Abstract: The present invention relates to a method for manufacturing a light extraction substrate for an organic light-emitting diode and, more specifically, to a method for manufacturing a light extraction substrate for an organic light-emitting diode, which can improve light extraction efficiency of an organic light-emitting diode and can also remarkably reduce a manufacturing process, manufacturing costs, and manufacturing time.

Abstract: The present invention relates to a substrate for a display device and, more particularly, to a substrate for a display device which has excellent durability and also can minimize generation of color shift when being applied to a display device.

Abstract: The present invention relates to a light extraction substrate for an organic light-emitting diode, a manufacturing method therefor, and an organic light-emitting diode including the same and, more specifically, to: a light extraction substrate for an organic light-emitting diode, which can improve light extraction efficiency of an organic light-emitting diode by reducing a distance between an organic light-emitting layer and a light extraction layer of the organic light-emitting diode more than a conventional distance therebetween; a manufacturing method therefor; and an organic light-emitting diode including the same.

Abstract: The present invention relates to a substrate for a display device and, more particularly, to a substrate for a display device, which not only has excellent durability, but can also minimize the occurrence of color shift when applied to a display device. To this end, the present invention provides a substrate for a display device, which is characterized by including: a substrate; a hard coat film formed on the substrate and formed of AlON; and a multilayer film formed between the substrate and the hard coat film, and formed of a coating film having a first refractive index and a coating film having a second refractive index, which are repetitively stacked in sequence.

Abstract: The present invention relates to a method for manufacturing a light extraction substrate for an organic light-emitting diode and, more specifically, to a method for manufacturing a light extraction substrate for an organic light-emitting diode, capable of increasing light extraction efficiency and structural stability of an organic light-emitting diode by improving the dispersibility of light scattering particles, distributed inside a matrix layer, and substrate adhesion.

Abstract: The present invention relates to a substrate for an integrated circuit package and, more specifically, to a substrate for an integrated circuit package, which reduces mismatch of coefficients of thermal expansion with a semiconductor chip, thereby preventing or minimizing warpage during a reflow process.

Abstract: The present invention relates to a substrate for the color conversion of a light-emitting diode and a manufacturing method therefor and, more specifically, to a substrate for the color conversion of a light-emitting diode and a manufacturing method therefor, which enable a quantum dot (QD) and a structure, in which the QD is supported, to have a color conversion function for implementing white light.

Abstract: The present invention relates to a method for manufacturing tempered glass and, more specifically, to a method for manufacturing alkali-free glass which has the thickness of 2.0 mm or less into tempered glass by means of heat treatment and surface treatment using fluosilicic acid. To this end, the present invention provides a method for manufacturing tempered glass, the method comprising: a preparation step for preparing alkali-free glass; a surface treatment step for surface-treating the alkali-free glass by means of a surface treatment solution comprising fluosilicic acid and thereby generating on the surface of the alkali-free glass a porous SiO2-rich layer of which the coefficient of thermal expansion (CTE) is smaller than the CTE of the inner part of the alkali-free glass; and a heat treatment step for heat-treating the alkali-free glass that has been surface-treated and thereby generating compressive stress on the surface of the alkali-free glass.

Abstract: A graphene-nanomaterial composite, an electrode and an electric device including the graphene-nanomaterial composite and a method of manufacturing the graphene-nanomaterial composite include a graphene stacked structure including a plurality of graphene films stacked on one another; and a nanomaterial between the plurality of graphene films and bonded to at least one of the plurality of graphene films by a chemical bond.

Abstract: The present invention relates to a substrate for an organic light-emitting diode, a method for manufacturing the same, and an organic light-emitting diode comprising the same, and more particularly, to a substrate for an organic light-emitting diode, the substrate having excellent productivity and manufacturing efficiency as well as an improved light extraction efficiency, a method for manufacturing the same, and an organic light-emitting diode comprising the same.

Abstract: The present invention relates to a hermetic sealing method and a hermetic-sealed substrate package and, more specifically, to a hermetic sealing method for hermetically sealing the space between two substrates by a glass frit paste, and a substrate package manufactured thereby. To this end, the present invention provides a hermetic sealing method comprising: a substrate preparation step for preparing a first substrate and a second substrate smaller than the first substrate; a glass frit paste applying step for applying the glass frit paste such that the glass frit paste adheres to the upper periphery of the first substrate and a side of the second substrate while the first and second substrates are disposed to face each other; and a laser irradiation step for irradiating a laser beam to the applied glass frit paste to hermetically seal the space between the first and second substrates.

Abstract: A method of fabricating a light extraction substrate for an organic light-emitting device which can increase the extraction efficiency of light emitted from the organic light-emitting device, thereby improving the overall luminous efficiency of the organic light-emitting device. Water glass is applied on a surface of a glass substrate. The water glass applied on the glass substrate is heat-treated such the surface of the glass substrate is roughened. The heat-treated water glass is removed from the glass substrate. A planarization layer of a glass frit is formed on the glass substrate from which the water glass has been removed.

