Patents Assigned to CONEXANT SYSTEMS
  • Publication number: 20120241954
    Abstract: There is provided a system and method for unpackaged and packaged IC stacked in a system-in-package module. There is provided a system-in-package module comprising a substrate including a first contact pad and a second contact pad disposed thereon, a packaged device disposed on the substrate, and an unpackaged device stacked atop the packaged device, wherein a first electrode of the packaged device is electrically and mechanically coupled to the first contact pad, and wherein a second electrode of the unpackaged device is electrically coupled to the second contact pad. The structure of the disclosed system-in-package module provides several advantages over conventional designs including increased yields, facilitated die substitution, enhanced thermal and grounding performance through direct connect vias, stacking of wider devices without a spacer, and a simplified single package structure for reduced fabrication time and cost.
    Type: Application
    Filed: March 24, 2011
    Publication date: September 27, 2012
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: Robert W. Warren, Nic Rossi
  • Publication number: 20120218086
    Abstract: This disclosure provides systems and methods for detecting a change in environmental conditions utilizing sampling circuitry configured to sample an environmental sensor while a processor remains in a low-power state or a sleep state. According to some embodiments, a pre-filter performs a simplified analysis of the sensor samples to determine if the processor should wake and perform additional analysis on stored sensor samples. Specific examples are provided for detecting motion using passive infrared detectors. Accordingly, systems and methods for reducing the power consumption of a motion detection system are provided herein.
    Type: Application
    Filed: February 28, 2011
    Publication date: August 30, 2012
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: Mark E. Miller, Guy Rahamim
  • Publication number: 20120188738
    Abstract: There is provided a system-in-package (SiP) module that comprises a substrate, a semiconductor die attached to the substrate, a mold compound which encapsulates the semiconductor die, and an LED (light emitting diode) component attached to the substrate, where the LED component is at least partially located within the SiP module, such that the LED component can emit lights to outside of the SiP module.
    Type: Application
    Filed: January 25, 2011
    Publication date: July 26, 2012
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: Robert W. Warren, Nic Rossi
  • Publication number: 20120182915
    Abstract: Stations in standby mode periodically wake up to check for buffered data at the access points. Traditionally, the information is available by checking the periodic beacon frame for a traffic indication map (TIM). Unfortunately, the length of beacons has steadily increased with the progression of the various wireless standards requiring stations to wake up for longer periods to merely check for buffered data. Several approaches are disclosed which address this shortcoming, including the broadcast of TIM frames, the partial reception of beacon frames and the use of an embedded TIM frame within a beacon frame.
    Type: Application
    Filed: March 21, 2012
    Publication date: July 19, 2012
    Applicant: CONEXANT SYSTEMS, INC.
    Inventor: Maarten Menzo Wentink
  • Publication number: 20120119341
    Abstract: An example semiconductor package with reduced solder voiding is described, which has a leadframe having an I/O pad and a thermal pad, a fabricated semiconductor die having a bond pad, where the fabricated semiconductor die is attached to a top surface of the thermal pad, and a wire bond connecting the bond pad to the I/O pad, where a bottom surface of the thermal pad has channels.
    Type: Application
    Filed: November 16, 2010
    Publication date: May 17, 2012
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: Robert W. Warren, Hyun Jung Lee, Nic Rossi
  • Publication number: 20120104591
    Abstract: Today's high speed semiconductor chips offer high performance at the expense of increase heat generation. A heat spreader can be build into a mold compound covering a semiconductor die in a semiconductor package by forming holes in the mold compound and filling the holes with a thermally conductive material such as thermally conductive adhesive. This heat dissipation capability can further be enhanced by a layer of thermally conductive material on the surface of the mold compound and optionally by an external metal layer or heat sink.
    Type: Application
    Filed: October 29, 2010
    Publication date: May 3, 2012
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: Robert W. Warren, Nic Rossi
  • Publication number: 20120044023
    Abstract: A circuit for providing a reference voltage can be widely used in audio applications. However, at startup an abrupt start in the reference signal can cause undesirable audible artifacts. A circuit employing feedback of a reference voltage to control the charging of a capacitor which provides the reference voltage can be used to provide a smooth startup to the reference voltage. The circuit contains a differential pair for steering a fixed current source from one path to another as the reference voltage increases. The steered current can then be mirrored into one or more current mirrors where the newly mirrored current can be squeezed to zero when the difference between a desired reference voltage and the reference voltage approaches zero. This newly mirrored current can be used to charge a capacitor which is used to provide the reference voltage.
