Abstract: Provided is a light-emitting apparatus including a substrate, an LED light source disposed on the substrate, and a reflecting frame disposed laterally of the LED light source on the substrate, wherein the LED light source includes a side-emitting LED device which is disposed on the substrate, and which emits light laterally toward the reflecting frame, and a top-emitting LED device which is disposed above the side-emitting LED device on the substrate so as to straddle the side-emitting LED device and so as to not block a portion of the light emitted from the side-emitting LED device, and which emits light upward, the light being different in color than the light emitted from the side-emitting LED device, and wherein the reflecting frame is disposed so that the light emitted from the side-emitting LED device is reflected upward.

Abstract: In a first aspect of the present disclosure, a push switch includes a substrate including a first electrode and a second electrode arranged on an upper surface of the substrate, the second electrode arranged around the first electrode; and a resilient member that is arranged on the second electrode over the first electrode. The substrate includes a recess in a lower surface of the substrate, and the recess is positioned below the first electrode that is arranged on the upper surface of the substrate.

Abstract: To provide an illumination method and a light-emitting device which are capable of achieving, under an indoor illumination environment where illuminance is around 5000 lx or lower when performing detailed work and generally around 1500 lx or lower, a color appearance or an object appearance as perceived by a person, will be as natural, vivid, highly visible, and comfortable as though perceived outdoors in a high-illuminance environment, regardless of scores of various color rendition metric. Light emitted from the light-emitting device illuminates an object such that light measured at a position of the object satisfies specific requirements. A feature of the light-emitting device is that light emitted by the light-emitting device in a main radiant direction satisfies specific requirements.

Abstract: To provide an illumination method and a light-emitting device which are capable of achieving, under an indoor illumination environment where illuminance is around 5000 lx or lower when performing detailed work and generally around 1500 lx or lower, a color appearance or an object appearance as perceived by a person, will be as natural, vivid, highly visible, and comfortable as though perceived outdoors in a high-illuminance environment, regardless of scores of various color rendition metric. Light emitted from the light-emitting device illuminates an object such that light measured at a position of the object satisfies specific requirements. A feature of the light-emitting device is that light emitted by the light-emitting device in a main radiant direction satisfies specific requirements.

Abstract: Provided is an LED drive circuit whereby the light emission color is easily changed when dimming by adjusting the current that drives the LED. The LED drive circuit has: a variable constant current source; a first LED row having a plurality of LEDs connected in series and emitting light in a first light emission color; a second LED row having a plurality of LEDs connected in series and emitting light in a second light emission color; and a current limiting circuit including a current detection element and a switch element. The LED drive circuit is characterized by: the threshold voltage for the first LED row being larger than the threshold voltage for the second LED row; the first LED row and the second LED row being connected in parallel to the variable constant current source; and the current limiting circuit limiting the current flowing to the second LED row, on the basis of the current flowing to the current detection element via the first LED row.

Abstract: A semiconductor device directly joins electrodes of a semiconductor element to electrodes of a metal substrate and has good yield, connection reliability, good mass productivity, and superior heat dissipation efficiency. A method for producing the semiconductor device that directly joins the electrodes of the metal substrate to the electrodes of the semiconductor element includes forming an electrode separating groove in an element mounting position on a main surface of the metal substrate at a predetermined depth. The semiconductor element is mounted to extend over the electrode separating groove. The metal substrate is ground from a surface reverse to the main surface of the metal substrate up to a position reaching the electrode separating groove.

Abstract: Provided is an LED device presenting minimal risk of bottom-surface contamination even when foreign substances such as liquids adhere thereto. The LED device has an LED die, a submount substrate on the surface of which the LED die is mounted, a frame-shaped electrode disposed along the outer circumferential part of the bottom surface of the submount substrate, and an inner-side electrode surrounded by the frame-shaped electrode and connected to the electrode of the LED die. In the LED device, the frame-shaped electrode is disposed along the entire outer circumferential part of the bottom surface. In an LED device, the bottom surface is rectangular, and the frame-shaped electrode is disposed along three sides of the bottom surface.

Abstract: An LED package used in a light-emitting device is provided with a function of position correction in mounting by self-alignment, and mounting density of such LED packages is increased. The LED package includes an LED element including an element electrode on a bottom surface, a phosphor layer containing a phosphor and covering a top surface and a side surface of the LED element, and an auxiliary electrode having an upper face bonded to a lower face of the element electrode, wherein the auxiliary electrode is larger than the element electrode, the auxiliary electrode includes a step that makes a lower face smaller than the upper face, and an end portion of the auxiliary electrode on a side where the step is formed is located inside an outer peripheral side of the phosphor layer.