Abstract: Systems and method for automatically assembling a multi-fiber optical ferrule. Holes are drilled or etched in a thin, flat substrate. A vacuum gripper and further alignment components are used to provide sufficient lateral alignment for insertion of the optical fibers. The protrusion of each optical fiber is detected on an output side of the substrate, and an adhesive is applied to attach the fibers to the substrate.

Abstract: Systems and method for attaching optical elements to a multi-fiber ferrule. The method may include the steps of acquiring a ferrule having a plurality of holes and an output side; providing an optical element having a flat surface such that an orientation of the flat surface of the optical element is facing the output side of the ferrule within a predetermined tolerance; applying an adhesive to the flat surface of the optical element or the output side of the ferrule, the adhesive selected to match the refractive index of the optical element; moving at least one of the optical element and the ferrule with a controlled velocity and acceleration such that the flat surface of the optical element pushes against all of the protruding fibers; and curing the applied adhesive to attach the optical element to the ferrule.

Abstract: A method for assembling an optical interconnect apparatus is provided. The optical interconnect comprises an integrated circuit chip, and at least one optoelectronic chip positioned on the integrated circuit chip, each of the at least one optoelectronic chip including a 2-dimensional optoelectronic array. The optical interconnect further comprises a first and a second microlens array, a bundle of optical fibers coupled to each second microlens array and supported by a bundle housing, and a block structure supporting the bundle housing to a printed circuit board (PCB).

Abstract: A fiber optic bundle including a coupler and a large matrix of fibers assembled from optical ribbons positioned very accurately in the coupler. Preferably, the coupler includes at least two plates, most preferably silicon plates, with a plurality of fiber receiving guides etched therethrough.

Abstract: A packet switching system for a packet transfer network, the system having an architecture including a plurality of line cards, each including an ingress path pipeline, with processing elements, and an egress buffer, and an electro-optical In/Out (IO) interconnect coupling the line cards to one another in a full mesh connectivity, in the absence of a switch fabric, wherein the ingress path pipeline of each line card is coupled by means of the electro-optical IO interconnect to the egress buffer of each of the plurality of line cards.

Abstract: A distributed switchless system characterized by full mesh connectivity is disclosed. The full mesh distributed switchless system allows direct and indirect communication between a source node and a destination node. In direct communication, data propagates via links connecting the source and destination nodes. In indirect communication, data is first sent to an intermediate node via links connecting the source and intermediate nodes. The intermediate node sends the data to the destination node via links connecting the intermediate node and the destination node. The traffic can be divided into all available links across the nodes, rather than only the links connecting the source and destination nodes. Because indirect communication uses more links compared to direct communication, the traffic in each link is smaller. Consequently, the switchless distributed interconnect system can operate with fewer links between any two nodes and links with smaller bandwidth.

Abstract: The present disclosure allows connection between optical and electrical devices at high frequencies and high bit rate. The present disclosure provides an electro-optical device that includes an optical interface for optical signal transmission and reception; an electrical interface for electrical signal transmission and reception; a data and signal unit located inside an integrated circuit chip coupled to the optical interface and to the electrical interface for manipulating data received through said interfaces; and a processing unit located inside the integrated circuit chip coupled to the optical interface and to the electrical interface for processing digital data received through said interfaces. The present disclosure provides devices that achieve smaller physical dimensions with an increased number of interfaces to allow greater throughput of data into and out of the integrated circuit.

Abstract: A passive connectivity optical module (“PassCOM”) is disclosed. A PassCOM is a passive device without a switching functionality. A PassCOM connects links between a plurality of nodes using replaceable plugs. The device can be used for an internal inter-node switching system, where each node is capable of sending data to a destination using a specific link. A source node sends data through a particular link that is connected to a link from a destination node in the PassCOM. Data is first sent from a source node through a link connecting the source node and the PassCOM, then the data is transmitted, through a plug, to the destination node using a link connecting the PassCOM and the destination.

Abstract: A switching Clos network universal element that can dynamically change its role is disclosed. The universal element contains a matrix of VCSELs and a matrix of photodiodes on top of an electro-optical chip. The matrix of VCSELs sends data via a first set of optical links, and the matrix of photodiodes receives data a second set of optical links. The universal element also receives and sends data through electronic links. The universal element can function as an expander, aggregator or transitive switch in a folded Clos network. As an expander or an aggregator, the universal element uses its optical links as ingress links and its electronic links as egress links. Using this universal element, a network can be constructed without separate switching elements. Multiple universal elements can be positioned on a PCB, and the multiple universal elements can function as one switch.

Abstract: A multi-chassis router with passive interconnect and distributed switchless interconnect for connecting a plurality of nodes in full mesh is disclosed. This system allows direct and indirect communication between a source node and a destination node. In direct communication, data propagates via links connecting the source and destination nodes. In indirect communication, data is first sent to an intermediate node via links connecting the source and intermediate nodes. The intermediate node sends the data either to the destination node via links connecting the intermediate node and the destination node. A passive device with replaceable plugs connects the plurality of nodes in full mesh. The passive device facilitates setting up and updating a network.

