oligomeric polyglycidyl ether or polyglycidyl ester having a glass transition temperature (T.sub.G) higher than 35.degree. C.,(b) a multifunctional nucleophilic chain transfer agent,(c) 0.

Abstract: A catalyst system for the ring-opening matathesis polymerization, which consists of at least two components (a) and (b), wherein(a) is a ruthenium compound of formula I or IIRuX.sub.2 (L.sub.1).sub.m (L.sub.2).sub.n (L.sub.3).sub.o (L.sub.4).sub.p (I),ARuX.sub.2 (L.sub.1).sub.r L.sub.2).sub.3 (II),wherein L.sub.1,L.sub.2, L.sub.3 and L.sub.4 are each independently of the other C.sub.1 -C.sub.18 alkylcyanide, C.sub.6 -C.sub.24 - aralkylcyanide, tertiary amine, tertiary phosphine which does not contain any secondary alkyl or cycloalkyl radicals bound to the phosphorus atom, or phosphite, X is halogen, A is arene, m, n, o and p are integers from 0 to 4, where 2.ltoreq.m+n+o+p.ltoreq.4, r and s are integers from 0 to 2, where 1.ltoreq.r+s.ltoreq.2, and(b) is a tertiary phosphine containing at least one secondary alkyl radical or cycloalkyl radical bound to the phosphorus atom,is particularly suitable for the polymerisation of strained cycloolefins by the RIM process.

Abstract: Reaction products of a microgel that contains carboxylic acid groups with a nitrogen-containing base have a high latency and high stability towards mechanical influences and are suitable as hardeners for one-component epoxy resin systems.

Abstract: The present invention relates to a process for the stereolithographic preparation of a three-dimensional object, wherein the object is built in a container which contains a radiation-curable liquid formulation with fillers by a repeated alternating succession of process steps (a) and (b). In step (a), a layer of the radiation-curable liquid formulation, one limitation of which is the surface of the formulation, is cured using suitable radiation within an surface area which corresponds to the desired cross-section of the three-dimensional object to be formed at the level of this layer. In step (b), said cured layer is coated with a new layer of the radiation-curable liquid formulation. The process comprises homogenizing the radiation-curable liquid formulation continuously or discontinuously to such an extent that there is no noticeable change in the filler content of the radiation-curable liquid formulation in the area of that layer with which the cured layer is coated in step (b).

Abstract: A liquid, radiation-curable composition which in addition to a liquid, free-radically polymerizable component comprises at least the following additional components: (A) from 40 to 80 percent by weight of a liquid difunctional or more highly functional epoxy resin or of a liquid mixture consisting of difunctional or more highly functional epoxy resins; (B) from 0.1 to 10 percent by weight of a cationic photoinitiator or of a mixture of cationic photoinitiators; and (C) from 0.

Abstract: A description is given of compounds of the formula I ##STR1## where r is 0 or 1 and y is a number from the range 1-3; X is a direct bond or --NR.sub.8 --, --CO--, --CONH-- or --COO-- or a divalent aliphatic or mixed aromatic-aliphatic C.sub.1 -C.sub.18 hydrocarbon radical;Z is an aromatic, aliphatic or mixed aromatic-aliphatic C.sub.3 -C.sub.18 hydrocarbon radical which is interrupted in the aliphatic moiety by one or more divalent functional groups, in each case in a carbon-carbon single bond, and/or in the aromatic or aliphatic moiety by one or more divalent functional groups, in each case in a carbon-hydrogen bond, possible functional groups being --O--, --NR.sub.8 --, --S--, --SO--, --SO.sub.

Abstract: Compositions based on synthetic organic polymers or prepolymers are effectively stabilized against the damaging effects of light, oxygen and/or heat by addition of a compound of the formula I ##STR1## in which Z is a group of one of the formulae II or III, ##STR2## R.sub.7 and R.sub.17, independently of one another, are a radical of one of the formulae IV, V and VI ##STR3## and the remaining symbols are as defined in claim 1.

Abstract: Photopolymerisable compositions are described which comprisea) 20 to 80% by weight of a specific film-forming, acid group-containing acrylate of higher molecular weight which is neutralised with ammonia or an amine or an inorganic base, at least 10% by weight of component a) consisting of a acrylate of higher molecular weight which is derived from a reaction product of a polymolecular epoxy resin that is advanced with a bisphenol and an ethylenically unsaturated monocarboxylic acid and after subsequent reaction with a cyclic anhydride of an organic polycarboxylic acid,b) 0.1 to 15% by weight of a photoinitiator,c) 1 to 25% by weight of optional components, andd) water, as well ase) at least one additional optional (meth)acrylate monomer or (meth)acrylate oligomer or a vinyl compound that can be crosslinked with light.The compositions contain no additional polymolecular polymer binders and which can be used as aqueous applicable photoresist compositions, preferably for coating printed circuit boards.