Abstract: Glass-based articles that include a compressive stress layer extending from a surface of the glass-based article to a depth of compression are formed by exposing glass-based substrates to water vapor containing environments. The glass-based substrates have compositions selected to be fusion formable, to be steam strengthen able, and to avoid the formation of platinum defects during the forming process. The methods of forming the glass-based articles may include elevated pressures and/or multiple exposures to water vapor containing environments.
Abstract: A process comprises cold-forming a flat glass substrate into a non-planar shape using a die. The cold-formed glass substrate is bonded to a non-planar rigid support structure at a plurality of non-planar points using the die. Bonding methods include injection molding the non-planar rigid support structure, and direct bonding. An article is also provided, comprising a cold-formed glass substrate having opposing major surfaces and a curved shape, the opposing major surfaces comprising a surface stress that differ from one another. The cold-formed glass substrate is attached to a rigid support structure having the curved shape. The cold-formed glass substrate includes an open region not in direct contact with the non-planar rigid support structure, and the open region has a curved shape maintained by the non-planar rigid support structure.
Abstract: A compound lens assembly and method for making a compound lens assembly useful for deep ultraviolet lithography are described. The compound lens assembly includes a first lens component having an optical surface bonded to an optical surface of a second lens component. The bonding at the interface can be achieved using a hydroxide catalysis bonding technique. The compound lens assembly and process for making same solve problems relating to constringence and/or inherent birefringence known for conventional optical elements used in deep ultraviolet lithography or inspection of wafers or reticles in the DUV.
Type:
Grant
Filed:
October 10, 2018
Date of Patent:
May 24, 2022
Assignee:
Corning Incorporated
Inventors:
Michael Morgan Dunn, Todd Robert McMichael, Paul Francis Michaloski, Mark Ranney Westcott
Abstract: The THz waveguides disclosed herein are used to transmit signals having a THz frequency in the range from 0.1 THz to 10 THz and include an alumina core surrounded by an optional cladding. The core may have a diameter (D1) in the range from 10 ?m to 500 ?m and may be comprised of a ceramic ribbon having a dielectric constant (Dk). The optional cladding may have a dielectric constant (Dk) less than the core. The THz waveguides can be formed using a continuous firing process and nano-perforation technology that enables access to a wide form factor range. In one example, rectangular waveguides, or ribbons, may be fabricated in the 10 ?m to 200 ?m thick range at widths in the range from sub-millimeters to several meters and lengths in the range from millimeters to several hundred meters.
Type:
Grant
Filed:
August 25, 2020
Date of Patent:
May 24, 2022
Assignee:
Corning Incorporated
Inventors:
Michael Edward Badding, Ming-Jun Li, Karan Mehrotra, Cheng-Gang Zhuang
Abstract: A fluid distributor comprises a first conduit extending along a first elongated axis and a second conduit circumscribing the first conduit. A first area comprises a cross-sectional flow area of the first conduit taken perpendicular to the first elongated axis. The first conduit comprises a first plurality of orifices comprising a first combined cross-sectional area. The second conduit comprises a second plurality of orifices comprising a second combined cross-sectional area. A first ratio of the first area to the first combined cross-sectional area can be about 2 or more. A second ratio of the first combined cross-sectional area to the second combined cross-sectional area can be about 2 or more. An angle between a direction of an orifice axis of a first orifice of the first plurality of orifices and a direction of an orifice axis of a first orifice of the second plurality of orifices can be from about 45° to 180°.
Type:
Grant
Filed:
November 6, 2019
Date of Patent:
May 24, 2022
Assignee:
Corning Incorporated
Inventors:
John Alan Langstrand, Dong-gun Moon, Elias Panides, Abhijit Rao, Jung-Hun Yun
Abstract: A process comprises cold-forming a flat glass substrate into a non-planar shape using a die. The cold-formed glass substrate is bonded to a non-planar rigid support structure at a plurality of non-planar points using the die. Bonding methods include injection molding the non-planar rigid support structure, and direct bonding. An article is also provided, comprising a cold-formed glass substrate having opposing major surfaces and a curved shape, the opposing major surfaces comprising a surface stress that differ from one another. The cold-formed glass substrate is attached to a rigid support structure having the curved shape. The cold-formed glass substrate includes an open region not in direct contact with the non-planar rigid support structure, and the open region has a curved shape maintained by the non-planar rigid support structure.
