Abstract: A system and apparatus for constructing a displacement model across a frequency range for a loudspeaker is disclosed. The resultant displacement model is centered around the distortion point. Once a distortion model is constructed it can be incorporated into an audio driver to prevent distortion by incorporating the model and a distortion compensation unit with a conventional audio driver. Various topologies can be used to incorporate a distortion model and distortion compensation unit into an audio driver. Furthermore, a wide variety of distortion compensation techniques can be employed to avoid distortion in such an audio driver.

Abstract: Presented is a method and associated system for suppression of linear and nonlinear echo. The method includes dividing an input signal into several frequency bands in each of a several of time frames. The input signal may include an echo signal. The method further includes multiplying the input signal in each of the several frequency bands by a corresponding echo suppression signal. Calculating the corresponding echo suppression signal may include estimating a power of the echo signal in a particular frequency band as a sum of several component echo powers, each of the several component echo powers due to an excitation from a far-end signal in a corresponding one of the several frequency bands. Calculating the corresponding echo suppression signal may further include subtracting the power of the echo signal in the particular frequency band from a power of the input signal in the particular frequency band.

Abstract: A system for cloud-based facsimile services comprising a cloud facsimile sending device configured to be coupled to a network, to generate image data of a document and to transmit the image data over the network. A cloud facsimile receiving device configured to be coupled to the network, to receive the image data and to generate image status data over the network. A cloud facsimile service configured to be coupled to the network and to receive the image data from the cloud facsimile sending device, to process the image data as a function sender data and recipient data, to transmit the image data to the cloud facsimile receiving device, to receive the image status data from the cloud facsimile receiving device and to transmit the image status data to the cloud facsimile sending device.

Abstract: A level shifter comprising a first driver transistor for receiving an input signal. A gate-controlled transistor coupled to the first driver transistor. A second driver transistor coupled to the gate controlled transistor. An output coupled to the second driver transistor, wherein the gate-controlled transistor is for receiving a predetermined gate voltage when the output voltage exceeds a predetermined value.

Abstract: Systems and methods for coexistence of WLAN and Bluetooth networks are described. At least one embodiment includes a method for operating a wireless device in both a 802.11 network and a Bluetooth network. In accordance with some embodiments, the method comprises monitoring transmission of Synchronous Connection Oriented (SCO) slots over the Bluetooth network, informing an access point (AP) in the 802.11 network not to transmit to the device before the end of an SCO slot, transmitting a power save trigger to the AP to retrieve buffered data from the AP, and transmitting data to the AP.

Abstract: Traditionally, echo cancellation has employed linear adaptive filters to cancel echoes in a two way communication system. The rate of adaptation is often dynamic and varies over time. Disclosed are novel rates of adaptation that perform well in the presence of background noise, during double talk and with echo path changes. Additionally, the echo or residual echo can further be suppressed with non-linear processing performed using joint frequency-time domain processing.

Abstract: A database system comprising a plurality of access keys stored in a first data memory device sector, each access key associated with a node value stored in a second data memory device sector. An access key processor configured to receive an input value and return the associated node value for the input value if the input value matches an access key stored in the first data memory device sector. The access key processor is configured to generate a revised input value if the input value does not match an access key stored in the first data memory device; a default node value stored in the second data memory device sector and associated with a portion of the input value, wherein the access key processor is configured to return the default node value as part of the revised input value.

Abstract: A grounding switch is described which operates properly even in the presence of negative voltages on a signal line. The grounding switch uses isolated field effect transistors that have their substrates tied to different voltages. The isolated field effect transistor has a gate voltage and substrate voltage which can be pulled down to a negative voltage when the signal line has a negative voltage allowing the switch to remain open even with a negative voltage.

Abstract: A power-saving block may be isolated from a remainder of a digital circuit. To save power, the power-saving block may be powered down when not in use. To prevent the power-down process from creating metastable states in the remainder of the digital circuit, appropriate isolation gates may separate outputs of the power-saving block from the remainder of the digital circuit. Signals may be sent to the power-saving block to ensure that the output signals from the power-saving block are always the same value during the power-down process. The isolation gates may be chosen based on the value expected on the output signals during the power-down process. Assertions may be used to confirm that the correct isolation gates were selected.

Abstract: A circuit for generating a signal comprising a first transistor having a drain, a gate and a source. A second transistor having a drain, a source and a gate coupled to the gate of the first transistor to form a current mirror. A current source coupled to the source of the first transistor. A diode-connected transistor having a drain coupled to the source of the second transistor, a source and a gate that forms an output. A variable resistor having a first terminal coupled to the source of diode-connected transistor and a second terminal. A capacitor coupled to the second terminal of the variable resistor.

Abstract: A system for current mode sample and hold, comprising a first PMOS transistor configured to generate a current to be sampled. A diode-connected NMOS transistor coupled to the first PMOS transistor and configured to receive the current. A switch coupled to the diode-connected NMOS transistor and configured to sample a gate-source voltage of the diode-connected NMOS transistor. A capacitor coupled to the switch and configured to stored the gate-source voltage of the diode-connected NMOS transistor. A second NMOS transistor coupled to the capacitor and configured to generate a current equal to the sampled current value.

