Abstract: The invention concerns a method for assembling at least two simple sheet metal elements (1, 2, 3, 11, 12, 21, 21?, 22, 22?) for producing a structural part with open section, preferably U-shaped, or closed section, at least one of the metal elements having a high or very high yield strength and low deformability. The invention is characterized in that the metal elements are formed by at least a folding process; the metal elements are arranged relative to each other along a junction section; the metal elements are assembled by a crimped lap-joint (4) along the junction section of said elements.

Abstract: An electroluminescent device comprising two electrodes (3, 5) whereby at least one organic electroluminescent semiconducting layer (4) is arranged therebetween, in addition to a substrate (2) supporting said device, and an electric current source (1) which is electroconductively linked to said electrodes. The inventive device is characterized in that substrate (2) is made or a metal or metal alloy.

Abstract: The invention concerns a beam structure comprising at least a wing (1, 1′) made of at least a first metal and at least a core (2, 2′) made of at least a second metal, said core being assembled substantially perpendicular to said wing and said core being a sheet material or sheet metal. The invention is characterised in that the first metal has a high or very high yield strength, and associated with a yield strength/tensile strength ratio close to 1, the second metal has a yield strength substantially lower than that of the first metal; the second metal has a yield strength/tensile strength ratio substantially less than 0.9 and less than the value of said ratio exhibited by the first metal.

Abstract: A process of depositing a coating (5) onto a substrate (3) by reactive sputtering in a closed chamber (1) in the presence of a plasma of a non-reactive gas, and a reactive gas containing the element or elements said coating has to be made of, according to which process use is made of a target (2) having a surface layer (4) directed towards the substrate and containing at least one of the elements to be sputter deposited onto this substrate, according to which process the thickness of said surface layer (4) during the cathode sputtering is controlled by adjusting the concentration of the gases in said closed chamber (1). The single figure.

Abstract: A process for forming a coating on a substrate by condensation of a coating material onto the substrate while the substrate is moving through an enclosure under vacuum in which evaporation of the coating material takes place. With the inventive process, deposits with controlled structure and adhesion can be made on moving substrate or support even at very high speeds, so that the process can advantageously be carried out continuously or at variable speed.

Abstract: A flat product made of multiphase steel and a method for preparing the steel includes hot rolling at a temperature at which the austenite phase is stable, then tempering to form a C and Mn-enriched phase in a matrix, followed by a heat treatment to form austenite islands and/or enriching in Mn the already formed austenite and cooling down to room temperature so as to obtain a final product with a ferrite matrix containing residual austenite, bainite and/or martensite islands.

Abstract: A bumper beam for motor vehicles includes vertical front and rear plates made of at least one metallic material. At least one elongated core made of metallic material is positioned between the two sole plates. An energy absorber is located at each end of the core and formed of a metallic hollow body, the energy absorber being positioned at right angles to the sole plates or to the core. The metallic materials of the core and the energy absorber have a ratio of elastic limit to breaking stress that is lower than that of the sole plate metallic material and lower than 0.9.

Abstract: The invention concerns a method for making a composite metal product by adding at least one substance to said product, which consists in using a metal product in the form of a continuous strip (1) moved in a vacuum chamber (2), applying the substance on said strip and diffusing said substance at least partially into the strip when it is passing in the vacuum chamber maintaining it at a temperature lower than its melting point, but sufficiently high for enabling said diffusion.

Abstract: Process for the depositing, onto a substrate, of a coating essentially constituted of an electronic conductor compound, in which the said coating is formed by producing alternatively, on the one hand, in at least one depositing zone, one or several deposits of a determined thickness of an electronic conductor element on the substrate, and, on the other hand, in at least one reaction zone, one or several reactions of the element thus deposited with ions of a reactive gas which are implanted into the deposit of the above-mentioned element over approximately this entire thickness determined in a way as to form, preferably with the totality of this element, the said compound, the above-mentioned ions being submitted to a kinetic energy below 2000 V, while the aforesaid thickness of the deposit of the element is determined as a function of the kinetic energy applied in such a way as to allow the implantation of these ions over approximately this entire thickness.

Abstract: Air lock for introducing and continuously passing a strip of a substrate into and through a vacuum chamber, including an enclosure containing at least three successive rollers in the direction of travel of the strip and between which a passage is made for the strip, the first and third rollers being located on one side of this passage, the second roller being located on the opposite side of this passage, an essentially airtight region being formed between the strip and the first and third rollers and connected to a vacuum pump, a component being provided for adjusting the pressure with which the strip rests on the rollers.