Abstract: Embodiments of this disclosure pertain to a vehicle interior system comprising a base having a base surface; and a glass article coupled to the surface, wherein the glass article comprises a first portion comprising a first elastically deformed surface forming a first concave shape with a first radius of curvature from about 20 mm to about 2000 mm, and a second elastically deformed surface directly opposite the first elastically deformed surface that forms a second convex shape, wherein the second elastically deformed surface has a surface compressive stress that is less than a compressive stress at the first elastically deformed surface, and a second portion adjacent the first portion, wherein the second portion is substantially planar portion or curved.
Abstract: An enclosure configured to simultaneously accommodate different connectorization applications includes a backplate and a bulkhead bracket and splice retention clips coupled to the backplate. The bulkhead bracket includes openings configured to house adapters for a first connecterized application. The splice retention clips are configured to accommodate one or more of a fusion splice protector and a mechanical splice for a second connecterized application. The bulkhead bracket, with or without an adapter, is configured to be uncoupled from the backplate to allow access to the splice retention clips for insertion or deletion of the fusion splice protector or the mechanical splice. The bulkhead bracket is configured to be recoupled with the backplate and over the splice retention clips.
Type:
Grant
Filed:
May 1, 2020
Date of Patent:
May 17, 2022
Assignee:
Corning Research & Development Corporation
Inventors:
Robert Alexander Crane, Christian Shane Duran, John Austin Keenum, Jose Manuel Hernandez Quintana, Rodger Alan Tenholder
Abstract: Pathside communication relay (PCR) for collecting and distributing pathside data among client devices. The PCR collects client data from client devices (such as vehicles, pedestrians, and roadside infrastructure) and sensor data from sensors. The PCR processes the collected client data and sensor data and generates pathside data to be distributed among the client devices. In some examples, the PCR includes wireless telecommunication circuitry for distributing the pathside data over dedicated short-range communications (DSRC) signals using the Wireless Access in Vehicular Environments (WAVE) protocol and/or Cellular-Vehicle to everything (Cellular-V2X) communications. The pathside data can include location data of client devices and other objects, ambient conditions, traffic data, and other information to facilitate improved decision-making (such as collision avoidance) by client devices.
Type:
Grant
Filed:
January 31, 2019
Date of Patent:
May 10, 2022
Assignee:
Corning Research & Development Corporation
Abstract: Multiports having connection ports formed in the shell and associated securing features are disclosed. One aspect of the disclosure is directed to a multiport for providing an optical connection comprising a shell comprising a first portion, at least one connection port comprising an optical connector opening, and a connection port passageway formed in the first portion of the shell, where the at least one securing feature is associated with the at least one connection port.
Abstract: A method of fabricating microstructures of polar elastomers includes coating a substrate with a dielectric material including a polar elastomer, coating the dielectric material with a photoresist, exposing the photoresist to ultraviolet (UV) light through a photomask to define a pattern on the photoresist, developing the photoresist to form the pattern on the photoresist, etching the dielectric material to transfer the pattern from the photoresist to the dielectric material, and removing the photoresist from the patterned dielectric material.
Type:
Grant
Filed:
December 19, 2017
Date of Patent:
May 10, 2022
Assignee:
Corning Incorporated
Inventors:
Robert George Manley, Karan Mehrotra, Barry James Paddock, Rajesh Vaddi, Nikolay Zhelev Zhelev, Bin Zhu
Abstract: A process of forming a sintered article includes heating a green portion of a tape of polycrystalline ceramic and/or minerals in organic binder at a binder removal zone to a temperature sufficient to pyrolyze the binder; horizontally conveying the portion of tape with organic binder removed from the binder removal zone to a sintering zone; and sintering polycrystalline ceramic and/or minerals of the portion of tape at the sintering zone, wherein the tape simultaneously extends through the removal and sintering zones.
