Patents Assigned to CO
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Publication number: 20240420609Abstract: An electronic device according to various embodiments comprises: a display; a camera module; a sensor module including a first sensor, which is disposed on the rear part of the electronic device and operates on the basis of light, and a second sensor, which is disposed on the front part of the electronic device and operates on the basis of light; and a processor including a first processor and a second processor, wherein the processor can be configured to control the brightness of the display on the basis of data received from the first sensor and data received from the second sensor when the camera module is in an inactive state, and control the brightness of the display on the basis of data received from the second sensor, and not on the basis of data received from the first sensor, when the camera module is in an active state.Type: ApplicationFiled: August 28, 2024Publication date: December 19, 2024Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jinbae LEE, Kihong MIN, Heewoong YOON, Hyungpil KUM, Donghwan SEO, Hyeonchang SON, Kyeongmun JO
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Publication number: 20240421566Abstract: Disclosed are a substrate processing equipment and a method of driving the substrate processing equipment, which automatically cut off power supplied to a main circuit breaker and a branch circuit breaker when an operator inspects a process chamber or a power supply system. The substrate processing equipment for processing a substrate includes: a process processing module including loads utilized in a process for processing a substrate; a branch circuit breaker installed on a periphery to the process processing module and electrically connected to the loads; a main circuit breaker electrically connected to the branch circuit breaker and supplying power to the branch circuit breaker; and a power distribution board in which the branch circuit breaker is mounted, and including a power distribution board door, in which the main circuit breaker cuts off power when the power distribution board door is opened.Type: ApplicationFiled: February 20, 2024Publication date: December 19, 2024Applicant: SEMES CO., LTD.Inventors: Jae Min KIM, Gun Min LEE
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Publication number: 20240421240Abstract: The present invention discloses a manufacturing method of a photovoltaic solar cell module, and belongs to the technical field of solar photovoltaic device manufacturing. In the present invention, a metal connecting ribbon is adopted for connecting a cell, and front and rear surfaces of the cell are designed by removing PAD dots, so that optical shielding on a surface of the cell is reduced, and the cost is reduced. The metal connecting ribbon and the cell are welded into a cell string by a jig and a manipulator and the risk of unstable connection is substantially eliminated by providing an adhesive pattern on the metal connecting ribbon of the cell string and curing.Type: ApplicationFiled: August 28, 2024Publication date: December 19, 2024Applicant: Suzhou Maizhan Automation Technology Co., Ltd.Inventors: XIN WANG, JING ZHENG
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Publication number: 20240419340Abstract: A method for a memory system is disclosed. The memory system can include a memory controller and a memory device. The method can include receiving data that includes bits and is to be written into the memory device, counting a first bit number of the bits corresponding to a first state and a second bit number of the bits corresponding to the second state, and in response to the second bit number of the bits being larger than the first bit number of the bits, the flipping operation is performed.Type: ApplicationFiled: July 24, 2023Publication date: December 19, 2024Applicant: Yangtze Memory Technologies Co., Ltd.Inventors: Hua TAN, Xing WANG, Yaolong GAO, Fanya BI, Zhe SUN, Bo YU
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Publication number: 20240417328Abstract: A polymer masonry unit is disclosed that can include a polymer added to a quarry byproduct to manufacture a quality brick unit. The present disclosure solves the technological problem of providing a structurally sound brick or concrete alternative without the need for kiln firing, using traditionally unusable waste material. By combining quarry byproduct and a polymer, a polymer masonry unit can be fabricated having compressive strength and architectural utility. In one exemplary embodiment, fiber elements can be added to the byproduct and polymer mixture to increase structural stability. The present disclosure improves the performance of the system itself by providing a basic block or brick unit using an environmentally responsible manufacturing process that reduces cost and waste. The manufacturing process includes a polymer/base material that can be poured into molds that cures over a predetermined period, without the need for kiln firing.Type: ApplicationFiled: August 30, 2024Publication date: December 19, 2024Applicant: Lithic Industries Holding Co.Inventors: Todd Denton, Michael Doty, Griffith J. Williams, Samuel Lopez, Kameron Anthony Hill, Johnathan Ross, Dyllon Hagan, Timothy James Kennedy
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Publication number: 20240422698Abstract: A communication method includes: receiving first indication information, wherein the first indication information indicates radio frequency chain switching; and sending a first uplink transmission, wherein the first uplink transmission comprises information about a power headroom, and the power headroom is determined based on at least one of a first power class or a second power class, wherein the first power class corresponds to an uplink transmission after the radio frequency chain switching, the second power class corresponds to an uplink transmission before the radio frequency chain switching, and the first uplink transmission is the uplink transmission after the radio frequency chain switching.Type: ApplicationFiled: August 26, 2024Publication date: December 19, 2024Applicant: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Dan Hu, XU ZHANG
