Abstract: A flowmeter including a sensor passage disposed with a sensor chip for measuring a flow rate and an orifice passage as a bypass passage placed with respect to the sensor passage is provided. The orifice passage has a passage diameter which is smaller than a passage diameter of an inflow passage, a distribution orifice is placed on an inlet side of the sensor passage, and the orifice passage and the distribution orifice are configured such that changing trends in an effective sectional area becomes same in a graph including a vertical axis indicating the effective sectional area and a lateral axis indicating a fluid pressure of a fluid.

Abstract: A blister sheet includes a container film including pockets receiving a content, and a cover film mounted to the container film to close the pockets. The container and the cover film are made of synthetic resins. The cover film is thinner than the container film. One pair of cuts formed for each pocket passes through the container and the cover film and extends to the pocket such that each pocket is placed between the cuts. The container and the cover film are broken from the one pair of cuts toward the pocket. A cutting slit or perforation is formed in the container film to allow for separation of the blister sheet into sheet pieces. The cutting slit or perforation is extended to intersect with the cut and a portion of the cutting slit or perforation that intersects with the cut passes through the container and the cover film.

Abstract: An actuator-operation detecting apparatus is configured to check the operating state of a piston of an actuator. The actuator includes a double-acting cylinder, the piston that partitions the cylinder into a first pressure acting chamber and a second pressure acting chamber, and a rod connected to an end face of the piston facing the second pressure acting chamber. The actuator-operation detecting apparatus includes a first pressure detector to detect the pressure in the first pressure acting chamber, a second pressure detector to detect the pressure in the second pressure acting chamber, a differential amplifier circuit to calculate a thrust force acting on the piston based on the pressures detected by the first and second pressure detectors and the pressure-receiving area of the piston, and a microcomputer to monitor the operation of the piston based on the thrust force.

Abstract: A three-dimensional measurement device includes: an illuminator that irradiates a measured object with a predetermined light; an imaging device that comprises: an imaging sensor displaceable at least in a vertical direction; and a both-sided telecentric optical system that causes the imaging sensor to form an image of a predetermined area on the measured object irradiated with the predetermined light; a conveyor that moves the illuminator and the imaging device relative to the measured object; and a controller that: executes three-dimensional measurement of a predetermined measurement object on the measured object, based on the taken image; measures a height of the predetermined area at least at a time prior to imaging of the predetermined area under the predetermined light; and changes a height position of the imaging sensor based on a measurement result to adjust an interval between the predetermined area and the imaging sensor to a predetermined distance.

Abstract: An inspection device includes: an irradiator that irradiates an object with near-infrared light; a spectroscope that disperses reflected light from the irradiated object; an imaging device that takes a spectroscopic image of the reflected light; a processor that: obtains spectral data of a plurality of points on the object, based on the spectroscopic image; defines a group of similar spectral data from among the spectral data of the plurality of points; extracts a group having a largest number of spectral data from the defined group; calculates an average of the spectral data of the extracted group; and detects a type of the object using a predetermined analysis of the object, based on the average.

Abstract: A temperature control system includes a first temperature adjustment unit storing fluid at a first temperature; a second temperature adjustment unit storing fluid at a second temperature higher than the first temperature; a low-temperature flow path for passing fluid supplied from the first temperature adjustment unit; a high-temperature flow path for passing fluid supplied from the second temperature adjustment unit; a bypass flow path for circulating fluid; a combination flow path for passing fluid from the low-temperature flow path, the high-temperature flow path, and the bypass flow path merged at a merging part; a temperature adjustment part that passes fluid from the combination flow path and cools/heats a member of a semiconductor manufacturing device; and a control device that controls valve positions of variable valves attached to the three flow paths upstream of the merging part and adjusts the flow rate distribution ratio for the three flow paths.

