Patents Assigned to Cytec Technology Corp.
  • Particle-toughened polymer compositions
    Patent number: 8268926
    Abstract: Particle-toughened polymer compositions include a base polymer formulation and a plurality of toughening particles. In certain embodiments, the base polymer formulation includes bismaleimides or other polymer resins capable of high temperature service. A first plurality of toughening particles may include core shell rubbers. A second plurality of toughening particles may be selected from a variety of polymer compositions, including polyimides, polyether ketone (PEK), polyether ether ketone (PEEK), polyether ketone ketone (PEKK), polyether imide, polyether sulfones, and polyphenylene oxide. It is found that increasing concentration of the core shell rubbers may improve the toughness of the composition while preserving thermal properties of the composition, such as glass transition temperature.
    Type: Grant
    Filed: May 25, 2010
    Date of Patent: September 18, 2012
    Assignee: Cytec Technology Corp.
    Inventors: Mark Richard Bonneau, Jack Douglas Boyd, Gordon T. Emmerson, Scott D. Lucas, Stephen J. Howard, Spencer Donald Jacobs
  • CO-CURABLE, CONDUCTIVE SURFACING FILMS FOR LIGHTNING STRIKE AND ELECTROMAGNETIC INTERFERENCE SHIELDING OF THERMOSET COMPOSITE MATERIALS
    Publication number: 20120219786
    Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 m?/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.
    Type: Application
    Filed: May 10, 2012
    Publication date: August 30, 2012
    Applicant: CYTEC TECHNOLOGY CORP
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
  • METHOD OF FABRICATING A COMPOSITE STRUCTURE WITH A CONDUCTIVE SURFACE
    Publication number: 20120171477
    Abstract: A method of fabricating a composite structure having a conductive surface is disclosed herein. The composite structure is formed by laminating a self-surfacing, conductive prepreg to one or prepreg plies or tapes to form a layup. The self-surfacing, conductive prepreg comprises a conductive surfacing film with a conductivity of less than 20 milliOhms formed on at least one surface of a prepreg ply or tape. Furthermore, the self-surfacing, conductive prepreg is suitable for use in an Automated Fiber Placement (AFP) process.
    Type: Application
    Filed: December 13, 2011
    Publication date: July 5, 2012
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
  • THERMOPLASTIC COMPOSITES AND METHODS OF MAKING AND USING SAME
    Publication number: 20120160399
    Abstract: A plurality of thermoplastic composite structures are laminated to each other in a lay-up arrangement to form a laminate. Each thermoplastic composite structure is composed of a core composite layer and a surface layer polymer applied to opposing surfaces of the core composite layer. The core composite layer is composed of a fibrous substrate and one or more high performance polymers, which crystallize at a faster rate than the surface layer polymer.
    Type: Application
    Filed: March 6, 2012
    Publication date: June 28, 2012
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: James F. Pratte, Scott A. Rogers, Dominique Ponsolle
  • Epoxy Resin System Containing Insoluble and Partially Soluble or Swellable Toughening Particles for Use in Prepreg and Structural Component Applications
    Publication number: 20120164455
    Abstract: Resin compositions comprise an epoxy thermosetting resin; and at least two types of interlaminar toughening particles; wherein a first type of interlaminar toughening particles are insoluble in said epoxy thermosetting resin; wherein a second type of interlaminar toughening particles are partially soluble or swellable in said epoxy thermosetting resin. Prepregs and structural compounds contain these resin compositions, which are useful in the aerospace industry.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 28, 2012
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: James Martin Griffin, Mark Bonneau, Gordon Emmerson
  • MULTILAYER AND COMPOSITION GRADIENT STRUCTURES WITH IMPROVED DAMPING PROPERTIES
    Publication number: 20120164907
    Abstract: Composite materials having favorable acoustic and vibration damping properties, while maintaining or improving other composite mechanical properties, include an interleaf layer comprising at least two different nonwoven materials in a specific sequence such that a gradient is formed in the z direction upon curing or an interleaf with a compositional gradient within its structure such that a resin interpenetration gradient is achieved upon curing. Composite materials that contain multilayered nonwoven interleaves are useful, for example, in structures found in aircrafts, such as fuselage skins, stringers and frames. Also contemplated are methods of making the composite material and the structures and aircrafts that contain the composite material.
    Type: Application
    Filed: December 9, 2011
    Publication date: June 28, 2012
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Carmelo Luca Restuccia, Emiliano Frulloni
  • PROCESSES FOR REMOVING HYDRAZINE FROM HYDROXYLAMINE SOLUTIONS
    Publication number: 20120152852
    Abstract: The present invention relates to processes for reducing or eliminating the amount of hydrazine from a hydroxylamine-free base containing hydrazine by treating said hydroxylamine-free base with a scavenger agent, and to the hydroxylamine-free base thereby obtained, as well as to its use for producing microdispersions containing a hydroxamated polymer for use as a flocculant in the Bayer process.
