Patents Assigned to CORNING PRECISION MATERIALS CO., LTD.
  • Patent number: 10295705
    Abstract: Provided is an anti-reflection glass substrate comprising an anti-reflection layer having a predetermined thickness from the surface, the anti-reflection glass substrate being characterized in that the anti-reflection layer has at least two layers of a first layer and a second layer successively provided in the depth direction from the surface, each of the first layer and the second layer has a plurality of pores, and the porosity of the first layer is smaller than the porosity of the second layer. In addition, provided is a method for manufacturing an anti-reflection glass substrate, the method successively comprising a step of etching a glass substrate using a first etching liquid and a step of etching the glass substrate using a second etching liquid, the method being characterized in that the molarity of multivalent metal ions of the first etching liquid is larger than the molarity of multivalent metal ions of the second etching liquid.
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: May 21, 2019
    Assignee: Corning Precision Materials Co., Ltd.
    Inventors: Jin Su Nam, Seon Ki Kim, Jung Keun Oh, Su Yeon Lee, Myeong Jin Ahn, Jae Ho Lee
  • Patent number: 10276834
    Abstract: An organic light-emitting device (OLED) which exhibits superior light extraction efficiency due to an extraction structure for dipole light generated from an organic light-emitting layer. The OLED includes a first glass substrate, a first electrode disposed on the first glass substrate, an organic light-emitting layer disposed on the first electrode, a second electrode disposed on the organic light-emitting layer, and a second glass substrate disposed on the second electrode. The second electrode has a composite electrode structure including a first transparent electrode layer and a second transparent electrode layer stacked on each other, the refractive index of the second transparent electrode layer being higher than the refractive index of the first transparent electrode layer.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: April 30, 2019
    Assignee: Corning Precision Materials Co., Ltd.
    Inventor: Hong Yoon
  • Patent number: 10269505
    Abstract: Provided are a multi-layered graphene film, a method of manufacturing the multi-layered graphene film, and an energy storage device using the multi-layered graphene film as an electrode. The multi-layered graphene film includes a first graphene layer, a spacer layer provided on the first graphene layer, and an upper graphene layer provided on the spacer layer. The spacer layer is provided to maintain a desired distance between the first graphene layer and the upper graphene layer. A plurality of layers with different layer configurations are further provided between the spacer layer and the upper graphene layer. The spacer layer may a graphene or a graphene oxide layer.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: April 23, 2019
    Assignees: Samsung Electronics Co., Ltd., Corning Precision Materials Co., Ltd.
    Inventors: Dong-wook Lee, Soon-geun Kwon
  • Patent number: 10256439
    Abstract: The present invention relates to a tandem organic light-emitting element, more particularly to a tandem organic light-emitting element which may decrease a driving voltage in a driving region of a charge generation layer by sequentially laminating an electronics layer, which is doped with a metal dopant, and an electronics layer, which is doped with an organic dopant, on one side of the charge generation layer, thereby having increased power efficiency and life span.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: April 9, 2019
    Assignees: Corning Precision Materials Co., Ltd., University-Industry Cooperation Group of Kyung Hee University
    Inventors: Hyung Seok Lee, Kwang Je Woo, Jang Dae Youn, Jang Hyuk Kwon, Young Hoon Son
  • Patent number: 10214000
    Abstract: The present invention provides a method for applying a film in which non-contact repulsive forces generated by ultrasonic vibration are applied using an ultrasonic vibration unit (A) to a surface of a substrate so as to support the surface of the substrate without contact, and a film is pressed and applied to the other surface of the substrate using a pressing roller. The ultrasonic vibration unit (A) may comprise: an ultrasonic vibration body facing a surface of the substrate; and an ultrasonic excitement unit for exciting the ultrasonic vibration body. In addition, the present invention provides an apparatus for applying a film comprising: an ultrasonic vibration unit (A) for applying non-contact repulsive forces generated by the ultrasonic vibration to a surface of a substrate so as to support the surface of the substrate without contact; and a pressing roller for pressing and applying a film to the other surface of the substrate.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: February 26, 2019
    Assignee: Corning Precision Materials Co., Ltd.
