Abstract: A water-cooling heat dissipator mounted on an electronic heat-generating element includes a water-cooling head member and at least one heat pipe. The water-cooling head member includes a first cover and a second cover connected to the first cover. Both ends of the first cover and the second cover are formed with a receiving portion corresponding to each other, respectively. The receiving portions are adapted to be connected to the conduit connectors. A channel portion is formed between the first cover and the second cover for receiving one end of the heat pipe. With the above arrangement, the present invention can perform the heat dissipations of different heat-generating elements simultaneously to make the heat-generating elements operate under acceptable working temperatures. Further, the present invention can be widely used in the heat dissipation of compact electronic products.

Abstract: A heat-dissipating assembly of a computer housing with airways includes a casing. The casing is provided with a first partition and a second partition thereon. The first partition has a recessed space. The first partition is provided thereon with a plurality of penetrating troughs. The second partition is provided with a plurality of air-introducing ports thereon. The positions of the air-introducing ports and the positions of the penetrating troughs of the first partition are staggered respectively. Finally, the back and top of the casing are provided at least one fan respectively. Via this arrangement, after the external air enters the recessed space through the plurality of air-introducing ports, the external air is drawn into the casing by the fan on the first partition to perform an air-cooling effect and the heat dissipation. Finally, the air is drawn out of the casing by the fans provided on the top and back of the casing.

Abstract: A cooling structure for interface card for cooling the heating component on an interface card includes a heat sink, a metallic hood, and a water block, wherein the heat sink has a heat conducting seat and a plurality of cooling fins, while the heat conducting seat is attached to the heating component of the interface card. Furthermore, the metallic hood arranged on the heat sink is connected thereto. Finally, the water block is arranged on the metallic hood; thereby, the operational heat, generated from the heating element, is absorbed by the heat-conducting seat and is then conducted to the fins of the heat sink, so that the operational heat is distributed to the metallic hood by heat conducting process, making the operational heat that is generated by the heating component carried away through the heat exchanging function of the water block, and thus a desired cooling effectiveness is achieved.

Abstract: A light emitting device including a housing, a light emitting unit, and a heatsink is provided. The housing has a projection end and a heat dissipation end, and a first opening and a second opening are respectively formed in the projection end and the heat dissipation end. The light emitting unit is disposed inside the housing, and is corresponding to the heat dissipation end, for projecting a light toward the projection end and through the first opening. The heatsink is fixed to the heat dissipation end of the housing, and in contact with one side of the light emitting unit that faces the second opening, for dissipating the heat generated by the light emitting unit to the outside air.

Abstract: A heat sink fin with joining structure is provided, the heat sink fin is joined with and spaced from other heat sink fins mutually, so as to from a heat sink. The heat sink fin includes a plate and at least one inserting piece. The plate has at least one inserted slot formed in the plate near an edge thereof. The inserting piece extends from the edge of the plate corresponding to the inserted slot and has a buckled hole and a deformable buckling portion. The position of the inserted slot is corresponding to that of the inserting piece of another heat sink fin, and the inserted slot is provided for the inserting piece of the neighboring heat sink fin to be inserted into, and then the buckling portion of the heat sink fin is deformed and buckled into the buckled hole of the neighboring heat sink fin.

Abstract: A protective cover is used for protecting thermal conducting mediums on two heat sinks from being damaged simultaneously. The protective cover includes a plate body and two holding portions. The plate body has two opposite plate surfaces respectively covering the sides of the two heat sinks coated with a thermal conducting medium. The two holding portions are formed on the periphery of the two plate surfaces and surround the two plate surfaces to form an accommodation space respectively. The holding portions are engaged with the two heat sinks and cover the thermal conducting mediums in the accommodation space respectively.

Abstract: A thermal conductive medium cover is covered on the bottom of a heat sink for protecting a thermal conductive medium on the bottom of the heat sink, and is latched by a latching member for the heat sink. The thermal conductive medium cover includes a tray body covered on the bottom of the heat sink for protecting the thermal conductive medium, and two latched portions formed on two opposite lateral edges of the tray body. Two ends of the latching member respectively latch the two latched portions, so as to fix the tray body to the bottom of the heat sink. Thus, the thermal conductive medium cover is firmly fixed and will not fall off. Meanwhile, the latching member is also fixed and will not shake relative to the heat sink, thus preventing the latching member from colliding with the heat sink.