    Type: Application
    Filed: August 20, 2010
    Publication date: February 23, 2012
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: Christian Larsen, Gomathi Komanduru, Lorenzo Crespi
  • Publication number: 20120032350
    Abstract: The addition of thermal conduits by bonding bond wires to bond pads either in a wire loop configuration or a pillar configuration can improve thermal dissipation of a fabricated die. The thermal conduits can be added as part of the normal packaging process of a semiconductor die and are electrically decoupled from the circuitry fabricated on the fabricated die. In an alternative, a dummy die is affixed to the fabricated die and the thermal conduits are affixed to the dummy die. Additionally, thermal conduits can be used in conjunction with a heat spreader.
    Type: Application
    Filed: August 6, 2010
    Publication date: February 9, 2012
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: Robert W. Warren, Jianjun Li, Nic Rossi
  • Publication number: 20120033275
    Abstract: A system and method for defringing chromatic aberrations that occur in imaging devices such as scanners. The system comprises shift filters to shift lines in the various color planes together. In addition in each color plane, a spread filter is used to compensate for the unequal point spread functions of each color. Furthermore, the results can be enhanced by filtering in the luminance-chrominance space.
    Type: Application
    Filed: August 5, 2010
    Publication date: February 9, 2012
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: RAGNAR H. JONSSON, DEREK T. WALTON, TRAUSTI THORMUNDSSON
  • Publication number: 20120008788
    Abstract: In many audio playback systems, frequencies below a given cut off frequency are suppressed either due to speaker constraints or safety constraints. For example, some speakers are only capable of generating signals above a certain frequency. Prolonged low frequency sound can cause damage to speakers or other components. An audio driver can be equipped with a phantom bass module which by doubling, tripling and/or quadrupling frequencies below a cutoff frequency can simulate the bass experience. The doubling, tripling and quadrupling methods disclosed provide a low complexity formulation of a frequency doubling, tripling and quadrupling. In addition, the frequency doubling, tripling and quadrupling formulations are easily adapted to multi-rate processing, where computational savings can be very high.
    Type: Application
    Filed: July 9, 2010
    Publication date: January 12, 2012
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: RAGNAR H. JONSSON, TRAUSTI THORMUNDSSON, HARRY K. LAU
  • Publication number: 20120002821
    Abstract: A grounding switch is described which operates properly even in the presence of negative voltages on a signal line. The grounding switch uses isolated field effect transistors that have their substrates tied to different voltages. The isolated field effect transistor has a gate voltage and substrate voltage which can be pulled down to a negative voltage when the signal line has a negative voltage allowing the switch to remain open even with a negative voltage.
    Type: Application
    Filed: July 1, 2010
    Publication date: January 5, 2012
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: CHRISTIAN LARSEN, LORENZO CRESPI
  • Publication number: 20110310144
    Abstract: Dielectric heating is used to cause explosive nucleation of ink in an ink reservoir to expel a drop of ink from an inkjet print head. Conductive plates generate an alternating electric field at microwave frequencies across an ink reservoir causing the ink to heat. Since the ink is heated without heating the conductive plates, less heat dissipation of the inkjet print head is necessary.
    Type: Application
    Filed: June 22, 2010
    Publication date: December 22, 2011
    Applicant: CONEXANT SYSTEMS, INC.
    Inventor: MICHAEL O. CHANDLER
  • Publication number: 20110302354
    Abstract: Multi-level cell (MLC) flash memory has become widely used due to their capacity to store more information in the same area as a single-level cell (SLC) flash memory. This makes MLC flash memory very attractive for storing media. Flash has also traditionally been used in electronic devices for firmware, but MLC flash is less reliable than SLC flash. For critical memory operations, MLC flash memory can be made as reliable as SLC flash by mapping one binary value to an MLC state corresponding to the highest threshold voltage and the other binary value to the MLC state corresponding the lowest threshold voltage when writing to the MLC flash, and by mapping all MLC states with corresponding threshold voltages above a central cutoff threshold voltage to one binary value and by mapping all MLC states with corresponding threshold voltages below a central cutoff threshold voltage to the other binary value.
    Type: Application
    Filed: June 2, 2010
    Publication date: December 8, 2011
    Applicant: CONEXANT SYSTEMS, INC.
