Abstract: The present disclosure describes a semiconductor structure that includes a substrate from an undoped semiconductor material and a fin disposed on the substrate. The fin includes a non-polar top surface and two opposing first and second polar sidewall surfaces. The semiconductor structure further includes a polarization layer on the first polar sidewall surface, a doped semiconductor layer on the polarization layer, a dielectric layer on the doped semiconductor layer and on the second polar sidewall surface, and a gate electrode layer on the dielectric layer and the first polarized sidewall surface.

Abstract: A moving-body indoor illumination apparatus is provided. The moving-body indoor illumination apparatus includes a light source, and a holder for holding the light source. The light source is pressed against the holder. The light source includes a spherical housing and a light emitter. The light emitter is disposed within the housing. The housing is provided with a housing-side restricting part that restricts movement of the housing with respect to the holder by contacting with or approaching the holder in a portion different from a portion which is exposed from an opening on an irradiation side of the holder.

Abstract: A hybrid connection element, in particular a bearing outer element of a wheel bearing, includes a core part made of steel and a reinforcement part made of plastic. The reinforcement part at least partially encases the core part. The core part includes a hollow cylindrical bearing unit extending in an axial direction and a flange extending in a radial direction. The reinforcement part includes at least one reinforcement rib which transmits force between the bearing unit and the flange of the core part.

Abstract: A heat sink includes a heat sink body having a plurality of stacked fins and a mounting base. The mounting base has a first heat dissipation plate and a second heat dissipation plate. A first surface of the first heat dissipation plate is connected to a bottom of the heat sink body. The second heat dissipation plate is mounted on a second surface of the first heat dissipation plate opposite to the first surface.

Abstract: A steering damper can minimize a mounting space and can achieve favorable damping force characteristics. A rod member is mounted on a side of a first end of a piston and passes through a side of a first end of the damper case. A cylinder has a stepped configuration including a small-diameter cylinder and a large-diameter cylinder. Insertion of the piston in the cylinder causes an oil chamber filled with damper oil to be divided into a first oil chamber that has the small-diameter cylinder as an outer circumference, a second oil chamber that has the large-diameter cylinder as an outer circumference and that contacts the rod member, and a third oil chamber that has the large-diameter cylinder as an outer circumference and that does not contact the rod member. The piston has a stepped configuration including a small-diameter portion associated with the small-diameter cylinder and a large-diameter potion associated with the large-diameter cylinder.

Abstract: A fungicidal composition is provided, the composition comprising: Component (A): prothioconazole; and Component (B): chlorothalonil. There is also provided a method for the control and/or prevention of fungal infestations in a plant, the method comprising applying to the plant, plant parts or the locus thereof: Component (A): prothioconazole; and Component (B): chlorothalonil. The combination of prothioconazole and chlorothalonil exhibits synergy and also exhibits a reduction in phytotoxicity.

Abstract: Disclosed is a sheet which comprises a fibrous substrate and carbon nanotubes attached to fibers constituting the fibrous substrate. The carbon nanotubes in the sheet comprise single-walled carbon nanotubes as a main component.

Abstract: A wafer processing tool is capable of detecting wafer warpage. The wafer processing tool includes a wafer holder on which a wafer is held and at least one sensor set. The at least one sensor set is disposed above the wafer or under the wafer, and a projection of each of the at least one sensor set on the wafer radially extending from a center of the wafer to an edge of the wafer. The at least one sensor set is configured to scan an entire surface of the wafer so as to measure warpage of the wafer while the wafer holder and the at least one sensor set are rotatable relative to each other.

Abstract: A gut organoid includes a tissue structure that encloses a cavity. A method of using the gut organoid includes providing a test drug to the gut organoid in the presence of a buffer solution so that liquid comprising the test drug enters into the cavity, and collecting and analyzing the liquid in the cavity. A method for producing the gut organoid includes plating cells on a cell culture substrate including a surface on which a cell-adhesive region and a non-cell-adhesive region surrounding the cell-adhesive region are formed, and culturing the cells plated on the cell culture substrate so as to induce differentiation of the cells.

Abstract: Provided is a portable article container. The portable article container according to one embodiment of the present invention includes: a accommodation main body which is portable and includes an accommodation portion configured to accommodate an article; a battery configured to provide power to charge a main battery of a portable electronic device; and at least one charging unit configured to transmit power stored in the battery to the portable electronic device through at least one method of a wireless method and a wired method.

Abstract: A heat treatment method of a substrate includes setting a temperature profile over the course of stabilization to a target temperature after the substrate is loaded as a reference, and controlling a temperature of the hot plate supporting the substrate on the basis of the reference.

