Abstract: A through-hole extending from an element-mounting surface to a back surface of a substrate is formed along an edge area of a bottom surface of the substrate. This through-hole is filled with a conductive resin paste directly into a quarter through-hole made in the substrate. This makes the conductive resin paste firmly adhere to the substrate preventing the conductive resin paste from being peeling off from the quarter through-hole even if the through-hole is reduced in diameter or has a cross-sectional configuration.

Abstract: An electromagnetic exciter includes a magnetic circuit assembly having an outer yoke, a magnet, and an inner yoke. A voice coil is inserted into a magnetic gap formed in the magnetic circuit assembly. A casing having a cylindrical wall is disposed around the magnetic circuit assembly. A suspension is set between a cylindrical side wall of the outer yoke and the cylindrical wall of the casing to supportingly connect the magnetic circuit assembly to the cylindrical wall of the casing. A weight is secured to the outer side surface of the side wall of the outer yoke. The suspension has an outer ring, an inner ring, and a pair of arcuate arms. Each arm is connected to the outer ring at one end thereof and connected to the inner ring at the other end thereof The arms and/or portions of the weight that face the arms are sloped so that the weight will not contact the arms when the magnetic circuit assembly is vibrated.

Abstract: A planar light source has a light emitting source, and a light guide plate for receiving light beams emitted from the light emitting source at a front side thereof and changing direction of the light beams, discharging the light beams from an upper surface thereof. A first anisotropic diffusion surface is formed on a lower surface of the light guide plate, and a reflection member is provided on the first anisotropic diffusion surface. The first anisotropic diffusion surface is hologram diffusion surface or a hairline diffusion surface.

Abstract: A semiconductor light-emitting device includes: a printed-wiring board; a light-emitting diode element mounted on the printed-wiring board; and a resin body for sealing the light-emitting diode element. The resin body is composed of a first resin body arranged around the light-emitting diode element, and a second resin body, which seals the light-emitting diode and the first resin body. An upper edge of the first resin body disposed at a lower position of the PN-junction is configured to be at least on or beyond an imaginary line that connects the PN-junction and a lower edge of the second resin body.

Abstract: An exciter for a panel-type loud speaker comprises a bimorph and a bimorph holding member. The bimorph comprises a plate member and a pair of piezoelectric ceramic layers, each formed on the opposite sides of the plate member. The bimorph holding member is holds one end of the bimorph and comprises a bimorph end holding portion for holding the one end of the bimorph, which comprises a three-layer embedded section embedding the pair of piezoelectric ceramic layers and the plate member sandwiched therebetween at the one end of the bimorph, and an extension embedded section in which an extension of the plate member is embedded, and a mounting protrusion protruding from the bimorph end holding portion, wherein a distal end of the mounting protrusion is connected to the diaphragm so that the bimorph is disposed on the diaphragm with a space interposed between the bimorph and the diaphragm.

Abstract: A light emitting diode has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting diode element is secured to the base at an exposed mounting area. The light emitting diode element is electrically connected to the conductive patterns.

Abstract: A light emitting diode has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting diode element is secured to the base at an exposed mounting area. The light emitting diode element is electrically connected to the conductive patterns.

Abstract: A side-emission type light-emitting diode including: a first substrate having a concavity formed in one of side surfaces of the first substrate, the concavity including an inner surface which is configured to be a first reflecting surface; an LED-element-mounting board of thin plate shape, arranged on the lower surface of the first substrate, the board configured to close the concavity at the lower surface of the first substrate; an LED element mounted on the board and arranged in the concavity; and a light-transmitting resin filled in the concavity and configured to seal the LED element.

Abstract: A light emitting apparatus including a substrate, at least one light emitting diode chip mounted on the substrate, a light-transmitting member disposed on the substrate to form a space between the light-transmitting member and the substrate, and a resin disposed in the space to seal the light emitting diode chip, the light-transmitting member including at least one resin-injection inlet and at least one air vent, the space being filled with the resin injected into the space through the resin-injection inlet.

Abstract: A light source apparatus capable of being reduced in size and thickness and superior in light combining performance includes a prism sheet unit having two mutually parallel prism surfaces each having a plurality of mutually parallel fine prism rows. The prism rows on the two prism surfaces intersect each other at a predetermined angle in plan view. A plurality of light sources are disposed at the light entrance surface side of the prism sheet unit to emit light so that the light is incident on the light entrance surface of the prism sheet unit at a predetermined angle thereto. The lights from the light sources are combined or color-mixed together by passing through the two prism surfaces, and the resulting combined or color-mixed light is emitted as exiting light.

