Patents Assigned to Daicel-Evonik Ltd.
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Patent number: 10316181Abstract: In a composition comprising (A) a reinforcing fiber containing a carbon fiber, (B) a resin particle, and (C) a matrix resin (C), the resin particle (B) comprises a spherical resin particle having an average particle diameter of 12 to 70 ?m. In a composition comprising (A) a reinforcing fiber containing a carbon fiber, (B) a resin particle, and (C) a matrix resin, the resin particle (B) comprises (B1) a spherical small resin particle having a particle diameter less than an average fiber diameter of the reinforcing fiber (A) and (B2) a spherical large resin particle having a particle diameter not less than the average fiber diameter of the reinforcing fiber (A). The reinforcing fiber (A) may particularly comprise a carbon fiber. The resin particle (B) may particularly comprise a polyamide resin particle. The resin particle (B) may have an average particle diameter of 1 to 10 times as large as the average fiber diameter of the reinforcing fiber (A).Type: GrantFiled: September 4, 2014Date of Patent: June 11, 2019Assignee: DAICEL-EVONIK LTD.Inventors: Mitsuteru Mutsuda, Thomas Grosse-Puppendahal
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Publication number: 20190161587Abstract: Polyamide particles including polyamide and having a water absorption rate of 0.5 to 2.5 wt. % are prepared to improve toughness of a cured product of a curable resin. The polyamide may be a semicrystalline polyamide. The polyamide has a glass transition temperature of approximately 100 to 150° C. The polyamide may have an alicyclic structure. The polyamide particles of this invention have an average particle size of approximately 5 to 40 ?m and a specific surface area determined by the BET method of approximately 0.08 to 12 m2/g. The polyamide particles of the present invention may also be spherical and have an average particle size of approximately 15 to 25 ?m. Furthermore, the polyamide particles of the present invention may have an exothermic peak in a temperature range between the glass transition temperature and a melting point of the polyamide upon heating the polyamide particles at a rate of 10° C./min by differential scanning calorimetry (DSC).Type: ApplicationFiled: April 10, 2017Publication date: May 30, 2019Applicant: DAICEL-EVONIK LTD.Inventors: Mitsuteru MUTSUDA, Yoshiki NAKAIE, Takayuki UNO
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Patent number: 10246586Abstract: Provided is an additive that increases or improves a light resistance of anon-fluorinated thermoplastic resin (e.g., a super engineering plastic, such as an aromatic polyamide, a liquid crystal polyester, or an aromatic polyetherketone resin). The additive comprises a fluorine-containing resin. The fluorine-containing resin may be, for example, a fluorine-containing resin comprising a tetrafluoroethylene unit as a monomer unit, in particular, may be a tetrafluoroethylene copolymer (e.g., at least one member selected from the group consisting of a copolymer of tetrafluoroethylene and another fluorinated olefin, a copolymer of tetrafluoroethylene and a fluorinated vinyl ether, and a copolymer of tetrafluoroethylene, another fluorinated olefin and a fluorinated vinyl ether).Type: GrantFiled: October 17, 2013Date of Patent: April 2, 2019Assignee: DAICEL-EVONIK LTD.Inventors: Tatsuki Akashi, Mitsuteru Mutsuda
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Publication number: 20190048153Abstract: (A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 ?m. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150° C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C.Type: ApplicationFiled: September 27, 2018Publication date: February 14, 2019Applicant: DAICEL-EVONIK LTD.Inventors: Mitsuteru MUTSUDA, Yoshiki NAKAIE, Takayuki UNO
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Patent number: 10162196Abstract: A functional lens which effectively prevents the separation of a functional layer in a fitting operation of a multilayer functional lens to a frame, and a pair of functional glasses with the lens are provided. The functional lens comprises a lens body and a laminate on the lens body. The laminate comprises, in sequence, a first thermoplastic resin layer, a first adhesive layer, an optically functional layer (e.g., a polarizing film), a second adhesive layer, and a second thermoplastic resin layer. The functional lens is to be fitted in a groove of a frame. The functional lens has an edge face having a shape with a peak. The peak of the edge face is positioned at a fitting side (the lens body side) relative to the first adhesive layer.Type: GrantFiled: March 24, 2016Date of Patent: December 25, 2018Assignee: DAICEL-EVONIK LTD.Inventor: Toshihiko Fujinaka