    Inventors: Mun Hwan Seol, Ki Nam Kim, Shin Kim, Dong Young Cho
  • Patent number: 10214439
    Abstract: The present invention provides a non-contact vibration suppression device comprising a first ultrasonic vibration unit and a second ultrasonic vibration unit, the device being characterized in that the first ultrasonic vibration unit and the second ultrasonic vibration unit are installed to face each other while being spaced from each other such that an object can be interposed therebetween, the first ultrasonic vibration unit and the second ultrasonic vibration unit generate ultrasonic vibrations, respectively, and apply repulsive forces, which result from the ultrasonic vibrations, to the object such that the object is constrained with no contact between the first ultrasonic vibration unit and the second ultrasonic vibration unit, thereby suppressing vibration of the object.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: February 26, 2019
    Assignee: Corning Precision Materials Co., Ltd.
    Inventors: Shin Kim, Ki Nam Kim, Mun Hwan Seol, Dong Young Cho
  • Patent number: 10215907
    Abstract: The present invention relates to a substrate for color conversion, a manufacturing method therefor, and a display device comprising the same and, more specifically, to a substrate for color conversion for not only securing the long-term stability of quantum dots but also exhibiting excellent color conversion efficiency, a manufacturing method therefor, and a display device comprising the same. To this end, the present invention provides a substrate for color conversion, a manufacturing method therefor, and a display device, the substrate for color conversion comprising: a thin plate glass; a coating layer for quantum dots formed on one surface of the thin plate glass; a light guide plate disposed to face the coating layer for quantum dots, a light emitting diode being disposed on the sides thereof; and a sealing material which is formed between the thin plate glass and the light guide plate and which blocks the coating layer for quantum dots from the outside.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: February 26, 2019
    Assignee: Corning Precision Materials Co., Ltd.
    Inventors: Yoon Seuk Oh, Hyung Soo Moon, Ki Yeon Lee, Young Suk Lee, Nae Young Jung, Yoon Young Kwon, Choon Bong Yang
  • Patent number: 10211377
    Abstract: The present invention relates to a method for manufacturing a light-emitting diode package, and more specifically to a method for manufacturing a light-emitting diode package that does not need an additional color conversion frit heat-treatment process and cutting process after bonding between the color conversion frit and a light-emitting diode chip. To this end, the present invention provides a method for manufacturing a light-emitting diode package characterized in that the present invention comprises: a color conversion frit formation step for forming a color conversion frit in which phosphor is included on a substrate; a color conversion frit transcription step for transcribing the color conversion frit formed on the substrate from the substrate to a transcription film; and a color conversion frit bonding step for bonding the color conversion frit transcribed on the transcription film onto a light-emitting diode package.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: February 19, 2019
    Assignee: Corning Precision Materials Co., Ltd.
    Inventors: Yoon Seuk Oh, Ki Yeon Lee, Hyung Soo Moon, Bo Mi Kim, Jhee Mann Kim, Cheol Min Park, Choon Bong Yang
  • Patent number: 10186685
    Abstract: The present invention relates to a method for manufacturing a light extraction substrate for an organic light emitting diode, a light extraction substrate for an organic light emitting diode, and an organic light emitting diode comprising same, and more specifically, to a method for manufacturing a light extraction substrate for an organic light emitting diode, a light extraction substrate for an organic light emitting diode, and an organic light emitting diode comprising same, capable of significantly increasing light extraction efficiency of the organic light emitting diode.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: January 22, 2019
    Assignee: Corning Precision Materials Co., Ltd.
    Inventor: Joo Young Lee
  • Patent number: 10177343
    Abstract: The present invention provides a light extraction substrate for an organic light emitting device, comprising: a base substrate; a scattering layer formed on the base substrate and made of TiO2; a plurality of first light scatterers formed inside the scattering layer and having a porous form; and a flat layer formed on the scattering layer, wherein the scattering layer is internally permeated by a part of the materials constituting the flat layer.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: January 8, 2019
    Assignee: Corning Precision Materials Co., Ltd.