Abstract: The present invention relates to a flexible hybrid substrate for a display and a method for manufacturing the same and, more specifically, to a flexible hybrid substrate for a display, which has a reduced occurrence of cracks, an improved level of flexibility, and can be used in a high-temperature process for manufacturing a display element, and a method for manufacturing the same. To this end, the present invention provides a flexible hybrid substrate for a display and a method for manufacturing the same, the flexible hybrid substrate for a display comprising: an ultra-thin plate glass; a first transparent thin film formed on one surface of the ultra-thin plate glass; and a second transparent thin film formed on the other surface of the ultra-thin plate glass, wherein the second transparent thin film includes a transparent conductive polymer.

Abstract: The present invention relates to a light extraction substrate for an organic light-emitting device, a manufacturing method therefor, and an organic light-emitting device comprising the same, and more specifically, to a light extraction substrate for an organic light-emitting device which can improve the light extraction efficiency of the organic light-emitting device, a manufacturing method therefor, and an organic light-emitting device comprising the same. To this end, the present invention provides a light extraction substrate for an organic light-emitting device, a manufacturing method therefor, and an organic light emitting device comprising the same. The light extraction substrate for the organic light-emitting device comprises: a base substrate; a matrix layer formed on the base substrate and made of frit; and a glass fiber structure arranged inside the matrix layer, wherein the matrix layer and the glass fiber structure form an inner light extraction layer of the organic light-emitting device.

Abstract: A low expansion glass filler which minimizes reflection of laser light during hermetic sealing, a method of manufacturing the same and a glass frit including the same. The low expansion glass filler includes SiO2, Al2O3, B2O3 and CaCO3, the transmittance of the low expansion glass filler being 80% or greater at a wavelength ranging from 630 to 920 nm.

Abstract: The present invention relates to an inorganic adhesive composition and to a hermetic sealing method, and more specifically relates to an inorganic adhesive composition with which an organic solvent is not used and to a hermetic sealing method using same. To this end, the present invention provides an inorganic adhesive composition comprising: between 20 and 80 parts by weight of a water glass diluted solution containing between 60 and 90 parts by weight of water glass (Na2SiO2); between 20 and 80 parts by weight of a refractory inorganic filler; and a black pigment.

Abstract: A method of manufacturing a thermochromic substrate, with which transmittance can be increased. The method includes the steps of forming a first thin film as a coating on a base substrate, the refractive index of the first thin film being different from that of a VO2 thin film; forming a pre-thermochromic thin film by coating the first thin film with pure vanadium; forming a second thin film as a coating on the pre-thermochromic thin film, the refractive index of the second thin film being different from that of a VO2 thin film; and heat-treating a resultant stack that includes the base substrate, the first thin film, the pre-thermochromic thin film and the second thin film.

Abstract: A device for gripping a substrate without contact with which the substrate can be more securely transported. In the device, a housing cap has an air inlet in the upper surface and a lower opening, the lower opening communicating with the air inlet such that air introduced through the air inlet exits through the lower opening. A contour of the lower opening in its vertical cross section is convexly rounded such that the introduced air is guided along a horizontal undersurface of the housing cap. A nozzle is disposed in an inner hollow space of the housing cap, and has an inclined surface such that the width of the nozzle gradually decreases in the direction from the undersurface of the nozzle to the upper surface of the nozzle adjacent to the air inlet. The undersurface of the nozzle is at a predetermined distance from the inner surface of the housing cap. An ultrasonic shaker applies ultrasonic vibration to the housing cap.

Abstract: A glass substrate protective pad which protects a glass substrate in close contact with the glass substrate. The glass substrate protective pad has multiple layers, the rear layer of the multiple layers which is to be in close contact with the glass substrate containing foamed polymer. A glass substrate packing container for packing a plurality of glass substrates loaded therein, in which the above-described glass substrate protective pad is in close contact with the front surface of the plurality of glass substrates.

Abstract: The present invention relates to a method for manufacturing a light-emitting diode package, and more specifically to a method for manufacturing a light-emitting diode package that does not need an additional colour conversion frit heat-treatment process and cutting process after bonding between the colour conversion frit and a light-emitting diode chip. To this end, the present invention provides a method for manufacturing a light-emitting diode package chatacterized in that the present invention comprises: a colour conversion frit formation step for forming a colour conversion frit in which phosphor is included on a substrate; a colour conversion frit transcription step for transcribing the colour conversion frit formed on the substrate from the substrate to a transcription film; and a colour conversion frit bonding step for bonding the colour conversion frit transcribed on the transcription film onto a light-emitting diode package.