Abstract: A liquid cooling system has a thermoelectric cooling module, a heat dissipating assembly, a water block and multiple flexible guide tubes with liquid flows inside. The thermoelectric cooling module has a cold surface and a hot surface. The water block has a contacting surface attached to a processor of a computer. The guide tubes are mounted between the thermoelectric cooling module, the heat dissipating assembly and the water block. With the thermoelectric cooling module, the liquid cooling system can cool a processor of computer hardware with high efficiency, and is able to dissipate extraordinary heat generated by the processor.

Abstract: A folio shielding mechanism suitable for protecting an operation surface of a host is provided. The folio shielding mechanism includes a first shell, a second shell, and a transmission module. The transmission module is disposed on a first supporting surface of the host adjacent to the operation surface, and is connected to the first shell and the second shell. When the first shell is moving towards a first direction, the second shell is driven by the first shell through the transmission module and moving towards a second direction opposite to the first direction, so that the first shell and the second shell would be either joined together above the operation surface for covering the operation surface or apart from each other for exposing the operation surface.

Abstract: A heat sink module has a heat sink, two arms and two fasteners. The arms are slidably mounted respectively in the heat sink to slide along pivotally to move to a certain position on a circuit board. The fasteners respectively extend through the arms and are fastened in the certain position on the circuit board to hold the heat sink on the circuit board. Because the heat sink only needs the arms and the fasteners to be held securely on the circuit board, the manufacturing and assembling procedures are effectively reduced.

Abstract: A heat-dissipation structure mainly including a heat-absorbing head, a heat pipe, and a tube jacket is provided. The heat pipe includes a heated end and a cooling end, wherein the heated end of the heat pipe is connected to the heat-absorbing head, and a flange is projected form the surface of the heat pipe adjacent to the cooling end. A joint is disposed on the cooling end of the heat pipe, and is connected to the tube jacket through the opening, such that the cooling end is sealed inside the tube jacket, and the flange of the heat pipe is tightly fastened between the joint and the opening. The heat-dissipation structure is used to rapidly conduct the waste heat generated by a processing chip to the tube jacket via the heat pipe.

Abstract: A rear panel assembly for a computer chassis has a mounting panel, at least one panel hinge, a terminal panel and an interface-card panel. The mounting panel has two edges and a panel opening defined through the mounting panel. The at least one panel hinge is mounted one edge of the mounting panel. The terminal panel and the interface-card panel are attached pivotally and detachably one panel hinge, and each panel has at least one latch to hold the panel in the panel opening in the mounting panel. With the terminal panel above or below the interface-card panel, the rear panel assembly has two different configurations to accommodate two types of motherboards.

Abstract: A supporting seat includes a base adapted to be securely connected to the heat conductive plate, two arms extending obliquely from the base from two opposed sides of the base, two engagement plates each formed on a free end of a corresponding arm and adapted to engage with a bottom face of a lowermost one of the heat dissipating fins and multiple through holes defined through each of the two engagement plates for extension of the heat dissipating tubes. Weight of the heat dissipating fins is supported and deformation of the heat dissipating tubes is prevented.

Abstract: A monitor heat dissipator includes a heat conductive plate having a first path defined in a top portion of the heat conductive plate and a second path defined in a bottom portion of the heat conductive plate to be in communication with the first path. A fluid is received in the second path to flow to the first path from the second path. A heat exchange assembly has a connecting tube in communication with the first path and the second path so that excessive heat carried by the fluid which flows from the second path to the first path is dissipated by the heat exchange assembly.

Abstract: A holding dock for portable computers to house a portable computer and disperse heat includes an upper lid, a holding surface, sidewalls and a hub to form a heat dissipation space. Heated air generated by the computer may enter the heat dissipation space through a heat dissipation section formed on the holding surface. The hub has a fan mounted thereon to draw the heated air to provide heat dissipation effect for the portable computer. The hub further can connect other electronic devices to the portable computer. The heat dissipation space can also house the portable computer to facilitate carrying and storing.

Abstract: A computer power supply with a display function has a rectifying circuit, an EMI filter, a power factor corrector, a switching circuit, a transformer and a secondary coil voltage regulator located between an AC voltage input and a DC voltage output. A linear rectifying circuit as a major technique connects to the output of the power factor corrector to detect power dissipation and represent the result in a display, thus user can take necessary measures when a computer draws excessive power.

Abstract: The cooling fan has a frame and at least one light-emitting diode (LED). The frame has a central block with a circuit and multiple ribs. The ribs are formed on the rear surface of the frame, extend to the center of the inner space and have at least one set hole. The at least one LED is mounted respectively in the at least one set hole to emit light and faces to the front surface of the frame.

Abstract: A cooling fin set, which is disposed on a heat source of a computer, includes a plurality of cooling fins. Each cooling fin includes some fastening portions formed thereon. The fastening portions are folded from the outer periphery of the cooling fin to form a folded side and a hook. The folded side includes an opening for inserting therein a hook of an adjacent cooling fin. An obstacle is formed extended from the rear portion of the opening of the cooling fin. The hook is parallel to the cooling fin, and includes a locking groove formed at the central portion thereof. The locking groove is formed corresponding to the obstacle of the cooling fin for clamping therein the obstacle of the adjacent fin. In this manner, the combination of the cooling fins becomes securely tight. Therefore, the cooling fins will not fall apart due to the vibration in transportation.

Abstract: A hardware monitoring device suitable for use to monitor performance of hardware installed in a computer host system is disclosed. For example, the operating temperature and transmission speed of a hard disk or the temperature of a central processing unit can all be monitored by such device. The monitored information can also be displayed on a panel as a reference for adjustment of a heat dissipation fan. By the connection via a firmware, the adjustment of the heat dissipation fan and the monitored information of the hardware can be directly accessed from the operation system of the computer.

Abstract: The cooling fan has a frame and at least one light-emitting diode (LED). The frame has a central block with a circuit and multiple ribs. The ribs are formed on the rear surface of the frame, extend to the center of the inner space and have at least one set hole. The at least one LED is mounted respectively in the at least one set hole to emit light and faces to the front surface of the frame.

Abstract: A computer chassis has a post assembly, a motherboard holder, a guardian board and a mounting board. The post assembly has a first post, a second post and a power supply holder. The motherboard holder is detachably mounted to one of the first post and the second post. The guardian board is detachably mounted between the first post and the second post. The mounting board is detachably mounted between the first post and the second post. The arrangement of the motherboard holder, the guardian board and the mounting board may be changed to make the computer chassis compatible with an ATX motherboard or a BTX motherboard.

Abstract: A fastening frame of the invention includes a fastener comprised of a transversal connecting arm that connects two attachment parts at two opposite sides. The transversal connecting arm has a thickness that is smaller than the space between the fins, and an edge that is parallel to the base of the heat slug. The fastening frame is thereby mounted in a manner that the transversal connecting arm inserts in a space between two fins with the attachment parts attached to the positioning socle. The transversal connecting arm is further downwardly connected to a pressing part that presses the base of the heat slug in tight abutment against the microprocessor.

Abstract: A fastener for combining a heat sink with an integrated circuit comprises a lateral strip and a lever. The lateral strip has a main portion with a first end formed as a first buckle that defines an aperture and a second end formed as a link for pivotally connecting the lever. Two taps extend perpendicularly downward from the lateral strip. The lever has a bottom end formed as a second buckle that defines an opening. When the fastener is applied to the heat sink that contacts with an integrated circuit which is attached on an integrated circuit base, the first and second buckles clasp two hooks of the integrated circuit base hence the two taps tightly contact with the heat sink so as to enhance the heat dissipating efficiency.