Abstract: A board inspection apparatus is disclosed, which includes a surface-side irradiator irradiating a surface of each inspection area of a board, a surface-side camera taking a surface-side image of the surface, a rear face-side irradiator irradiating a rear face of each inspection area, a rear face-side camera taking a rear face-side image of the rear face, and a controller moving the surface-side irradiator and the surface-side camera to a position corresponding to the surface of each inspection area, moving the rear face-side irradiator and the rear face-side camera to a position corresponding to the rear face of each inspection area, and inspecting the surface and the rear face of each inspection area based on the surface-side image and the rear face-side image, respectively.

Abstract: A board inspection apparatus is disclosed, which includes one surface-side irradiator that irradiates a first area on a surface side of a board with first light, a surface-side camera that takes an image of the first area, one rear face-side irradiator that irradiates a second area on a rear face side of the board with second light, a rear face-side camera that takes an image of the second area; and a controller that inspects the first area based on image data obtained from the surface-side camera and the second area based on image data obtained from the rear face-side camera.

Abstract: A measurement apparatus includes an illumination device irradiating an object with a first and a second pattern, a camera taking image data of the object, a motor displacing the object, and a processor measuring the object, obtaining a first value of the object based on a first number of image data taken with the first pattern at a first number of phases at a first position, obtaining a gain and/or offset based on the first number of image data, obtaining a second value of the object based on the gain and/or offset and a second number of image data taken with the second pattern at a second number of phases at a second position, obtaining height data of the object based on the first and the second value, and obtaining the second value with an average of the gain and/or offset of pixels adjacent to each pixel.

Abstract: The present invention provides a tube with coupling according to which liquid leakage and the like can be suppressed as much as possible when couplings are connected. A tube with coupling 10 according to the present invention is a tube with coupling 10 obtained by forming a coupling 30 on a leading end portion 22 of a tube 20 through injection molding, and the leading end portion 22 of the tube 20 is arranged at a position set back from a leading end portion 32 of the coupling 30, at least a portion of the leading end portion 22 of the tube 20 being covered by the coupling 30. It is desirable that a flange 36 is provided so as to protrude outward at a position set back from the leading end portion 32 of the coupling 30 and the leading end portion 22 of the tube 20 is arranged at a position set further back from the flange 36.

Abstract: A monitor system for monitoring a status of one or more equipment includes a plurality of mobile terminals respectively operated by a plurality of operators. Each of the plurality of mobile terminals includes a communicator that receives status information with regard to the status of the equipment via a communication line; a display that displays, when the status according to the status information received from one of the mobile terminals indicates that the equipment requires a specified operation, information showing that the specified operation is required; and a territory setter that sets a territory in which one or more operations for the equipment to be performed by the operator of the each of the plurality of mobile terminals.

Abstract: A substrate inspection device and a component mounting device are provided. The solder inspection device and the component mounting device respectively have substrate support devices that support a rear face of a printed circuit board. The substrate support device includes backup pins that support the rear surface of the printed circuit board, a location determiner that determines locations of the backup pins, and a backup pin locator that places the backup pins at the locations of the backup pins determined by the location determiner. The location determiner determines positions for supporting areas of the rear face of the printed circuit board where an electrode is covered by a resist film and where neither electronic component nor solder is present, as the locations of the backup pins.

Abstract: A solder print inspecting device includes three-dimensional measurement lighting unit that directs a specific light at a printed substrate, a CCD camera for imaging the printed substrate that is illuminated by the light, three-dimensional calculating unit that performs a three-dimensional measurement of cream solder based on image data, etc., and displaying unit that displays a three-dimensional image showing a three-dimensional shape of the cream solder, along with displaying an arrow image showing an operating direction of a squeegee in a solder printing machine, an arrow image showing a conveying direction of the printed substrate, etc.

Abstract: In a monitoring system, when there is an evaluation that a product is defective, in a solder print inspecting device that is subject to monitoring, that information is sent to a mobile terminal possessed by an operator. The operator who views the notification performs, through the mobile terminal, a checking task for evaluating whether or not the evaluation result regarding the printed substrate that has been evaluated as a defective product is correct. Depending on the evaluation result, an operating instruction is sent to the solder print inspecting device, which has temporarily stopped the printed substrate. If correction information instructing that the defective-product evaluation be corrected to a non-defective-product evaluation is sent from a mobile terminal to the solder print inspecting device, the solder print inspecting device corrects the defective-product evaluation to a non-defective-product evaluation, and releases the temporary stop of the printed substrate.

Abstract: A three-dimensional measuring device includes an extraction unit that extracts an image data set with a brightness value of each of pixels in image data within an effective range from among a plurality of image data sets at each of coordinate positions of an object to be measured, and a three-dimensional measurement unit that performs three-dimensional measurement relating to each of the coordinate positions of the object to be measured based on the extracted image data set. The extraction unit extracts the image data set imaged under a pattern light with the highest irradiation brightness among a plurality of types of pattern lights when there is a plurality of sets of the image data sets with the brightness value of each of the pixels in the image data within the effective range from among the plurality of the image data sets.

Abstract: A monitor system for monitoring a status of one or more equipment includes a plurality of mobile terminals respectively operated by a plurality of operators. Each of the plurality of mobile terminals includes a communicator that receives status information with regard to the status of the equipment via a communication line; a display that displays, when the status according to the status information received from one of the mobile terminals indicates that the equipment requires a specified operation, information showing that the specified operation is required; and a territory setter that sets a territory in which one or more operations for the equipment to be performed by the operator of the each of the plurality of mobile terminals.

Abstract: A board inspection apparatus includes an irradiation unit, an imaging unit, and an image processing unit. The image processing unit includes a three-dimensional measurement unit configured to perform three-dimensional measurement of the surfaces of the solder and the resist film by a certain three-dimensional measurement method based on the image data, a virtual standard surface setting unit configured to set a virtual standard surface corresponding to a contacting surface of a certain component mounted in a certain area of the printed board, a protrusion amount calculation unit configured to calculate a protrusion amount from the virtual standard surface for each solder printed and formed in the certain area, and a determination unit configured to determine whether the printed state of the solder passes or fails based on each of the protrusion amounts of the solder.

Abstract: A liquid control apparatus that controls a spread of a liquid has a main body that has a supply subject surface onto which the liquid is supplied. The apparatus also has a mesh form body that is woven into a mesh form and provided to contact the supply subject surface and a guiding member that is provided to contact an opposite side of the mesh form body to the main body side.

Abstract: A liquid vaporizer includes a first housing having a liquid-supplied surface to which a chemical solution is supplied, a heater, a mesh, a first holder and a second holder attached to the outer edge portions of the mesh, the outer edge portions opposing each other in a direction of spreading of the mesh, first cover bolts, stems supported by the first housing so as to be movable along a specific direction inclined with respect to the liquid-supplied surface, second cover bolts, coil springs biasing the stems along the specific direction and bring the mesh into intimate contact with the liquid-supplied surface, and a lid member covering the mesh from a side of the liquid-supplied surface to seal a space around the liquid-supplied surface with the first housing.

Abstract: A device for measuring three dimensional shape includes a first irradiation unit, a first grating control unit, a second irradiation unit, a second grating control unit, an imaging unit, and an image processing unit. After performance of a first imaging operation as imaging processing of a single operation among a multiplicity of imaging operations performed by irradiation of said first light pattern of multiply varied phases, a second imaging operation is performed as imaging processing of a single operation among a multiplicity of imaging operations performed by irradiation of said second light pattern of multiply varied phases. After completion of the first imaging operation and the second imaging operation, shifting or switching operation of the first grating and the second grating is performed simultaneously.