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Publication number: 20240416425Abstract: The disclosure provides a method for additive manufacturing, including: a solidified layer forming process, in which a solidified layer is laminated by repeating a process of forming a material layer by supplying a material powder containing a metal material that expands with a tempering treatment, and a process of forming a solidified layer by irradiating the material layer with a laser beam or an electron beam, on a build table adjusted to a manufacturing temperature; and a thermal expansion treatment process, in which each time a predetermined number or a predetermined thickness of the solidified layer is newly formed, the temperature of the solidified layer is raised from the manufacturing temperature to a heating temperature, held for a predetermined time, and then lowered to the manufacturing temperature.Type: ApplicationFiled: May 29, 2024Publication date: December 19, 2024Applicant: Sodick Co., Ltd.Inventors: Itaru MATSUMOTO, Tsubasa TAKAYAMA
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Publication number: 20240418912Abstract: A light-uniformizing film, comprising a light-splitting layer (21), a substrate layer (20) and a light-diffusion layer (22), or only comprising the light-splitting layer (21) and the substrate layer (20), wherein the light-diffusion layer (22) is located on the upper surface of the substrate layer (20), the light-splitting layer (21) is located on the lower surface of the substrate layer (20), and the light-splitting layer (21) has a good surface finish, such that the abnormal deflection of light is small. By means of the light-uniformizing film, the energy concentrated within a certain range around a beam center of a point light source can be rationally distributed in other directions, the energy of a central hotspot on a projection screen is reduced, and the overall light-emission area is enlarged, thereby improving the uniformity of energy distribution.Type: ApplicationFiled: September 16, 2022Publication date: December 19, 2024Applicant: NINGBO EXCITON TECHNOLOGY CO., LTD.Inventors: Yan ZHANG, Zhipeng YE, Gang LI, Haijiang TANG
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Publication number: 20240421018Abstract: A semiconductor device, including: a stacked substrate; a plurality of semiconductor chips provided on the stacked substrate; an external output terminal; a circuit board configured to electrically connect the plurality semiconductor chips, and to electrically connect the plurality of semiconductor chips to the external output terminal, the circuit board having a first surface and a second surface opposite to each other, the second surface facing the stacked substrate; a sealing resin sealing the stacked substrate and the circuit board; and a plurality of flow velocity control pins attached to the circuit board, at the first surface of the circuit board.Type: ApplicationFiled: April 25, 2024Publication date: December 19, 2024Applicant: FUJI ELECTRIC CO., LTD.Inventor: Kazuma KAWAMURA
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Publication number: 20240422911Abstract: According to an embodiment, an electronic device includes a first printed circuit board and a second printed circuit board, facing the first printed circuit board, disposed over the first printed circuit board. The electronic device includes a first support member disposed on a first surface of the first printed circuit board. The electronic device includes a second support member, disposed on a second surface of the second printed circuit board, facing the first printed circuit board and configured to come into contact with the first support member by an external force applied to the electronic device. The electronic device includes an interposer between the first printed circuit board and the second printed circuit board, surrounding an area between the first surface and the second surface.Type: ApplicationFiled: April 4, 2024Publication date: December 19, 2024Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dohyeong PARK, Junghoon PARK
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Publication number: 20240420596Abstract: A heart model includes a deformable body forming a simulated ventricle therein that expand and contract; and a restraint body outside of the simulated ventricle and having a spiral outer shape, the restraint body regulating deformation of the deformable to generate a twist in the deformable body when the simulated ventricle expands.Type: ApplicationFiled: August 28, 2024Publication date: December 19, 2024Applicant: ASAHI INTECC CO., LTD.Inventors: Nobuyoshi YAMANAKA, Satoshi NAMIMA, Masakazu NAKADA
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Publication number: 20240419031Abstract: A color filter substrate, a display panel and a display device are provided. The color filter substrate includes: a base substrate; a color conversion layer on the base substrate; a covering layer on a side of the color conversion layer away from the base substrate; and a polarizing layer on a side of the covering layer away from the base substrate. The polarizing layer includes a wire grid polarizer. The covering layer includes a first covering sub-layer and a second covering sub-layer, the first covering sub-layer is located on the side of the color conversion layer away from the base substrate, the second covering sub-layer is located on a side of the first covering sub-layer away from the base substrate, and a material of the first covering sub-layer is different from a material of the second covering sub-layer.Type: ApplicationFiled: August 22, 2024Publication date: December 19, 2024Applicant: BOE Technology Group Co., Ltd.Inventors: Ge Shi, Yujie Liu, Shi Shu, Wei Huang, Shiyu Zhang, Yuyao Wang, Yunsik Im, Xiaochuan Chen, Xue Dong, Ming Zhu, Song Yang
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Publication number: 20240420303Abstract: A defect detection method can detect and classify a non-defective product, a defective product including a known defect, and a defective product including an unknown defect.Type: ApplicationFiled: March 31, 2022Publication date: December 19, 2024Applicant: ANAMORPHOSIS NETWORKS CO., LTD.Inventor: Shogo TSUJIMOTO