    Inventors: Joo Young Lee, Seo Hyun Kim, Eun Ho Choi
  • Patent number: 10162085
    Abstract: The present invention relates to a large area organic light emitting panel and, more particularly, to a large area organic light emitting panel which prevents an observer in front of the panel from recognizing a seam connecting organic light emitting panels, i.e. which can implement a seamless effect. To this end, the present invention provides a large area organic light emitting panel comprising: a plurality of organic light emitting panels arranged vertically and horizontally; and a seam part, formed between the plurality of organic light emitting panels, for connecting the plurality of organic light emitting panels and refracting, to the front, light laterally emitted from the organic light emitting panels by a wave guiding effect.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: December 25, 2018
    Assignee: Corning Precision Materials Co., Ltd.
    Inventors: Joo Young Lee, Kyoung Wook Park
  • Patent number: 10153458
    Abstract: The present invention relates to an organic light emitting diode, and more specifically, to an organic light emitting diode capable of significantly increasing light extraction efficiency through optimization of a corrugated structure, which is formed by being transferred from an inner light extraction layer, thereby enabling excellent light-emitting efficiency.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: December 11, 2018
    Assignee: Corning Precision Materials Co., Ltd.
    Inventors: Joo Young Lee, Yoon Young Kwon, Dong Hyun Kim, Seo Hyun Kim
  • Patent number: 10141481
    Abstract: The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a color-conversion substrate of a light-emitting diode capable of completely protecting the quantum dots (QDs) supported in the interior from the exterior as hermetic sealing is possible, and a method for producing the color-converting substrate.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: November 27, 2018
    Assignee: Corning Precision Materials Co., Ltd.
    Inventors: Ki Yeon Lee, Jhee Mann Kim, Hyung Soo Moon, Yoon Seuk Oh, Choon Bong Yang
  • Patent number: 10134652
    Abstract: The present invention relates to a substrate for an integrated circuit package and, more specifically, to a substrate for an integrated circuit package, which reduces mismatch of coefficients of thermal expansion with a semiconductor chip, thereby preventing or minimizing warpage during a reflow process.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: November 20, 2018
    Assignee: Corning Precision Materials Co., Ltd.
    Inventors: Joon Soo Kim, Hyung Soo Moon, Jae Young Choi
  • Publication number: 20180319580
    Abstract: The present invention relates to an accommodation container and, more specifically, to an accommodation container capable of easily and simply winding a flexible glass-bonded substrate and accommodating the same. To this end, the present invention provides the accommodation container comprising: a container body having a slit, formed at one side thereof, for providing a passage such that the flexible glass-bonded substrate having magnetism is inserted or withdrawn; and a core part rotatably formed inside the container body, formed in parallel to the slit, and winding, around the outer peripheral surface thereof, the flexible glass-bonded substrate by rotation in a state in which the end portion of the flexible glass-bonded substrate, inserted into the container body through the slit, is fixed by magnetic adsorption.
    Type: Application
    Filed: August 31, 2016
    Publication date: November 8, 2018
    Applicant: Corning Precision Materials Co., Ltd.
    Inventors: Dong Keun Shin, Choul Hee Park, Sang Yoon Oh
  • Publication number: 20180304430
    Abstract: A method of symmetrically chamfering a substrate includes repeating, at least a plurality of times, the steps of chamfering an edge of the substrate using a chamfering wheel, measuring an asymmetric chamfering deviation (y) of the edge of the substrate which is chamfered, and controlling a relative position of the chamfering wheel with respect to the substrate by a value of a function f(y) of the variable y. It is possible to constantly symmetrically chamfer the edge of the substrate via active response to a change in the chamfering environment without a hardware-based operation of the related art.