    Type: Application
    Filed: December 19, 2011
    Publication date: June 21, 2012
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Morris LEWELLYN, Alan S. ROTHENBERG, Haunn-Lin Tony CHEN, Lino G. MAGLIOCCO, Thomas P. SASSI
  • MICRODISPERSIONS OF HYDROXAMATED POLYMERS AND METHODS OF MAKING AND USING THEM
    Publication number: 20120153209
    Abstract: Methods of producing microdispersions containing hydroxamated polymers by reacting water-in-oil microdispersions having vinyl polymers containing one or more pendant functional groups that react with hydroxylamine, with a hydroxylamine-free base substantially free of inorganic salt and containing less than 500 ppm hydrazine are disclosed herein, along with the microdispersions thereby obtained.
    Type: Application
    Filed: December 19, 2011
    Publication date: June 21, 2012
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Morris LEWELLYN, Alan S. ROTHENBERG, Haunn-Lin Tony CHEN, Lino G. MAGLIOCCO, Thomas P. SASSI
  • PROCESSING ADDITIVES AND USES OF SAME IN ROTATIONAL MOLDING
    Publication number: 20120146257
    Abstract: The cycle time of polymer compositions subjected to a rotomolding process is improved (i.e.
    Type: Application
    Filed: December 12, 2011
    Publication date: June 14, 2012
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: J. Mon Hei ENG, Lingqing PENG, Sari-Beth SAMUELS, Thomas STEELE, Ram GUPTA
  • RESIN-SOLUBLE VEILS FOR COMPOSITE ARTICLE FABRICATION AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20120141728
    Abstract: Embodiments of the invention are directed to resin-soluble thermoplastic veils for use in liquid resin infusion processes, methods of manufacturing resin-soluble thermoplastic veils for use in liquid resin infusion processes, and methods of manufacturing composite articles using resin-soluble thermoplastic veils for use in liquid resin infusion applications. The resin-soluble thermoplastic veils according to embodiments of the invention and of which function as a toughening agent in composites having the veil incorporated therein have improved characteristics including, but not limited to, increased uniformity and decreased thickness relative to prior art veils. These characteristics translate into improvements in the processing of a composite article including, but not limited to, a substantial or complete elimination in premature dissolution of the veil during cure.
    Type: Application
    Filed: November 30, 2011
    Publication date: June 7, 2012
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Dominique Ponsolle, Robert Blackburn, Billy Harmon, Richard Price, Marc Doyle
  • USE OF SILICON-CONTAINING POLYMERS TO IMPROVE RED MUD FLOCCULATION IN THE BAYER PROCESS
    Publication number: 20120125862
    Abstract: The suspended solids content of a Bayer process stream is reduced by contacting the stream with silicon-containing polymers.
    Type: Application
    Filed: February 1, 2012
    Publication date: May 24, 2012
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Qi Dai, Donald Paul Spitzer, Howard I. Heitner, H-L Tony Chen
  • PHENOXYPYRAZOLE COMPOSITION AND PROCESS FOR THE SOLVENT EXTRACTION OF METALS
    Publication number: 20120118109
    Abstract: Methods for extracting metals from aqueous solutions, by contacting an aqueous solution containing a dissolved metal with a solvent extraction composition having a water-immiscible organic solvent; and a metal extractant compound according to Formula (1) and tautomers and salts thereof, are disclosed herein, wherein substituents R5-8, Y, and Z are as described herein.
    Type: Application
    Filed: December 21, 2011
    Publication date: May 17, 2012
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: John CAMPBELL, Ronald Matthys SWART, Lucy EMELEUS, Susan OWENS
  • Co-curable, conductive surfacing films for lightning strike and electromagnetic interference shielding of thermoset composite materials
    Patent number: 8178606
    Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 m?/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: May 15, 2012
    Assignee: Cytec Technology Corp.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
  • COMPATIBLE CARRIER FOR SECONDARY TOUGHENING
    Publication number: 20120115388
    Abstract: Embodiments of the invention are directed to carriers providing a primary toughening function and incorporating a secondary toughening agent therein. According to embodiments of the invention, the carrier/agent combination may be used in liquid resin infusion applications. The carrier may be any polymer-based material having a solubility characteristic in a thermosetting resin. The secondary toughening agent may be of a material such as a thermoplastic, a thermoset, a cross-linked thermoset, a rubber, a rubbery-like material or a combination thereof and may be in the form of a particle, a micro-fiber (fibril) or a fibrous network. In some embodiments, the carrier is soluble in the resin while the secondary toughening agent is insoluble in the resin when subjected to a cure cycle.
