Abstract: Changes in light intensity emitted by an illumination system are controlled by receiving signals to initiate dimming, determining a present value of the output drive signal, computing a change increment for the output drive signal based on the present value of the output drive signal, and changing the output drive signal by the change increment. The change increment is a first value if the present value of the output drive signal is less than a threshold, and the change increment is a second value greater than the first value if the present value of the output drive signal is greater than the threshold.
Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
Type:
Grant
Filed:
January 30, 2015
Date of Patent:
May 17, 2016
Assignee:
Cooledge Lighting, Inc.
Inventors:
Michael A. Tischler, Alborz Amini, Thomas Pinnington, Henry Ip, Gianmarco Spiga
Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
Type:
Grant
Filed:
March 18, 2015
Date of Patent:
May 17, 2016
Assignee:
Cooledge Lighting, Inc.
Inventors:
Michael A. Tischler, Alborz Amini, Thomas Pinnington, Henry Ip, Gianmarco Spiga
Abstract: In accordance with certain embodiments, heat-dissipating elements are integrated with semiconductor dies and substrates in order to facilitate heat dissipation therefrom during operation.
Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
Abstract: In various embodiments, a control system for an electronic circuit iteratively applies voltage to and senses current from a load to regulate operation of the load.
Type:
Grant
Filed:
November 11, 2014
Date of Patent:
February 23, 2016
Assignee:
Cooledge Lighting, Inc.
Inventors:
Michael A. Tischler, William P. Coetzee, Paul Jungwirth
Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
Type:
Grant
Filed:
May 5, 2015
Date of Patent:
February 2, 2016
Assignee:
Cooledge Lighting, Inc.
Inventors:
Michael A. Tischler, Philippe Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
Abstract: In various embodiments, a control system for an electronic circuit iteratively applies voltage to and senses current from a load to regulate operation of the load.
Type:
Grant
Filed:
June 16, 2015
Date of Patent:
February 2, 2016
Assignee:
Cooledge Lighting, Inc.
Inventors:
Michael A. Tischler, William P. Coetzee, Paul Jungwirth
Abstract: In accordance with certain embodiments, a phosphor element at least partially surrounding a light-emitting die is shaped to influence color-temperature divergence.
Type:
Grant
Filed:
February 25, 2015
Date of Patent:
January 26, 2016
Assignee:
Cooledge Lighting, Inc.
Inventors:
Tom Pinnington, Henry Ip, Michael A. Tischler, Ian Ashdown, Philippe M. Schick
Abstract: In accordance with certain embodiments, semiconductor dies are at least partially coated with a polymer and a conductive adhesive prior being bonded to a substrate having electrical traces thereon.
Abstract: In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded to a substrate having electrical traces thereon.
Abstract: In accordance with certain embodiments, an electric device includes a flexible substrate having first and second conductive traces on a first surface thereof and separated by a gap therebetween, an electronic component spanning the gap, and a stiffener configured to substantially prevent flexing of the substrate proximate the gap during flexing of the substrate.
Type:
Grant
Filed:
September 19, 2014
Date of Patent:
December 29, 2015
Assignee:
Cooledge Lighting, Inc.
Inventors:
Michael A. Tischler, Paul Palfreyman, Philippe M. Schick
Abstract: In accordance with certain embodiments, thermal stresses are mitigated in illumination systems by mating optical substrates with a plurality of discrete substrates each having one or more light-emitting elements thereon.
Type:
Grant
Filed:
October 31, 2012
Date of Patent:
December 29, 2015
Assignee:
Cooledge Lighting, Inc.
Inventors:
Philippe M. Schick, Michael A. Tischler
Abstract: In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded to a substrate having electrical traces thereon.
Abstract: A transfer stamp that can be charged with a spatial pattern of electrostatic charge for picking up selected semiconductor dice from a host substrate and transferring them to a target substrate. The stamp may be bulk charged and then selectively discharged using irradiation through a patterned mask. The technique may also be used to electrostatically transfer selected semiconductor dice from a host substrate to a target substrate.
Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
Abstract: In various embodiments, lighting systems include an electrically insulating carrier having a plurality of conductive elements disposed thereon, a light-emitting array, and at least one power source. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting strings, each light-emitting string comprising a plurality of electrically connected light-emitting diodes (LEDs). Each LED has at least two electrical contacts, and each electrical contact is electrically connected to a conductive element by a conductive adhesive and/or a solder. The power source provides power to the light-emitting strings.
Type:
Grant
Filed:
November 3, 2014
Date of Patent:
November 3, 2015
Assignee:
Cooledge Lighting Inc.
Inventors:
Michael A. Tischler, Vladimir Odnoblyudov, David Keogh
Abstract: In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies.
Type:
Grant
Filed:
November 7, 2014
Date of Patent:
September 22, 2015
Assignee:
Cooledge Lighting Inc.
Inventors:
Michael A. Tischler, Ian Ashdown, Tom Pinnington, Henry Ip
Abstract: In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.