    Type: Application
    Filed: June 29, 2018
    Publication date: October 25, 2018
    Applicant: CORNING PRECISION MATERIALS CO., LTD.
    Inventor: MyeongBo HAN
  • Patent number: 10106361
    Abstract: The present invention provides a sheet manufacturing method comprising: an unwinding step of supplying an object from a roll on which the object is wound; a feeding step of feeding the supplied object; and a cutting step of cutting the fed object, wherein the cutting comprises sheet-cutting in which the object is cut in the width direction of the object. Further, the present invention provides a sheet manufacturing apparatus comprising: an unwinding part for supplying an object from a roll on which the object is wound; a feeding part for feeding the supplied object; and a cutting part for the fed object, wherein the cutting comprises sheet-cutting in which the object is cut in the width direction of the object.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: October 23, 2018
    Assignee: Corning Precision Materials Co., Ltd.
    Inventors: Dong Young Cho, Ki Nam Kim, Shin Kim, Mun Hwan Seol
  • Patent number: 10100985
    Abstract: The present invention relates to an organic light-emitting device for lighting, and more specifically relates to an organic light-emitting device for lighting whereby it is possible to achieve excellent brightness by increasing the light-emitting area per unit area of an organic light-emitting element. For this purpose, the present invention provides an organic light-emitting device comprising: a first substrate and a second substrate disposed facing each other; a frame section which is formed between the first substrate and the second substrate, and is formed on the periphery of the first substrate and the second substrate so as to hermetically close the space between the first substrate and the second substrate; and a flexible organic light-emitting element which is disposed inside of the space, and of which at least one part has a curved surface.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: October 16, 2018
    Assignee: Corning Precision Materials Co., Ltd.
    Inventors: Kyoung Wook Park, June Hyong Park, Hong Yoon, Seo Hyun Kim, Il Hee Baek, Gun Sang Yoon, Joo Young Lee, Hyun Hee Lee, Eun Ho Choi
  • Patent number: 10076030
    Abstract: The present invention relates to a flexible hybrid substrate for a display and a method for manufacturing the same and, more specifically, to a flexible hybrid substrate for a display, which has a reduced occurrence of cracks, an improved level of flexibility, and can be used in a high-temperature process for manufacturing a display element, and a method for manufacturing the same. To this end, the present invention provides a flexible hybrid substrate for a display and a method for manufacturing the same, the flexible hybrid substrate for a display comprising: an ultra-thin plate glass; a first transparent thin film formed on one surface of the ultra-thin plate glass; and a second transparent thin film formed on the other surface of the ultra-thin plate glass, wherein the second transparent thin film includes a transparent conductive polymer.
    Type: Grant
    Filed: November 24, 2014
    Date of Patent: September 11, 2018
    Assignee: Corning Precision Materials Co., Ltd.
    Inventors: Jin Nyoung Heo, Tae Hyo Park, Dong Keun Shin, Jong Taek Kim, Sang Yoon Oh, Jin Sung Lim
  • Patent number: 10050235
    Abstract: An optical film includes: a high refractive index pattern layer including a material having a refractive index greater than about 1, where a plurality of grooves, each having a curved groove surface and a depth greater than a width thereof, is defined on a first surface of the high refractive index pattern layer, the plurality of grooves defines a pattern, the plurality of grooves are two-dimensionally arranged in a first direction and a second direction, and a first distance between adjacent grooves in the first direction and a second distance between adjacent grooves in the second direction are different from each other; and a low refractive index pattern layer including a material having a refractive index less than the refractive index of the high refractive index pattern layer and further including a plurality of fillers which fills the plurality of grooves, respectively.
    Type: Grant
    Filed: October 9, 2014
    Date of Patent: August 14, 2018
    Assignees: SAMSUNG ELECTRONICS CO., LTD, CORNING PRECISION MATERIALS CO., LTD., CHEIL INDUSTRIES INC.
    Inventors: Youmin Shin, Hyunmin Kim, Hongshik Shim, Young Oh, Chulho Jeong, Eunyoung Cho