Abstract: An optical interconnect uses large 2-dimensional matrices of optoelectronic chips. The optoelectronic chips are placed directly above the analog circuitry required to drive them and with the microlens array placed on top of the optoelectronic chip. A single microlens array is assembled directly on top of the 2-dimensional optoelectronic chip. The optoelectronic chips may include vertical cavity surface emitting lasers (VCSEL) for signal generation and p-i-n photodiodes for signal detection. A bundle of optical fibers or waveguides with a layout identical to the optoelectronic chips is used for optical data transfer between constituents of the optical communication system.

Abstract: A Ternary Content Addressable Memory (TCAM)-based Longest Prefix Match (LPM) lookup table including a TCAM holding a plurality of prefix entries for looking up results in an associated RAM, the associated RAM storing results corresponding to TCAM match indices; additional Random Access Memory (RAM) storing results from the associated RAM; and one entry in the TCAM representing at least two entries in the additional RAM from the associated RAM, whereby at least one entry in the TCAM is made available.

Abstract: A method of error mitigation for transferring packets over a chip-to-chip data interconnect using a high speed interconnect protocol, the method including grouping a pre-selected number of high speed interconnect protocol words to form a protection frame, adding at least one additional error protection bit to each word in the group, adding a synchronization bit to each word, using the synchronization bit in a first word in each frame for synchronization of the protection frame and detecting and correcting a single bit error in the protection frame using the additional error protection bits, thereby reducing packet drop when the frames are transferred over the high speed data interconnect.

Abstract: Systems and methods are provided for controlling optical connectors. A float mechanism for controlling an optical connector can include a pin, a first and a second shaft assembly, and a base. The base can include a first and a second cantilever, and a housing, that defines an opening for receiving the pin. The base can receive the two shaft assemblies. The float mechanism can further include a tab with multiple surfaces and be configured to receive the pin.

Abstract: The present disclosure allows connection between optical and electrical devices at high frequencies and high bit rate. The present disclosure provides an electro-optical device that includes an optical interface for optical signal transmission and reception; an electrical interface for electrical signal transmission and reception; a data and signal unit located inside an integrated circuit chip coupled to the optical interface and to the electrical interface for manipulating data received through said interfaces; and a processing unit located inside the integrated circuit chip coupled to the optical interface and to the electrical interface for processing digital data received through said interfaces. The present disclosure provides devices that achieve smaller physical dimensions with an increased number of interfaces to allow greater throughput of data into and out of the integrated circuit.

Abstract: A switching Clos network universal element that can dynamically change its role is disclosed. The universal element contains a matrix of VCSELs and a matrix of photodiodes on top of an electro-optical chip. The matrix of VCSELs sends data via a first set of optical links, and the matrix of photodiodes receives data a second set of optical links. The universal element also receives and sends data through electronic links. The universal element can function as an expander, aggregator or transitive switch in a folded Clos network. As an expander or an aggregator, the universal element uses its optical links as ingress links and its electronic links as egress links. Using this universal element, a network can be constructed without separate switching elements. Multiple universal elements can be positioned on a PCB, and the multiple universal elements can function as one switch.

Abstract: A distributed switchless system characterized by full mesh connectivity is disclosed. The full mesh distributed switchless system allows direct and indirect communication between a source node and a destination node. In direct communication, data propagates via links connecting the source and destination nodes. In indirect communication, data is first sent to an intermediate node via links connecting the source and intermediate nodes. The intermediate node sends the data to the destination node via links connecting the intermediate node and the destination node. The traffic can be divided into all available links across the nodes, rather than only the links connecting the source and destination nodes. Because indirect communication uses more links compared to direct communication, the traffic in each link is smaller. Consequently, the switchless distributed interconnect system can operate with fewer links between any two nodes and links with smaller bandwidth.

Abstract: A multi-chassis router with passive interconnect and distributed switchless interconnect for connecting a plurality of nodes in full mesh is disclosed. This system allows direct and indirect communication between a source node and a destination node. In direct communication, data propagates via links connecting the source and destination nodes. In indirect communication, data is first sent to an intermediate node via links connecting the source and intermediate nodes. The intermediate node sends the data either to the destination node via links connecting the intermediate node and the destination node. A passive device with replaceable plugs connects the plurality of nodes in full mesh. The passive device facilitates setting up and updating a network.

Abstract: A passive connectivity optical module (“PassCOM”) is disclosed. A PassCOM is a passive device without a switching functionality. A PassCOM connects links between a plurality of nodes using replaceable plugs. The device can be used for an internal inter-node switching system, where each node is capable of sending data to a destination using a specific link. A source node sends data through a particular link that is connected to a link from a destination node in the PassCOM. Data is first sent from a source node through a link connecting the source node and the PassCOM, then the data is transmitted, through a plug, to the destination node using a link connecting the PassCOM and the destination.

Abstract: A matrix processor and processing method, the processor including a data encoder for receiving an input data stream; a data controller coupled to the data encoder for arranging the input data in an operand matrix, at least one processing unit for processing the data in matrix form by Boolean matrix-matrix multiplication with a selected operator matrix, and an output control module coupled to the processing unit for outputting desired results therefrom.