Abstract: An inspection device includes: an irradiator that irradiates an object with near-infrared light; a spectroscope that has a slit where reflected light enters and that disperses the reflected light into wavelength component lights; an imaging device that comprises an imaging element that takes a spectroscopic image of the wavelength component lights; and a processor that: obtains spectral data based on the spectroscopic image; and detects a type of the object using a predetermined analysis based on the spectral data. Each of the wavelength component lights is a single wavelength light, the inspection device satisfies L?2P, where L is a width of each of the wavelength component lights in a wavelength dispersion direction on a light receiving surface of the imaging element and P is a width of a pixel in the wavelength dispersion direction on the light receiving surface.

Abstract: The present invention provides a checking tool for a tube coupler with which it is possible to visually check an attachment state of the tube coupler. A checking tool 10 for a tube coupler according to the present invention is a checking tool configured to be attached to a tube coupler 30, the tube coupler being formed of a first coupling piece 31 and a second coupling piece 35 hingedly connected to each other so as to be able to be opened and closed, being configured to couple tubes to each other with use of the first coupling piece and the second coupling piece, and having hook pieces 33 and 37 that are provided protruding from outer circumferential surfaces of the first coupling piece and the second coupling piece.

Abstract: A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder.

Abstract: A measurement apparatus includes an illumination device irradiating an object with a first and a second pattern, a camera taking image data of the object, a motor displacing the object, and a processor measuring the object, obtaining a first value of the object based on a first number of image data taken with the first pattern at a first number of phases at a first position, obtaining a gain and/or offset based on the first number of image data, obtaining a second value of the object based on the gain and/or offset and a second number of image data taken with the second pattern at a second number of phases at a second position, obtaining height data of the object based on the first and the second value, and obtaining the second value with an average of the gain and/or offset of pixels adjacent to each pixel.

Abstract: A three-dimensional measurement device includes: a projector including: a light source that emits a predetermined light; a grid that converts the light from the light source into a predetermined striped pattern; and a driver that moves the grid, and the projector projecting the striped pattern onto a measurement object; an imaging device that takes an image of the measurement object on which the striped pattern is projected; and a controller that: controls the projector and the imaging device to obtain a plurality of image data having different light intensity distributions; executes three-dimensional measurement of the measurement object by phase shifting based on the image data having different light intensity distributions; and obtains each of the image data among the image data having different light intensity distributions.

Abstract: A measurement device includes: an optical system that splits incident light into two lights to emit one light as measurement light to a measurement object and the other light as reference light to a reference surface, and recombines the two lights to emit combined light; a light emitter that emits light entering the optical system; an imaging system that takes an image of output light emitted from the optical system; and a processor that executes measurement with regard to a predetermined measurement area of the measurement object, based on an interference fringe image taken by the imaging system, wherein the processor: obtains complex amplitude data at a predetermined position in an optical axis direction at predetermined intervals in at least a predetermined range in the optical axis direction, with regard to a specific area set in advance in the measurement area based on the interference fringe image.

Abstract: A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device including: an irradiator that irradiates the solder and the adhesive with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive; and a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group.

Abstract: A three-dimensional measurement device includes: a projector that includes: a light source that emits predetermined light; and a reflective optical modulator that converts the predetermined light into a predetermined striped pattern, wherein the projector projects the predetermined striped pattern onto a measurement object at a predetermined number of frames per unit time; an imaging device that takes an image of the measurement object projected with the predetermined striped pattern; a processor that: controls the projector and the imaging device to sequentially project a plurality of different ones of the predetermined striped pattern and take images of the plurality of different ones of the predetermined striped pattern to obtain a plurality of image data having different light intensity distributions; and executes three-dimensional measurement of the measurement object based on the plurality of image data.

Abstract: A solder printing inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder on the substrate on which a thermosetting adhesive is applied, the solder printing inspection device including: an irradiator that irradiates the solder with light; an imaging device that takes an image of the irradiated solder; a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group; outputs mounting position adjustment information to the component mounting machine.