Patents Assigned to Daicel-Evonik Ltd.
-
Patent number: 8663542Abstract: A thermoplastic resin composition of which the molding efficiency can be improved by a high flowability and a high crystallization temperature while ensuring desired physical properties (e.g., strength) in a molded product, and a molded product of the composition are provided. The thermoplastic resin composition comprises a plurality of thermoplastic resins having a melt viscosity different from each other and containing a unit which comprises an arylene group and an ether group and/or a carbonyl group; when the thermoplastic resin composition at least comprises a first thermoplastic resin having a melt viscosity of 150 to 1500 Pa·s at a temperature of 400° C. and a shear rate of 1216 s?1, and a second thermoplastic resin, and the melt viscosity ratio of the first thermoplastic resin relative to the second thermoplastic resin at a temperature of 400° C. and a shear rate of 1216 s?1 [the former/the latter] is 1.5/1 to 10/1.Type: GrantFiled: July 9, 2010Date of Patent: March 4, 2014Assignee: Daicel-Evonik Ltd.Inventor: Mitsuteru Mutsuda
-
Publication number: 20140008843Abstract: A thermoplastic resin composition of which the molding efficiency can be improved by a high flowability and a high crystallization temperature while ensuring desired physical properties (e.g., strength) in a molded product, and a molded product of the composition are provided. The thermoplastic resin composition comprises a plurality of thermoplastic resins having a melt viscosity different from each other and containing a unit which comprises an arylene group and an ether group and/or a carbonyl group; when the thermoplastic resin composition at least comprises a first thermoplastic resin having a melt viscosity of 150 to 1500 Pa·s at a temperature of 400° C. and a shear rate of 1216 s?1, and a second thermoplastic resin, and the melt viscosity ratio of the first thermoplastic resin relative to the second thermoplastic resin at a temperature of 400° C. and a shear rate of 1216 s?1 [the former/the latter] is 1.5/1 to 10/1.Type: ApplicationFiled: September 6, 2013Publication date: January 9, 2014Applicant: DAICEL-EVONIK LTD.Inventor: Mitsuteru MUTSUDA
-
Publication number: 20130318835Abstract: A sheet for forming a shoe sole, useful for efficiently joining a crosslinked rubber layer as a stud and a thermoplastic elastomer layer as a sole, is provided. The sheet comprises a resin component (A) containing a polyamide resin (a) and having an amino group concentration of not less than 10 mmol/kg and a flexural modulus of not less than 300 MPa in accordance with ISO178. The polyamide resin (a) may contain a polyamide resin having a melting point of not less than 165° C. at a predetermined concentration (e.g., not less than 30% by weight) in the total polyamide resin (a).Type: ApplicationFiled: March 11, 2011Publication date: December 5, 2013Applicant: DAICEL-EVONIK LTD.Inventors: Mitsuteru Mutsuda, Hiroaki Arita, Tomohiro Kawahara
-
Publication number: 20130177704Abstract: A sealant capable of tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The sealant for molding and sealing a device comprises a copolyamide-series resin powder. The copolyamide-series resin may be a crystalline resin. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. The copolyamide-series resin may be a multiple copolymer, e.g., a binary or ternary copolymer. Further, the copolyamide-series resin may contain a unit derived from a long-chain component having a C8-16alkylene group (at least one component selected from the group consisting of a C9-17lactam and an aminoC9-17alkanecarboxylic acid).Type: ApplicationFiled: September 21, 2011Publication date: July 11, 2013Applicant: DAICEL-EVONIK LTD.Inventors: Hiroaki Arita, Yoshiki Nakaie, Mitsuteru Mutsuda
-
Publication number: 20130171440Abstract: A film sealant useful for tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The device is covered and sealed by covering at least a region of the device with a film sealant containing a copolyamide-series resin, heat-melting the sealant, and cooling the sealant. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. and may be a crystalline resin. The copolyamide-series resin may be a multiple copolymer or may contain a unit derived from a long-chain component having a C8-16alkylene group (e.g., a C9-17lactam and an aminoC9-17alkanecarboxylic acid). The film sealant may cover one side of the device.Type: ApplicationFiled: September 21, 2011Publication date: July 4, 2013Applicant: DAICEL-EVONIK LTD.Inventors: Hiroaki Arita, Yoshiki Nakaie, Taiji Yamabe
-
