Abstract: A Ternary Content Addressable Memory (TCAM)-based Longest Prefix Match (LPM) lookup table including a TCAM holding a plurality of prefix entries for looking up results in an associated RAM, the associated RAM storing results corresponding to TCAM match indices; additional Random Access Memory (RAM) storing results from the associated RAM; and one entry in the TCAM representing at least two entries in the additional RAM from the associated RAM, whereby at least one entry in the TCAM is made available.

Abstract: A matrix processor and processing method, the processor including a data encoder for receiving an input data stream; a data controller coupled to the data encoder for arranging the input data in an operand matrix, at least one processing unit for processing the data in matrix form by Boolean matrix-matrix multiplication with a selected operator matrix, and an output control module coupled to the processing unit for outputting desired results therefrom.

Abstract: A bit-matrix processor including a pair of optoelectronic matrices and a controller for causing the matrices to perform Boolean Matrix transforms to perform logical operations, wherein Boolean logical equivalents include logical AND to replace element-wise multiplication, and logical OR instead of summation. According to one embodiment, the processor includes an optical source matrix for receiving input binary data; a passive optical replicator for replicating a pattern on the optical source matrix and projecting it onto a Spatial Light Modulator (SLM); a database loading device for loading data onto the SLM thereby to perform logical AND with the optical source matrix data; an integrating device for integrating light from the SLM onto a photodiode matrix; and an output signal processing device.

Abstract: An optoelectronic chip assembly including a printed circuit board (PCB) coupled to a substrate, an aperture formed through the printed circuit board and through the substrate, a heat sink, an array of active electro-optical elements mounted in the aperture and connected to a driving chip controlled by the PCB, wherein the driving chip is coupled to the heat sink. Preferably, the assembly further includes a plurality of passive optical elements disposed for optical communication and data transfer with said active electro-optical elements, but thermally isolated therefrom.