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Publication number: 20180258240Abstract: (A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 ?m. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150° C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C.Type: ApplicationFiled: October 5, 2016Publication date: September 13, 2018Applicant: DAICEL-EVONIK LTD.Inventors: Mitsuteru MUTSUDA, Yoshiki NAKAIE, Takayuki UNO
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Publication number: 20170192256Abstract: A functional lens which effectively prevents the separation of a functional layer in a fitting operation of a multilayer functional lens to a frame, and a pair of functional glasses with the lens are provided. The functional lens comprises a lens body 1 and a laminate 2 on the lens body 1. The laminate 2 comprises, in sequence, a first thermoplastic resin layer 3, a first adhesive layer 4, an optically functional layer (e.g., a polarizing film) 5, a second adhesive layer 6, and a second thermoplastic resin layer 7. The functional lens is to be fitted in a groove of a frame. The functional lens has an edge face having a shape with a peak. The peak of the edge face is positioned at a fitting side (the lens body 1 side) relative to the first adhesive layer.Type: ApplicationFiled: March 24, 2016Publication date: July 6, 2017Applicant: DAICEL-EVONIK LTD.Inventor: Toshihiko FUJINAKA
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Patent number: 9644080Abstract: Provided is an additive that increases or improves a light resistance (or whiteness) of a non-fluorinated thermoplastic resin (e.g., a super engineering plastic, such as an aromatic polyamide, a liquid crystal polyester, or an aromatic polyetherketone resin). The additive comprises a fluorine-containing resin and an inorganic white pigment (e.g., titanium oxide). The fluorine-containing resin may be, for example, a fluorine-containing resin comprising a tetrafluoroethylene unit as a monomer unit, in particular, may be a tetrafluoroethylene copolymer (e.g., at least one member selected from the group consisting of a copolymer of tetrafluoroethylene and another fluorinated olefin, a copolymer of tetrafluoroethylene and a fluorinated vinyl ether, and a copolymer of tetrafluoroethylene, another fluorinated olefin and a fluorinated vinyl ether).Type: GrantFiled: October 17, 2013Date of Patent: May 9, 2017Assignee: DAICEL-EVONIK LTD.Inventors: Tatsuki Akashi, Mitsuteru Mutsuda
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Publication number: 20160200910Abstract: In a composition comprising (A) a reinforcing fiber containing a carbon fiber, (B) a resin particle, and (C) a matrix resin (C), the resin particle (B) comprises a spherical resin particle having an average particle diameter of 12 to 70 ?m. In a composition comprising (A) a reinforcing fiber containing a carbon fiber, (B) a resin particle, and (C) a matrix resin, the resin particle (B) comprises (B1) a spherical small resin particle having a particle diameter less than an average fiber diameter of the reinforcing fiber (A) and (B2) a spherical large resin particle having a particle diameter not less than the average fiber diameter of the reinforcing fiber (A). The reinforcing fiber (A) may particularly comprise a carbon fiber. The resin particle (B) may particularly comprise a polyamide resin particle. The resin particle (B) may have an average particle diameter of 1 to 10 times as large as the average fiber diameter of the reinforcing fiber (A).Type: ApplicationFiled: September 4, 2014Publication date: July 14, 2016Applicant: DAICEL-EVONIK LTD.Inventors: Mitsuteru MUTSUDA, Thomas GROSSE-PUPPENDAHAL
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Patent number: 9382414Abstract: A thermoplastic resin composition having a high flame retardancy in a thin-wall molded product and a molded article thereof are provided. The thermoplastic resin composition comprises (A) a thermoplastic resin containing a repeating unit having an arylene group, an ether group, and a carbonyl group and (B) a thermoplastic fluorine-containing resin. The weight ratio of the thermoplastic resin (A) and the thermoplastic fluorine-containing resin (B) in the former/the latter is 80/20 to 99/1. The thermoplastic fluorine-containing resin (B) is dispersed in the form of a particle in the thermoplastic resin (A) to form a dispersed phase, and the dispersed phase has an average particle diameter of not more than 3 ?m. The thermoplastic resin composition is suitable for forming a molded article having a thin-wall portion with a thickness of not more than 1.5 mm.Type: GrantFiled: August 21, 2013Date of Patent: July 5, 2016Assignee: DAICEL-EVONIK LTD.Inventors: Mitsuteru Mutsuda, Tatsuki Akashi, Yuki Adachi, Haruhisa Masuda