Abstract: This disclosure provides systems and methods for decoupling the mechanical drive systems of image scanners from the exposure system. A light source, such as an array of light-emitting diodes (LEDs), may be modulated in order to maintain a constant exposure for each scan-line, regardless of the document velocity. Accordingly, the present systems and methods allow for continuous document scanning at varying speeds. An automatic document feeder may dynamically adjust the velocity of a document without negatively impacting the exposure of the image scan. As the velocity of the document is changed, the modulation rate of the light source may be adjusted to maintain a constant exposure.

Abstract: A driver controller comprising a state machine for controlling transitions between a plurality of states. An output switch for providing a low impedance path to ground during transition periods. An output stage for decoupling output signal from driver amplifier during the transition periods.

Abstract: There is provided a system and method for a copper stud bump wafer level package. There is provided a semiconductor package comprising a semiconductor die having a plurality of bond pads on an top surface thereof, a plurality of metallic stud bumps mechanically and electrically coupled to said plurality of bond pads, and a plurality of solder balls mechanically and electrically coupled to said plurality of metallic stud bumps. Advantageously, the metallic stud bumps may be provided using standard wirebonding equipment, avoiding the conventional wafer level package requirement for photolithography and deposition steps to provide a multi-layer metallic routing structure. As a result, reduced cycle times, lower cost, and reduced complexity may be provided. Alternative fabrication processes utilizing metallic stud bumps may also support multi-die packages with dies from different wafers and packages with die perimeter pads wirebonded to substrates.

Abstract: There is provided a system and method for a spot plated leadframe and an IC bond pad via array design for copper wire. There is provided a semiconductor package comprising a leadframe having a pre-plated finish and a spot plating on said pre-plated finish, a semiconductor die including a bond pad on a top surface thereof, and a copper wire bonded to said spot plating and to said bond pad. Optionally, a novel corner via array design may be provided under the bond pad for improved package performance while maintaining the integrity of the copper wire bond. The semiconductor package may provide several advantages including high MSL ratings, simplified assembly cycles, avoidance of tin whisker issues, and low cost compared to conventional packages using gold wire bonds.

Abstract: There is provided a system and method for a shielded connector module with a molded hood and an LED light pipe. There is provided a shielded connector module comprising a system-in-package (SiP) device having a surface mounted light emitting diode (LED), a metallic shield surrounding the SiP device, a molded hood surrounding the metallic shield, and an LED light pipe in a proximity with the surface mounted LED, the LED light pipe being directed through the metallic shield and the molded hood. By designing the LED light pipe with a concave surface for surrounding the surface mounted LED and by using various techniques to reduce a gap between the LED and the light pipe, light capture and transmission may be optimized for easily viewable high intensity light. A fresnel lens may be optionally attached to the light pipe for wider viewing angles.

Abstract: A satellite signal demodulator is configured to use frequency-based channel scanning to sense the presence of a channel and to obtain the frequency profile of the channel. Once the channel is identified and the profile is obtained, channel extraction is used to identify the frequency parameters for a given channel. A coarse parameter estimation is performed to obtain a coarse estimate of the symbol rate (SR) and the center frequency (fc) of the channel. The coarse estimation can then be followed by a fine estimation of the symbol rate and center frequency (fc), using a bit tracking loop (BTL) lock indicator.

Abstract: Wafer level packaging (WLP) packages semiconductor dies onto a wafer structure. After the wafer level package is complete, individual packages are obtained by singulating the wafer level package. The resulting package has a small form factor suitable for miniaturization. Unfortunately conventional WLP have poor heat dissipation. An interposer with a thermal pad can be attached to the semiconductor die to facilitate improved heat dissipation. In one embodiment, the interposer can also provide a wafer substrate for the wafer level package. Furthermore, the interposer can be constructed using well established and inexpensive processes. The thermal pad attached to the interposer can be coupled to the ground plane of a system where heat drawn from the semiconductor die can be dissipated.

Abstract: Provided is a fully differential adaptive bandwidth phase locked loop with differential supply regulation. One fully differential phase locked loop includes a differential active loop filter and regulator coupled to an output of a differential charge pump, a differential voltage-controlled oscillator coupled to differential control voltages developed by the differential active loop filter and regulator, and a bias circuit coupled to the differential control voltages and providing a bias current to the differential charge pump.

Abstract: Presented is a method and associated system for suppression of linear and nonlinear echo. The method includes dividing an input signal into several frequency bands in each of a several of time frames. The input signal may include an echo signal. The method further includes multiplying the input signal in each of the several frequency bands by a corresponding echo suppression signal. Calculating the corresponding echo suppression signal may include estimating a power of the echo signal in a particular frequency band as a sum of several component echo powers, each of the several component echo powers due to an excitation from a far-end signal in a corresponding one of the several frequency bands. Calculating the corresponding echo suppression signal may further include subtracting the power of the echo signal in the particular frequency band from a power of the input signal in the particular frequency band.