    Inventor: Mark E. Miller
  • Publication number: 20110254711
    Abstract: Poly-phase filters are used to offer an efficient and low complexity solution to rate conversion. However, they suffer from inflexibility and are not easily reconfigured. A novel design for rate converters employ poly-phase filters but utilize interpolation between filter coefficients to add flexibility to rate conversion. This interpolation can be implemented as an interpolation of the poly-phase filter results. Additional approximations can be made to further reduce the amount of calculations required to implement a flexible rate converter.
    Type: Application
    Filed: February 17, 2011
    Publication date: October 20, 2011
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: Ragnar H. Jonsson, Vilhjalmur S. Thorvaldsson, Trausti Thormundsson
  • Publication number: 20110170683
    Abstract: Traditionally, echo cancellation has employed linear adaptive filters to cancel echoes in a two way communication system. The rate of adaptation is often dynamic and varies over time. Disclosed are novel rates of adaptation that perform well in the presence of background noise, during double talk and with echo path changes. Additionally, the echo or residual echo can further be suppressed with non-linear processing performed using joint frequency-time domain processing.
    Type: Application
    Filed: January 8, 2010
    Publication date: July 14, 2011
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: Youhong Lu, Trausti Thormundsson, Yair Kerner, Ragnar H. Jonsson
  • Publication number: 20110110607
    Abstract: A method of rotating a digital image includes performing a first pass to process a selected image tile of a source image. The first pass includes copying a set of pixels of the selected image tile from a first memory to a processor memory, where the set of pixels comprises a portion of the selected image tile. The first pass further includes grouping the set of pixels into blocks of pixels and writing each of the blocks of pixels to a memory location. The method further includes repeating the first pass until each of the pixels of the selected image tile is processed, performing a second pass to process the blocks of pixels, and repeating the second pass until each of the blocks of pixels is processed. The second pass includes copying blocks of pixels, regrouping the blocks of pixels, and writing the regrouped pixels to a destination image location.
    Type: Application
    Filed: January 21, 2011
    Publication date: May 12, 2011
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: Derek T. Walton, Jim Duda
  • Publication number: 20110080191
    Abstract: A triangular waveform generator is converted to a free running oscillator controlled by a calibration code. The free running oscillator can be synchronized to an external clock signal by comparing the external clock frequency to the frequency of the triangular waveform and adjusting the calibration code until the discrepancy in frequency is minimized.
    Type: Application
    Filed: October 6, 2009
    Publication date: April 7, 2011
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: Ketan B. Patel, Lorenzo Crespi, Lakshmi P. Murukutla
  • Publication number: 20110050467
    Abstract: Class-D amplifiers have evolved from using binary pulse-width modulation (PWM) modulators to three-level PWM modulators. Three-level PWM drivers for audio applications offer the benefits of eliminating costly elements at the output of an audio system. However, they also introduce increased common-mode interference. Three-level PWM generates three states, but one state has two interchangeable representations which can be scrambled in order to shape the common-mode output spectrum.
    Type: Application
    Filed: September 2, 2009
    Publication date: March 3, 2011
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: Lorenzo Crespi, Ketan B. Patel, Kyehyung Lee
  • Publication number: 20110037822
    Abstract: Laser printers are plagued with an assortment of alignment issues. In color laser printers the issues are exacerbated. Variations in distance from the mirror to the drum can lines in different color planes to vary in size. Variations in angles in the facets of the mirror can cause alignment issues between lines. Even lack of synchronization between the dot clock and start of line indication can cause misalignment between rows. In addition, a cosine distortion occurs due to the non-constant linear velocity of the laser scan of a single line. A very high speed master clock can drive the laser scanning unit. By using a very high speed clock, the control circuitry has the resolution to compensate for many of these distortion types, by appropriately counting clock cycles and indicating such to the laser modulator.
    Type: Application
    Filed: August 11, 2009
    Publication date: February 17, 2011
    Applicant: CONEXANT SYSTEMS, INC.
    Inventor: Michael Joseph Schaffstein
  • Publication number: 20110038539
    Abstract: A raster to block converter and equivalently a block to raster converter can be implemented using enough memory to contain a single image band, that is a band of pixels of height equal to a single block but spanning the entire width of an image. The raster to block converter can operate at full rate so that as soon as a pixel is read out from the memory a new pixel can be stored in its place. The location of a pixel can be tracked using a mapping involving basic modular arithmetic. This raster to block converter is scalable so that it can work with any size image and block size.
    Type: Application
    Filed: August 12, 2009
    Publication date: February 17, 2011
    Applicant: CONEXANT SYSTEMS, INC.
    Inventors: Manhar Karsanbhai, John M. Brooks