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Publication number: 20160096946Abstract: A resin powder containing an ultraviolet scattering agent (such as a titanium oxide particle or a zinc oxide particle) is deformed into a plate-like form. The ultraviolet scattering agent may include, for example, a titanium oxide particle or zinc oxide particle having an average particle diameter of not more than 100 nm. A resin contained in the resin powder may particularly be a thermoplastic resin (e.g., a polyamide resin). The plate-like resin powder may be a powder obtainable by deforming resin particles, each containing the ultraviolet scattering agent, into a plate-like form. The resulting resin powder has an excellent ultraviolet scattering function.Type: ApplicationFiled: April 24, 2014Publication date: April 7, 2016Applicant: DAICEL-EVONIK LTD.Inventors: Mitsuteru MUTSUDA, Hirofumi IGUCHI
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Publication number: 20160083616Abstract: A resin powder containing an aromatic polyetherketone resin (e.g., a polyetheretherketone) is deformed into a plate-like form, and the resulting powder is used as a resin powder for a coating material. The plate-like resin powder may have an average thickness of, for example, not more than 2 ?m. The coating material may contain a dispersing agent or may be dispersed in a dispersion medium, such as water. The coating material may particularly be used as a coating material for covering a metal substrate. The plate-like resin powder, which comprise an aromatic polyetherketone resin, allows formation of a coating layer which has a high adhesion to a substrate and in which the generation of pinholes is efficiently prevented or reduced.Type: ApplicationFiled: June 6, 2014Publication date: March 24, 2016Applicant: DAICEL-EVONIK LTD.Inventors: Mitsuteru MUTSUDA, Hirofumi IGUCHI, Ryo NAKAHAMA, Kimihiko OYA
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Publication number: 20160068652Abstract: Provided is an additive that increases or improves a light resistance (or whiteness) of a non-fluorinated thermoplastic resin (e.g., a super engineering plastic, such as an aromatic polyamide, a liquid crystal polyester, or an aromatic polyetherketone resin). The additive comprises a fluorine-containing resin and an inorganic white pigment (e.g., titanium oxide). The fluorine-containing resin may be, for example, a fluorine-containing resin comprising a tetrafluoroethylene unit as a monomer unit, in particular, may be a tetrafluoroethylene copolymer (e.g., at least one member selected from the group consisting of a copolymer of tetrafluoroethylene and another fluorinated olefin, a copolymer of tetrafluoroethylene and a fluorinated vinyl ether, and a copolymer of tetrafluoroethylene, another fluorinated olefin and a fluorinated vinyl ether).Type: ApplicationFiled: October 17, 2013Publication date: March 10, 2016Applicant: DAICEL-EVONIK LTD.Inventors: Tatsuki AKASHI, Mitsuteru MUTSUDA
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Publication number: 20160046806Abstract: Provided is an additive that increases or improves a light resistance of anon-fluorinated thermoplastic resin (e.g., a super engineering plastic, such as an aromatic polyamide, a liquid crystal polyester, or an aromatic polyetherketone resin). The additive comprises a fluorine-containing resin. The fluorine-containing resin may be, for example, a fluorine-containing resin comprising a tetrafluoroethylene unit as a monomer unit, in particular, may be a tetrafluoroethylene copolymer (e.g., at least one member selected from the group consisting of a copolymer of tetrafluoroethylene and another fluorinated olefin, a copolymer of tetrafluoroethylene and a fluorinated vinyl ether, and a copolymer of tetrafluoroethylene, another fluorinated olefin and a fluorinated vinyl ether).Type: ApplicationFiled: October 17, 2013Publication date: February 18, 2016Applicant: DAICEL-EVONIK LTD.Inventors: Tatsuki AKASHI, Mitsuteru MUTSUDA
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Patent number: 9233065Abstract: Disclosed is a method for producing resin particles, which can impart a desired function to the surface of resin particles efficiently and simply. Also disclosed are resin particles produced by the method. The method produces resin particles by melting and mixing an acidic-group-containing thermoplastic resin or elastomer with filler particles and a water-soluble material to give a resin composition containing resin fine particles formed by the thermoplastic resin and the filler particles and dispersed in a matrix including the water-soluble material; and removing the matrix component from the resin composition, to give the resin particles. The resulting resin particles each include a core particle including the acidic-group-containing thermoplastic resin or elastomer, and the filler particles immobilized on the outside of the core particle. The acidic group is preferably carboxyl group or carboxylic anhydride group.Type: GrantFiled: May 22, 2008Date of Patent: January 12, 2016Assignee: DAICEL-EVONIK LTD.Inventors: Hideki Matsui, Yoshiki Nakaie, Hajime Komada