Abstract: A supporting seat includes a base adapted to be securely connected to the heat conductive plate, two arms extending obliquely from the base from two opposed sides of the base, two engagement plates each formed on a free end of a corresponding arm and adapted to engage with a bottom face of a lowermost one of the heat dissipating fins and multiple through holes defined through each of the two engagement plates for extension of the heat dissipating tubes. Weight of the heat dissipating fins is supported and deformation of the heat dissipating tubes is prevented.

Abstract: A heat sink module has a heat sink, two arms and two fasteners. The arms are slidably mounted respectively in the heat sink to slide along pivotally to move to a certain position on a circuit board. The fasteners respectively extend through the arms and are fastened in the certain position on the circuit board to hold the heat sink on the circuit board. Because the heat sink only needs the arms and the fasteners to be held securely on the circuit board, the manufacturing and assembling procedures are effectively reduced.

Abstract: An external box with a shockproofing mechanism is disclosed. The external box accommodates a hard disk that has a plurality of opening holes formed on a bottom side thereof. The external box comprises: a box body, a plurality of positioning posts, a plurality of elastic elements, and a cover body. The box body has a bottom seat. The positioning posts are disposed on the bottoms seat. The elastic elements are disposed around the positioning posts, respectively. The cover body covers the box body. The opening holes correspond to the positioning posts, and the positioning posts are respectively accommodated in the opening holes for contacting the hard disk with the elastic elements to achieve a shockproof effect.

Abstract: A liquid-cooling heat dissipation apparatus includes a casing, a first compartment defined in the casing for assembling a liquid driving unit, a cooling plate module on bottom of the casing, a second compartment defined between an inner space of the casing and the cooling plate module and containing a cooling liquid therein. At least one liquid inlet and liquid outlet are defined on the casing and communicated through the second compartment. Therefore, the liquid driving unit and the cooling plate module can be advantageously integrated into the casing while the duct is reduced to achieve compact space. Moreover, the overall structure achieves liquid storing, circulating and heat conveying function.

Abstract: A water-cooling heat exchanger and a heat-dissipating device are mounted on a heat-generating element of a computer for rapidly guiding and dissipating the heat generated by the heat-generating element. A water-cooling head, a pump and a heat-dissipating fan are stacked up, and an annular heat exchanger is used to surround the above components, thereby to reduce the space of the whole construction to a lowest extent. With the heat-dissipating fan provided in the center of the annular heat exchanger, the airflow generated by the heat-dissipating fan can blow the heat exchanger in multiple directions, thereby to obtain the optimal effect of heat dissipation.

Abstract: A heat dissipation structure including a wind cover, a heat sink and a wind-shielding plate is provided. The wind cover has an outlet and a fan connection portion corresponding to the outlet and having an inlet. In addition, the heat sink includes a base, multiple fins disposed in the wind cover, and at least a heat pipe passing through the fins and being fixed on the base. The wind-shielding plate is connected to a lowest one of the fins for leading an air flow to move around a heat source. Accordingly, the waste heat near the heat source can be taken away.

Abstract: A method for manufacturing a heat sink has steps of providing multiple fins and a heat pipe, assembling the fins, mounting a thermal-conductive medium, attaching the heat pipe, heating the thermal-conductive medium, rotating the fins and cooling the thermal-conductive medium. Because the thermal-conductive medium is inserted in the cavities in the fins before the heat pipe extends through the fins, inserting the thermal-conductive medium is easy and convenient.

Abstract: A heat dissipation system includes a housing, a circulator and a cooler. The housing has at least one surface made of heat-conductive metal to contact with a heat source. The housing includes a recess with a passage formed on the bottom to contain cooling liquid and an inlet and an outlet connected to the recess. Two pipes are provided to connected between the inlet and the outlet and the cooler, respectively. The circulator is installed in the recess to circulate the flowing of the cooling liquid. As such, heat generated from the heat source is directly conducted to the housing and takes away by the cooling liquid circulated by the circulator to the cooler.