Abstract: A semiconductor device includes a substrate, a gate stack over the substrate, an insulating structure over the gate stack, a conductive via in the insulating structure, and an contact etch stop layer (CESL) over the insulating structure. The insulating structure has an air slit therein. The conductive via is electrically connected to the gate stack. A portion of the CESL is exposed in the air slit.

Abstract: A damping device for structure includes a base frame installed on a target place, an air floating mass disposed on the base frame to blow off air, a TMD mass disposed above the base frame to float with an air pressure, one pair of guiderail units disposed on X-direction both sides of the base frame along the X direction respectively, slider units disposed to be slidable in the X direction relative to the guiderail units, coupled to each X-direction side face of the TMD mass and each including a slider moving up/down mechanism part which moves down a slider when the TMD mass floats, an oil damper attached to the base frame to exert an attenuation action on the TMD mass and a coil spring attached to the base frame to exert a restoration action on the TMD mass.

Abstract: An electromagnetic relay includes a fixed contact holder, a moving contact holder, an electromagnetic device, and a magnet. The fixed contact holder extends in a predetermined direction and is provided with a fixed contact. The moving contact holder also extends in the predetermined direction, and is provided with a moving contact. The magnet is arranged perpendicularly to an opening/closing direction of the fixed contact and the moving contact. A stretch space in which an arc generated between the fixed contact and the moving contact is stretched is provided, in the predetermined direction, beyond respective tips of the fixed contact holder and the moving contact holder. The stretch space also faces a surface of the fixed contact holder and a surface of the moving contact holder.

Abstract: A reciprocating pump includes: a pump head having an inner space; a diaphragm configured to partition the inner space of the pump head into a pump chamber into which a transfer fluid is to be introduced and a working chamber into which working air is to be introduced; a driving device including a reciprocating member coupled to the diaphragm, the driving device being capable of driving the reciprocating member with the working air at least in a direction that the diaphragm is retracted; and a working air switching device.

Abstract: The present disclosure describes a semiconductor apparatus and a method for handling contamination from a semiconductor manufacturing process. The semiconductor apparatus can include a chuck configured to hold a substrate, a drain cup configured to surround the chuck and to capture a chemical sprayed from the substrate, and a detection module disposed in a space between the drain cup and the chuck and configured to monitor sidewalls of the drain cup.

Abstract: A display control device according to one embodiment includes a processor. The processor receives image information indicating a first image appearing on a display from an information terminal, controls a first display device and a second display device based on the image information to display the first image on a first touch screen and a second touch screen, receives first coordinate information indicating a contact position on the first image from the first display device when a touch operation that brings a finger or an object into contact is performed in a range in which the first image is displayed in the first touch screen, overlays and displays a second image at a position corresponding to the first coordinate information on the first image displayed on the second touch screen when the first coordinate information is received, and transmits the received first coordinate information to the information terminal.

Abstract: A method of forming a memory device includes: forming a polish stop layer over a metallization layer in an inter-metal dielectric layer; performing an etching process to form an opening in the polish stop layer, in which a sidewall of the opening extends at an acute angle relative to a top surface of the polish stop layer; forming an electrode material in the opening and over the polish stop layer; planarizing the electrode material until a top surface of the polish stop layer is exposed so as to form a bottom electrode surrounded by the polish stop layer; and forming a stack of a resistance switching layer and a top electrode over the bottom electrode.

Abstract: An integrated endoscope and visualization system comprises an endoscope, a visualization processing module and a 3D display device such as smart-glasses or naked-eye 3D display. The endoscope is equipped with two image capturing modules such as CMOS image sensors and can be disposable. The visualization processing module receives and encodes the images obtained by the two image capturing modules in order to generate an output visualization signal. The output visualization signal is transmitted to and displayed by the 3D display device in a 3D manner. The integrated endoscope and visualization system not only provides a 3D vision of surgical target during an endoscopic surgery operation, but also allow the medical personnel to walk or move during the surgery while keeping looking at the 3D images captured by the endoscope through wearable display devices.

Abstract: A forming device that forms a 3D object includes a head section including a plurality of nozzle rows, and a scanning driving section that causes the head section to carry out a scanning operation; where the head section includes a first nozzle row group, a second nozzle row group, and a support nozzle row group; in an operation of at least one of the forming modes, the forming device forms at least one part of the 3D object using the first nozzle row group and the second nozzle row group and forms a support layer in a periphery of the 3D object; and when a maximum value of a material dischargeable in unit time in one scanning operation is defined as a material discharging ability, the material discharging ability of the support nozzle row group is greater than the material discharging ability of the first nozzle row group.