Abstract: An optical assembly and a method for making the optical assembly. The optical assembly includes an optical element; a blocking coating; a capping layer on the blocking coating; a holder; and an adhesive configured to adhere the optical element to the holder. The blocking coating includes a light absorber that does not transmit light with wavelengths from greater than or equal to about 250 nm to less than or equal to about 400 nm; The light absorber is positioned such that light having a wavelength from greater than or equal to about 190 nm to less than or equal to about 500 nm is not incident to the adhesive. The capping layer is made from a material having high transmission in the UV and enables use of aggressive cleaning treatments on the optical element significant impairment of the UV transmission of the optical element.

Abstract: An improved method and apparatus for determination of the absolute coefficient of thermal expansion of materials, including ultralow expansion materials, utilizes a metrology frame that is regulated within a first narrow temperature range that varies by only a small fraction of a degree Celsius from a set point temperature (e.g., less than about 0.01° C. from the set point temperature), while the temperature of the sample is varied to determine the coefficient of thermal expansion over a larger temperature range (e.g., 30, 40 or 50° C.). The method and apparatus permit determination of the coefficient of thermal expansion of a material to levels approaching 10?9/° C.

Abstract: High-connection density and bandwidth fiber optic apparatuses and related equipment and methods are disclosed. In certain embodiments, fiber optic apparatuses are provided and comprise a chassis defining one or more U space fiber optic equipment units. At least one of the one or more U space fiber optic equipment units may be configured to support particular fiber optic connection densities and bandwidths in a given 1-U space. The fiber optic connection densities and bandwidths may be supported by one or more fiber optic components, including but not limited to fiber optic adapters and fiber optic connectors, including but not limited to simplex, duplex, and other multi-fiber fiber optic components. The fiber optic components may also be disposed in fiber optic modules, fiber optic patch panels, or other types of fiber optic equipment.

Abstract: A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((?tensile stress location)/(?interface laser weld))<<1 or <1 and ?interface laser weld>10 MPa or >1 MPa where ?tensile stress location is the stress present in the first substrate and ?interface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.

Abstract: An inspection apparatus and methods for inspecting a body having a structure of walls defining a plurality of channels, such as a honeycomb structure. An inspection apparatus may include a translucent conveyor belt and a light source oriented to direct light onto the backlight surface. The light source and the belt are arranged to convey the body while directing diffuse light into the body, whereby inspection of the inner walls of the structure may be facilitated.

Abstract: A high frequency heating apparatus which heats a substrate by applying high frequency waves thereto. The high frequency heating apparatus includes a high frequency generator which generates high frequency to heat the substrate. The distance from the substrate to the high frequency generator is n/2*?, where n is a natural number ranging from 1 to 6, and ? is the wavelength of the high frequency that is generated by the high frequency generator.

Abstract: The glass waveguide assembly includes a substrate with glass optical waveguides formed in the body of the glass substrate without adding or removing any glass from the substrate body. The glass optical waveguides run generally from a front-end section to a back-end section. A protective coating is formed over at least a portion of the top surface of the glass substrate where the glass optical waveguides reside. Optical connectors are formed at or adjacent the back end at corresponding connector regions. Each connector includes an end portion of at least one of the glass optical waveguides. In some configurations, the glass waveguide assembly includes a bend section that facilitates forming an optical interconnection in a photonic system between an optical-electrical printed circuit board and photonic integrated circuit.

Abstract: A shingle including a substrate having a top surface and a bottom surface, an asphalt layer, a layer of granules, and a spacing layer is provided. The asphalt layer covers at least a portion of the top surface and the layer of granules is adhered to the asphalt layer. The spacing layer is attached beneath at least a portion of the bottom surface.

Abstract: A machine for distributing insulation material from a package of compressed insulation material has a chute having an inlet end and an outlet end, the inlet end configured to receive compressed insulation material. A lower unit has a shredding chamber configured to receive the insulation material from the outlet end of the chute. The shredding chamber includes shredders and at least one agitator configured to condition the insulation material, thereby forming conditioned insulation material. A discharge mechanism receives the conditioned insulation material exiting the shredding chamber and distributes the conditioned insulation material into a distribution airstream. A blower is configured to provide the distribution airstream flowing through the discharge mechanism, the blower driven by a blower motor.

Abstract: Present systems and methods provide ways to provide access services to connecting wireless devices particularly for (but not limited to) neutral host networks. Steps include executing authentication between a connecting wireless device and a service provider, receiving an address of a remote gateway from the service provider, and providing access service for the wireless device including forwarding data received from the wireless device to the indicated remote gateway address in forwarding wireless device associated data received from the remote gateway address to the wireless device. Other ways are also disclosed.

Abstract: Embodiments of thermally and chemically strengthened glass-based articles are disclosed. In one or more embodiments, the glass-based articles may include a first surface and a second surface opposing the first surface defining a thickness (t), a first CS region comprising a concentration of a metal oxide that is both non-zero and varies along a portion of the thickness, and a second CS region being substantially free of the metal oxide of the first CS region, the second CS region extending from the first surface to a depth of compression of about 0.17·t or greater. In one or more embodiments, the first surface is flat to 100 ?m total indicator run-out (TIR) along any 50 mm or less profile of the first surface. Methods of strengthening glass sheets are also disclosed, along with consumer electronic products, laminates and vehicles including the same are also disclosed.