Type:
Grant
Filed:
August 19, 2021
Date of Patent:
May 10, 2022
Assignee:
Corning Incorporated
Inventors:
Michael Edward Badding, William Joseph Bouton, Douglas Edward Brackley, Lanrik Wayne Kester, Thomas Dale Ketcham, Eric Lee Miller, Cameron Wayne Tanner, James William Zimmermann
Abstract: Aspects of this disclosure pertain to a colorless material that includes a carrier, copper-containing particles, and either one or both of sodium thiocyanate and titanium dioxide. In one or more embodiments, the material exhibits, in the CIE L*a*b* system, an L* value in the range from about 91 to about 100, and a C* value of less than about 7, wherein C* equals ?(a*2+b*2). In some embodiments, the material exhibits a greater than 3 log reduction in a concentration of Staphylococcus aureus, under the EPA Test Method for Efficacy of Copper Alloy as a Sanitizer testing conditions.
Abstract: The present disclosure relates to a process by which an optical fiber is terminated with a ferrule to form an optical fiber connector assembly. The ferrule is heated at a heating temperature whereby the ferrule bore (and ferrule microhole) expands. The optical fiber is then inserted into the ferrule microhole. The ferrule then contracts when heat is no longer applied resulting in an interference fit between the optical fiber and the ferrule microhole based on the dimensions of the optical fiber and the ferrule microhole. The interference fit yields certain optical fiber characteristics within the optical fiber connector assembly. The present disclosure also relates to an optical fiber having an outer cladding comprising titania-doped silica and the resulting optical fiber characteristics.
Type:
Grant
Filed:
November 13, 2020
Date of Patent:
May 10, 2022
Assignee:
Corning Research & Development Corporation
Inventors:
Scott Robertson Bickham, Mark Alan McDermott, Pushkar Tandon
Abstract: A light diffusing optical fiber includes a core, a cladding surrounding the core, an outer surface, and a plurality of scattering structures positioned within the core, the cladding, or both the core and the cladding. The plurality of scattering structures are configured to scatter guided light towards the outer surface, such that light including a wavelength of from about 450 nm to about 650 nm diffusing through the outer surface along a diffusion length of the light diffusing optical fiber includes a spectral attenuation percent relative range of about 15% or less.
Abstract: A multimode optical fiber having a core region. The core region includes silica, has an outer radius r1, and has a maximum relative refractive index of about 1.5% or less. Additionally, the multimode optical fiber is configured to have an effective bandwidth of about 4.7 GHz-Km or greater for an excited portion of the core region that has a diameter greater than 50 microns, the effective bandwidth being at a wavelength that is within a range of between about 800 and about 1370 nm.
Type:
Grant
Filed:
March 29, 2021
Date of Patent:
May 10, 2022
Assignee:
Corning Incorporated
Inventors:
Xin Chen, Kangmei Li, Ming-Jun Li, Anping Liu, Simit Mayank Patel, Jeffery Scott Stone
Abstract: Embodiments of the disclosure relate to a method for fabricating semiconductor-on-insulator (SemOI) electronic components. In the method, a device wafer is bonded to a handling wafer. The device wafer includes a semiconductor device layer and a buried oxide layer. A substrate is adhered to the handling wafer. The substrate is a glass or a ceramic, and bonding occurs at an interface between the semiconductor device layer and the substrate. Material is removed from the device wafer to expose the buried oxide layer. The substrate is debonded from the handling wafer so as to provide an SemOI electronic component including the substrate, the semiconductor device layer, and the buried oxide layer.
Type:
Grant
Filed:
January 20, 2021
Date of Patent:
May 10, 2022
Assignee:
Corning Incorporated
Inventors:
Ya-Huei Chang, Jen-Chieh Lin, Jian-Zhi Jay Zhang
Abstract: A black ?-spodumene glass ceramic is provided. The glass ceramic includes ?-spodumene as a primary crystal phase and gahnite as a minor crystal phase. The glass ceramic is characterized by the color coordinates: L*: 20.0 to 40.0, a*: ?1.0 to 0.5, and b*: ?5.0 to 1.0. The glass ceramic may be ion exchanged. Methods for producing the glass ceramic are also provided.
Type:
Grant
Filed:
November 28, 2018
Date of Patent:
May 10, 2022
Assignee:
Corning Incorporated
Inventors:
Anthony Vincent DeCeanne, Qiang Fu, Alana Marie Whittier
Assignee:
Corning Research & Development Corporation
Inventors:
Kevin Charles Beach, Mark Robert Dagley, Giovanna Monserrat Franco Romo, Sergio Sanchez Garcia, Raymond Glenn Jay, Brian Duane Kingsbury, Robert Tomasz Klak, Wojciech Kreczmer