    Type: Application
    Filed: November 4, 2011
    Publication date: May 10, 2012
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Alexandre A. Baidak, Patrick Terence McGrail, Dominique Ponsolle, Robert Blackburn
  • TARGETED DEPOSITION OF PARTICLES USED IN THE MANUFACTURE OF COMPOSITE ARTICLES
    Publication number: 20120107560
    Abstract: Embodiments of the present disclosure are directed to the targeted deposition of particles below 100 microns onto a substrate such as a film, tape, adhesive, fabric, fibers or a combination thereof. The targeted deposition may be accomplished by a dual-component electro-static deposition process. In one embodiment, the substrate having at least one layer of particles thereon may be combined with a prepreg. Prepregs manufactured according to embodiments of the invention may be used to manufacture composites with more robust mechanical and strength characteristics relative to conventional composites manufactured using conventional prepregs in addition to providing improved processed performance during the manufacture of the particle-coated substrate. In another embodiment, targeted deposition may be applied directly to a composite article to achieve similar benefits.
    Type: Application
    Filed: October 28, 2011
    Publication date: May 3, 2012
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Scott Alfred Rogers, Mark Roman, Abdel Qader Abusafieh
  • USE OF SILICON-CONTAINING POLYMERS FOR IMPROVED FLOCCULATION OF SOLIDS IN PROCESSES FOR THE PRODUCTION OF ALUMINA FROM BAUXITE
    Publication number: 20120103916
    Abstract: The suspended solids content of a process stream in a process for digesting bauxite ore to produce alumina is reduced by contacting the stream with silicon-containing polymers.
    Type: Application
    Filed: January 5, 2012
    Publication date: May 3, 2012
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Matthew J. Davis, Qi Dai, Haunn-Lin Tony Chen, Matthew Taylor
  • APPARATUS AND METHODS FOR SPREADING FIBER BUNDLES FOR THE CONTINUOUS PRODUCTION OF PREPREG
    Publication number: 20120102678
    Abstract: Apparatus for producing spread fiber bundles by strategic use of tension control throughout the device and use of higher differential speeds between driven rollers and line speed of the running fiber bundle are provided herein, along with methods for producing spread fibers, prepregs, and articles of manufacture therefrom.
    Type: Application
    Filed: April 29, 2011
    Publication date: May 3, 2012
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Shawn W. JUNKER, Shaun Michael POH, Ping YEE, Scott Alfred ROGERS, Thomas A. VANHORNE
  • Thermoplastic composites and methods of making and using same
    Patent number: 8158245
    Abstract: Thermoplastic composites having a core composite layer including a fibrous substrate and one or more high performance polymer, and a surface layer polymer applied to at least one surface of the core composite layer, which forms a polymer blend with the high performance polymer thereby imparting improved toughness and processing times, and methods for making and using same, are provided herein.
    Type: Grant
    Filed: September 21, 2010
    Date of Patent: April 17, 2012
    Assignee: Cytec Technology Corp.
    Inventors: James Francis Pratte, Scott A. Rogers, Dominique Ponsolle
  • COMPOSITE MATERIALS AND THEIR USE
    Publication number: 20120064283
    Abstract: A composite material comprising the following components: (a) a first prepreg material with improved resistance to microbuckling and kinkband formation; and (b) a second prepreg material with improved resistance to delamination.
    Type: Application
    Filed: November 16, 2011
    Publication date: March 15, 2012
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Samuel Jestyn Hill, Emiliano Frulloni, Carmelo LoFaro, Robin Maskell
  • PARTICLE-TOUGHENED FIBER-REINFORCED POLYMER COMPOSITES
    Publication number: 20120052287
    Abstract: Particle toughened, fiber-reinforced composites include a fiber region and an interlayer region between the fibers. The fiber region includes a plurality of fibers at least partially within a first polymer composition including a first base polymer formulation and a first plurality of toughening particles. The interlayer region includes a second polymer composition including a second base polymer formulation and at least one of the first plurality of toughening particles and a second plurality of toughening particles. Examples of first and second pluralities of toughening particles, respectively, may include core shell rubbers and polyimides. Increasing concentration of the first plurality of toughening particles may improve the composite toughness while preserving thermal properties of the composite, such as weight loss after extended duration exposure to elevated temperature.
    Type: Application
    Filed: November 8, 2011
    Publication date: March 1, 2012
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Mark Richard Bonneau, Jack Douglas Boyd, Gordon T. Emmerson, Scott D. Lucas, Stephen Jacob Howard, Spencer Donald Jacobs