Abstract: A mode division multiplexing system that includes a transmitter system, a receiver system and an optical link that optically connects the transmitter and receiver systems. The optical link includes a rectangular-core optical fiber having a rectangular core with a short dimension and a long dimension. The rectangular-core optical fiber supports only a single mode in the short dimension and multiple modes in the long dimension. A method of transmitting optical signals includes converting single mode optical signals to respective multimode optical signals each having a select spatial mode as defined by the rectangular-core optical fiber. The multimode optical signals are multiplexed and transmitted from the transmitter system to the receiver system over the rectangular-core optical fiber where the multimode optical signals are demultiplexed and converted back to single mode optical signals, which are then detected by respective receivers. A rectangular-core optical fiber is also disclosed.

Abstract: Dynamic determination of threshold power level for use in distinguishing between downlink and uplink periods in time-division duplexed (TDD) communications. For example, downlink and uplink periods may be distinguished in TDD communications in a distributed communications system (DCS), such as a distributed antenna system (DAS). Detecting a power level in a TDD communications signal less than the threshold power level is used to identify uplink periods in the TDD communications signal. In this manner, TDD communications circuits involved with transmitting TDD communications signals can synchronize their transmission circuitry to only transmit downlink TDD communications signals in downlink periods and receive uplink TDD communications signals in uplink periods.

Abstract: At least one group of loose optical fibers is restrained at multiple locations during fabrication of a fiber optic cable assembly using rear and front ferrule boots, thereby avoiding a need for traditional ribbonizing techniques. The group(s) of loose optical fibers are inserted through one or more apertures defined in each of the rear ferrule boot and the front ferrule boot, and inserted through at least one group of bores defined in a ferrule. A rear portion of the ferrule receives at least a portion of the front ferrule boot. A manufacturing fixture including a removable jig may retain a rear ferrule boot and a medial section of the group(s) of loose optical fibers, while the front ferrule boot and a terminal section of the group(s) of loose optical fibers are positioned outside the fixture for further processing. A fiber optic cable assembly including front and rear ferrule boots, as well as methods of fabrication, are further provided.

Abstract: An adapter for electrically connecting a laser diode to a circuit board is disclosed. An example laser diode may form part of an optical communications system in which the laser diode emits optical signals into an optical fiber cable based on electrical signals received from one or more source circuits. The laser diode is electrically connected to the source circuit(s) through a circuit board. A laser diode adapter is provided to facilitate electrically connecting, as well as mechanically coupling, the laser diode to the circuit board. In this regard, the laser diode adapter includes conductive pads for coupling to conductive legs of the laser diode. The laser diode adapter also includes a set of conductive signal pads for coupling to conductive receiving pads which are electrically connected to the conductive pads, thereby electrically connecting the conductive legs of the laser diode to the circuit board.

Abstract: Reversibly cross-linkable foam is provided. The reversibly cross-linked foam includes a first polymeric material, at least one reversibly cross-linkable monomer polymerized with the first polymeric material, and at least one blowing agent. The reversibly cross-linkable co-polymeric foam is thermally stable at temperatures of at least 10 degrees higher than otherwise identical polymeric foam that does not include the reversibly cross-linkable agent polymerized with the first polymeric material.

Abstract: The present invention relates to a light extraction substrate for an organic light emitting element, a method for manufacturing the same, and an organic light emitting element comprising the same and, more particularly, to a light extraction substrate for an organic light emitting element exhibiting a good light extraction efficiency, a method for manufacturing the same, and an organic light emitting element comprising the same. To this end, the present invention provides a light extraction substrate for an organic light emitting element, a method for manufacturing the same, and an organic light emitting element comprising the same, the light extraction substrate comprising a first light extraction layer having a plurality of pores formed therein and made of a first metal oxide doped with a dopant; and a second light extraction layer formed on the first light extraction layer and made of a second metal oxide which has a different atomic diffusion rate compared to the first metal oxide.

Abstract: A chucking apparatus and methods for coating a glass substrate using a vacuum deposition process are disclosed. In one or more embodiments, the chucking apparatus includes an ESC (ESC), a carrier disposed on the ESC, wherein the carrier comprises a first surface adjacent to the ESC and an opposing second surface for forming a Van der Waals bond with a third surface of a glass substrate, without application of a mechanical force on a fourth surface of the glass substrate opposing the third surface. In one or more embodiments, the method includes disposing a carrier and a glass substrate on an ESC, such that the carrier is between the glass substrate and the ESC to form a chucking assembly, forming a Van der Waals bond between the carrier and the glass substrate, and vacuum depositing a coating on the glass substrate.

Abstract: A fiber optic connector sub-assembly includes a ferrule having a front end, a rear end, and a ferrule bore extending between the front and rear ends along a longitudinal axis. The fiber optic connector sub-assembly also includes a bonding agent disposed in the ferrule bore and having first and second ends along the longitudinal axis. The bonding agent has been melted and solidified at the first and second ends.