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Publication number: 20150259525Abstract: A thermoplastic resin composition having a high flame retardancy in a thin-wall molded product and a molded article thereof are provided. The thermoplastic resin composition comprises (A) a thermoplastic resin containing a repeating unit having an arylene group, an ether group, and a carbonyl group and (B) a thermoplastic fluorine-containing resin. The weight ratio of the thermoplastic resin (A) and the thermoplastic fluorine-containing resin (B) in the former/the latter is 80/20 to 99/1. The thermoplastic fluorine-containing resin (B) is dispersed in the form of a particle in the thermoplastic resin (A) to form a dispersed phase, and the dispersed phase has an average particle diameter of not more than 3 ?m. The thermoplastic resin composition is suitable for forming a molded article having a thin-wall portion with a thickness of not more than 1.5 mm.Type: ApplicationFiled: August 21, 2013Publication date: September 17, 2015Applicants: Daikin Industries, Ltd., Daicel-Evonik Ltd.Inventors: Mitsuteru Mutsuda, Tatsuki Akashi, Yuki Adachi, Haruhisa Masuda
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Patent number: 9127186Abstract: A film sealant useful for tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The device is covered and sealed by covering at least a region of the device with a film sealant containing a copolyamide-series resin, heat-melting the sealant, and cooling the sealant. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. and may be a crystalline resin. The copolyamide-series resin may be a multiple copolymer or may contain a unit derived from a long-chain component having a C8-16alkylene group (e.g., a C9-17lactam and an aminoC9-17alkanecarboxylic acid). The film sealant may cover one side of the device.Type: GrantFiled: September 21, 2011Date of Patent: September 8, 2015Assignee: DAICEL-EVONIK LTD.Inventors: Hiroaki Arita, Yoshiki Nakaie, Taiji Yamabe
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Publication number: 20150024130Abstract: A sealant capable of tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The sealant for sealing a device comprises a copolyamide-series resin powder having a particle diameter of not more than 1 mm. The copolyamide-series resin powder contains at least a fine particle (e.g., a copolyamide-series resin particle having an average particle diameter of 20 to 400 ?m), or may contain the fine particle in combination with a coarse particle (e.g., a copolyamide-series resin particle having an average particle diameter of 450 to 800 ?m). The copolyamide-series resin may be a crystalline resin. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. The copolyamide-series resin may be, e.g., a binary or ternary copolymer.Type: ApplicationFiled: February 8, 2013Publication date: January 22, 2015Applicant: Daicel-Evonik Ltd.Inventors: Hiroaki Arita, Yoshiki Nakaie, Mitsuteru Mutsuda
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Patent number: 8765047Abstract: Thermoplastic resin composition providing improved molding efficiency due to high flowability and a high crystallization temperature, while ensuring desired physical properties (e.g., strength) in a molded product. Also, molded product of the composition. The thermoplastic resin composition comprises a plurality of thermoplastic resins having a melt viscosity different from each other and containing a unit which comprises an arylene group and an ether group and/or a carbonyl group. The thermoplastic resin composition may comprise a first thermoplastic resin having a melt viscosity of 150 to 1500 Pa·s at a temperature of 400° C. and a shear rate of 1216 s?1 and a second thermoplastic resin, wherein the melt viscosity ratio of the first thermoplastic resin relative to the second thermoplastic resin, at a temperature of 400° C. and a shear rate of 1216 s?1, is 1.5:1 to 10:1.Type: GrantFiled: September 6, 2013Date of Patent: July 1, 2014Assignee: Daicel-Evonik Ltd.Inventor: Mitsuteru Mutsuda
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Patent number: 8703296Abstract: A functioning optical lens includes a molded polyamide layer, and an optical sheet including a polyamide sheet layer and an optical film layer. Such a functioning optical lens may be prepared by bending an optical sheet including an optical film layer and a polyamide sheet layer, and injection molding a polyamide composition onto the bent polyamide sheet layer so as to thermally fuse the polyamide composition and the polyamide sheet layer with each other.Type: GrantFiled: December 6, 2006Date of Patent: April 22, 2014Assignee: Daicel-Evonik Ltd.Inventors: Toshihiko Fujinaka, Masakazu Tokunaga