Abstract: An electric-acoustic transducer/housing assembly includes an electric-acoustic transducer and a housing within which the electric-acoustic transducer is arranged. The electric-acoustic transducer includes a casing, a first and second vibratory plates transversely mounted within the casing, and an exciter disposed between the first and second vibratory plates and operated to vibrate the first and second vibratory plates. The first vibratory plate cooperates with the exciter to define a first inner chamber therebetween. A sound pipe extends outwardly from the casing and is adapted to allow the first inner chamber to be communicated with the outside of the housing. The second vibratory plate cooperates with the exciter to define a second inner chamber therebetween. The casing has a through sound hole through which the second inner chamber is communicated with the outside of the casing. The sound pipe is kept out of communication with the through sound hole.

Abstract: A planar light-emitting device includes a lightguide plate (7), a light source including at least one light-emitting package (6) that makes light enter the lightguide plate, and a reflecting sheet (10, 11) that returns light leaking from the light source. The lightguide plate has an upper surface as a light exit surface, a lower surface opposite to the upper surface, and a peripheral edge surface a part of which is disposed as a light entrance surface (7?). The light source includes at least one light-emitting package (6) having a substrate, at least one light-emitting element mounted on a mount surface of the substrate, and a light-transmitting resin provided on the mount surface to seal the light-emitting element. The reflecting sheet is disposed to face at least one of the upper and lower surfaces of the lightguide plate and to extend beyond the light entrance surface as far as over or underneath the light-transmitting resin.

Abstract: A backlight unit includes a light guide plate having opposite side surfaces and a peripheral edge surface. A part of the peripheral edge surface is a light entrance surface, and one of the opposite side surfaces is a light exit surface. A light source is disposed adjacent to the light entrance surface of the light guide plate. A light deflecting film is disposed adjacent and parallel to the light exit surface of the light guide plate. The light deflecting film has a multilayer construction wherein light reflecting layers and light transmitting layers are stacked one by one alternately. The light reflecting and transmitting layers are tilted at a predetermined angle to the light exit surface.

Abstract: A substrate is prepared that includes substrate segments arranged in series in the X and Y directions. The substrate segments are respectively provided with circuit patterns on its one side and electrodes on the other side. Sets of IC devices including bobbins are mounted on the sides with the circuit patterns of the respective substrates. A conductor is wound around the bobbins successively to form the windings. Portions of the conductor extending between the adjacent windings are pressed against and connected to the circuit patterns to form leading and trailing ends of the windings connected to the circuit patterns. Thereafter, the substrate is severed to provide surface-mount coil packages each comprising the circuit board and the set of IC devices including the coil.

Abstract: An optical member (3) has an entrance bottom surface (6) opposed to LED chips (1) and the entrance bottom surface (6) is configured to receive light from the LED chips (1), an exit top surface (7) opposite to the entrance bottom surface (6) and the exit top surface (7) is configured to emit the light outside the optical member(3), and an outer peripheral side surface (8) disposed between the entrance bottom surface (6) and the exit top surface (7). The outer peripheral side surface (8) has a plurality of circumferentially extending grooves (9) each having a V-shaped sectional configuration. The grooves (9) are set at an angle at which the entered light can be totally reflected inwardly in the optical member (3).

Abstract: A method of producing an electret condenser microphone capable of reflow mounting includes a first step of providing a backplate substrate having a backplate; a second step of providing an adhesive-backed fluorine-containing resin film formed by stacking an adhesive on a film-shaped fluorine-containing resin material having a surface treated by wet or dry chemical etching; a third step of stacking the adhesive-backed fluorine-containing resin sheet on the backplate of the backplate substrate with the adhesive interposed therebetween; a fourth step of setting the adhesive to firmly secure the fluorine-containing resin material to the backplate of the backplate substrate; and a fifth step of implanting electric charges into the fluorine-containing resin film firmly secured onto the backplate.

Abstract: A light emitting sheet module includes a light guiding sheet to cover a plurality of key switches, at least one LED disposed on at least one end portion of the light guiding sheet, and a circuit board disposed on the one end portion of the light guiding sheet on which the LED is disposed. When the light emitting sheet module is, mounted on a switch board, it is capable of adaptation to key switches in a wide variety of forms and to illuminate the key switches with light emission of high brightness.