Abstract: A heat transfer device includes a chamber with a condensable fluid with an evaporative region coupled to a heat source. Within the chamber is a boiling-enhanced multi-wick structure.

Abstract: A vapor-augmented heat spreader device includes a lower sheet in communication with an upper sheet. The lower sheet includes condensate grooves formed into the upper surface and the upper sheet includes a series of vapor grooves formed therein. The dimensions of the condensate grooves differ from the dimensions of the vapor grooves. For example, the condensate grooves may have dimensions smaller than those of the vapor grooves. The lower sheet may further include a multi-wick structure in communication with the condensate grooves. The lower sheet may be coupled to the upper sheet utilizing one or more of a crest joint or an edge joint.

Abstract: A heat transfer device includes a chamber with a condensable fluid with an evaporative region coupled to a heat source. Within the chamber is a boiling-enhanced multi-wick structure.