Abstract: A process for forming a coating on a substrate by condensation of a coating material onto the substrate while the substrate is moving through an enclosure under vacuum in which evaporation of the coating material takes place.

Abstract: Process for the depositing, onto a substrate, of a coating essentially constituted of an electronic conductor compound, in which the said coating is formed by producing alternatively, on the one hand, in at least one depositing zone, one or several deposits of a determined thickness of an electronic conductor element on the substrate, and, on the other hand, in at least one reaction zone, one or several reactions of the element thus deposited with ions of a reactive gas which are implanted into the deposit of the above-mentioned element over approximately this entire thickness determined in a way as to form, preferably with the totality of this element, the said compound, the above-mentioned ions being submitted to a kinetic energy below 2000 V, while the aforesaid thickness of the deposit of the element is determined as a function of the kinetic energy applied in such a way as to allow the implantation of these ions over approximately this entire thickness.

Abstract: Process for continuously stripping the surface of a substrate moving in a defined direction through a vacuum chamber past at least one counterelectrode, according to which process a plasma is created in a gas, between this counterelectrode and this surface, so as to generate radicals and/or ions which can act on the surface to be stripped, characterized in that at least one pair of successive counterelectrodes, past which the abovementioned chamber and in that an alternating potential is applied to these counterelectrodes so as to impose on the latter an alternately positive and negative potential with respect to the substrate.

Abstract: Process for the depositing, onto a substrate, of a coating essentially constituted of an electronic conductor compound, in which the said coating is formed by producing alternatively, on the one hand, in at least one depositing zone, one or several deposits of a determined thickness of an electronic conductor element on the substrate, and, on the other hand, in at least one reaction zone, one or several reactions of the element thus deposited with ions of a reactive gas which are implanted into the deposit of the above-mentioned element over approximately this entire thickness determined in a way as to form, preferably with the totality of this element, the said compound, the above-mentioned ions being submitted to a kinetic energy below 2000 V, while the aforesaid thickness of the deposit of the element is determined as a function of the kinetic energy applied in such a way as to allow the implantation of these ions over approximately this entire thickness.

Abstract: A process for annealing a moving metal substrate, especially a steel sheet.

Abstract: Disclosed is a process for forming a coating on a substrate (2,2') by cate sputtering, comprising the coating of substrate surfaces (2,2') which have been transferred to a cathode sputtering chamber (1). The substrates vary in width and have a predetermined maximum width. The process involves the use of a target (3) whose surface (4) has an invariable length corresponding approximately to said maximum substrate width. A shift takes place, in accordance with the width of the substrate being coated, between the surface (4) of the target and the substrate surface to be coated, so that the entire surface of the target remains more or less constantly in front of the surface to be coated during the cathode sputtering process.

Abstract: Process and device for continuously pickling at least one of the sides of a substrate (1), according to which this substrate (1) is moved according a predetermined direction between an anode (8), with respect to which it is polarised negatively, and at least one magnetic circuit (2) disposed opposite this anode (8), the side to be pickled being directed towards the anode (8), and, in the proximity of this side, a plasma (10) is created in a gas so as to generate radicals and/or ions acting thereon, use being made of means enabling to adjust the width of the field of action of the magnetic circuit to the width of the zone of the substrate (1) which is to be pickled.

Abstract: A stamping press comprising a blank-holder force-regulating system using fluid-operated compensating cylinders (5, 7). The variation in the force in the blank-holder pressure-regulating areas is thus compensated so as to maintain a predetermined constant pressure in the conventional blank-holder area. This pressure in the conventional blank-holder area can, by virtue of the invention, according to certain alternative embodiments, also be made to vary.

Abstract: A product for forming a coating on a support, in particular a protective coating against corrosion, photonic degradation and/or against gas penetration, comprising a halogenated polymer and/or copolymer activated by at least one peroxide and/or hydroperoxide function to which at least one phosphonated chain is attached.

Abstract: A method and apparatus for continuously treating a strip of hot dip-galvanized steel. The method comprises the steps of rapidly reheating the strip to a predetermined temperature between 460.degree. C. and 600.degree. C., with a heating flux greater than 180 kWatts per meter squared based for each face of the strip; maintaining the strip at a substantially constant temperature for a predetermined period of time lasting between 10 and 30 seconds; and subsequently cooling the strip rapidly to a temperature below 420.degree. C., using a cooling flux of a magnitude greater than 100 kWatts per meter squared for each face of the strip. The step of rapidly reheating is performed following a drying operation conducted on the strip as it exits from a zinc bath.