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Publication number: 20240421026Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure, a heat conduction layer is formed on the electronic element, and a heat dissipation member having a recess portion is disposed on the heat conduction layer to cover the electronic element. Therefore, the arrangement of the recess portion can buffer the flow of the heat conduction layer to facilitate the formation of an intermetallic structure with sufficient thickness between the heat dissipation member and the electronic element, and the heat dissipation effect of the electronic element can meet expectations.Type: ApplicationFiled: August 11, 2023Publication date: December 19, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chiu-Ling CHEN, Shuai-Lin LIU, Pin-Jing SU, Yi-Min FU, Lung-Yuan WANG
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Publication number: 20240418334Abstract: An optical apparatus for a mobility vehicle reduces the overall size of an optical system of the mobility vehicle by implementing a favorable package configuration, ensures sufficient lighting and high luminous efficiency through the efficient operation of a light source, and improves the quality of the lighting image projected onto an illumination area.Type: ApplicationFiled: November 22, 2023Publication date: December 19, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, HYUNDAI MOBIS CO., LTD.Inventors: Hyeong Seon Kim, Young Geun Jun
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Publication number: 20240421697Abstract: The present disclosure discloses a control method and circuit for two-stage current limiting of peak power current, and relates to the technical field of switching power supply control. The control method for two-stage current limiting of peak power current includes the following steps: step 1, detecting a load current of a power supply system; step 2, judging a load current interval of the power supply system; step 3, when the load current of the power supply system is less than the rated power current, enabling the system to work in a constant voltage mode; and when the load current of the power supply system is greater than the rated power current, enabling the system to work in a peak power mode; and step 4, when the load current of the power supply system is greater than the peak power current, starting a protection program.Type: ApplicationFiled: January 23, 2024Publication date: December 19, 2024Applicant: WUXI SI-POWER MICRO-ELECTRONICS CO., LTD.Inventors: Ye LI, Haodan HUANG
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Publication number: 20240421509Abstract: In order to design a cable connection system so as to be operable particularly reliably and to be simultaneously compact, the actuator (1?) is provided at the ends of its actuation arms (122) with an actuation web (123), in the form of a protrusion (13), for reducing friction forces. In order to save on construction space for the collar of an electric cable and for regions of a clamping spring, the actuator (1?) has a receiving opening (120) above the actuation web (123). For the resultantly necessary stabilization, it has stiffening ribs (127) which are integrally formed on the outside of the actuation arms (122). As a result, the actuator (1?) can advantageously be manufactured from plastic and nevertheless have sufficient stability. In addition, the stiffening ribs (127) can be used as an installation aid.Type: ApplicationFiled: October 25, 2022Publication date: December 19, 2024Applicant: HARTING Electric Stiftung & Co. KGInventors: Norbert KROPIEWNICKI, Sergej ZIER
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Publication number: 20240417882Abstract: A seed substrate for epitaxial growth has a support substrate, a planarizing layer of 0.5 to 3 ?m provided on the top surface of the support substrate, and a seed crystal layer provided on the top surface of the planarizing layer. The support substrate includes a core of group III nitride polycrystalline ceramics and a 0.05 to 1.5 ?m encapsulating layer that encapsulates the core having surface voids filled and flattened by Al or Si oxide, nitride, oxynitride, or a mixture thereof. The seed crystal layer is provided by thin-film transfer of 0.1 to 1.5 ?m of the surface layer of Si <111> single crystal with oxidation-induced stacking faults (OSF) of less than 10 defects/cm2.Type: ApplicationFiled: June 23, 2022Publication date: December 19, 2024Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Yoshihiro KUBOTA, Shigeru KONISHI, Hiroshi MOGI, Koichi HIGUCHI
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Publication number: 20240416004Abstract: The invention relates to a coating for an implant component, a method for producing an implant component having said coating, and a use of said coating on an implant component. The coating is intended for an implant component, in particular a spinal implant component, and is a TiNb coating which has, in addition to an atom % proportion of Ti and an atom % proportion of Nb, an atom % proportion of 5-30 atom % of Ag.Type: ApplicationFiled: August 26, 2024Publication date: December 19, 2024Applicant: Waldemar Link GmbH & Co. KGInventors: Helmut D. LINK, Richard CSASZAR
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Publication number: 20240421428Abstract: Disclosed is an electrochemical apparatus. The present disclosure relates to the field of electrochemical energy storage technologies. In the present disclosure, a positive electrode electrolyte solution and a negative electrode electrolyte solution are separated by a solid electrolyte membrane. A high content of a nitrile compound is added to the positive electrode electrolyte solution. A high content of an ether compound is added to the negative electrode electrolyte solution. The nitrile compound may effectively improve stability of a positive electrode interface. The ether compound may effectively improve stability of a negative electrode interface. In this way, a cycle life of an electrochemical apparatus is improved, and in particular, a cycle life of an electrochemical apparatus including metal lithium in a negative electrode is improved.Type: ApplicationFiled: August 28, 2024Publication date: December 19, 2024Applicant: ZHUHAI COSMX BATTERY CO., LTD.Inventors: Wei ZHAO, Suli LI