Patent number: 8173262Abstract: In a molded composite article, a resin member comprising a non-urethane thermoplastic resin and a resin member comprising a thermoplastic polyurethane resin are directly joined with each other. The non-urethane thermoplastic resin comprises at least one member selected from the group consisting of a polyamide component having an alicyclic ring and an amino group-containing compound, or each of the non-urethane thermoplastic resins and the thermoplastic polyurethane has a polyether segment. Even if the base resin is a non-urethane thermoplastic resin, the present invention provides a direct and firm bonding between the non-urethane thermoplastic resin member and the thermoplastic polyurethane resin member.Type: GrantFiled: September 30, 2004Date of Patent: May 8, 2012Assignee: Daicel-Evonik Ltd.Inventors: Mitsuteru Mutsuda, Hiroaki Arita, Hajime Komada, Toru Ikuta
-
Patent number: 8148357Abstract: Resin particles are produced by adding a liquid material having a boiling point of 100° C. or higher to an aqueous dispersion of resin particles to yield a mixture, recovering a wet cake from the mixture by filtration, and drying the wet cake. A water-soluble material is preferably used as the liquid material. The liquid material may also be at least one compound selected from compounds listed in The Japanese Standards of Cosmetic Ingredients, The Japanese Cosmetic Ingredients Codex, The Pharmacopoeia of Japan, and The Japan's Specifications and Standards for Food Additives. According to this method, there are provided resin particles which are resistant to coagulation upon drying and are satisfactorily dispersible in other materials.Type: GrantFiled: September 13, 2005Date of Patent: April 3, 2012Assignee: Daicel-Evonik Ltd.Inventor: Arimichi Okumura
-
Patent number: 8029910Abstract: The present invention is directed to a composite comprising a resin element comprising a resin composition and a vulcanized rubber element formed by vulcanizing an unvulcanized rubber, wherein the resin composition comprises a resin, a vulcanization-activating agent for improving adhesiveness of the resin to a rubber, and a stabilizer, and the resin composition and the vulcanized rubber are directly joined together.Type: GrantFiled: May 4, 2010Date of Patent: October 4, 2011Assignee: Daicel-Evonik Ltd.Inventors: Toru Ikuta, Hajime Komada, Mitsuteru Mutsuda, Hiroaki Arita, Naoki Wakita
-
Patent number: 7989540Abstract: A resin composition comprises a resin, a vulcanization-activating agent, and a stabilizer. The vulcanization-activating agent may be a compound having a plurality of polymerizable unsaturated bonds (e.g., a compound having a plurality of (meth)acryloyl groups). The stabilizer may be an antioxidant, or a light stabilizer (particularly, a stabilizer is capable of capturing a radical). Use of the resin composition as a resin material ensures to directly join between a resin and a rubber certainly and firmly. The proportion of the vulcanization-activating agent may be about 0.1 to 10 parts by weight relative to 100 parts by weight of the resin. The proportion of the stabilizer may be about 0.01 to 5 parts by weight relative to 100 parts by weight of the resin. The present invention provides a resin composition excellent in adhesiveness to a rubber.Type: GrantFiled: September 12, 2003Date of Patent: August 2, 2011Assignee: Daicel-Evonik Ltd.Inventors: Toru Ikuta, Hajime Komada, Mitsuteru Mutsuda, Hiroaki Arita, Naoki Wakita
-
Patent number: 7740943Abstract: In a molded composite article formed by directly bonding a resin member comprising a polyamide-series resin to a resin member comprising a thermoplastic polyurethane-series resin, the polyamide-series resin comprises a polyamide block copolymer containing (A) a polyether segment having at least one terminal imino group. The polyamide-series resin may comprise a polyamide-series resin having a free amino group in a concentration of not less than about 10 mmol/kg. The molded composite article is producible, for example, by heating at least one of the polyamide-series resin and the thermoplastic polyurethane-series resin to bond the former to the latter. Thus obtained molded composite article is suitable for a member of a shoe and an industrial roll. In such a process, the polyamide-series resin member and the thermoplastic polyurethane-series resin member both of which are different in nature from each other can be directly and firmly bonded together.Type: GrantFiled: May 1, 2005Date of Patent: June 22, 2010Assignee: Daicel-Evonik Ltd.Inventors: Mitsuteru Mutsuda, Hiroaki Arita, Hajime Komada, Toru Ikuta
-
Publication number: 20090194225Abstract: A rubber-reinforced structure comprises a composite member comprising a resin member and a rubber member being directly bonded to the resin member without any adhesive, wherein the resin member and the rubber member form a tire. The composite member can be obtained by bringing a resin member into contact with an unvulcanized rubber composition in the following combination, and vulcanizing the unvulcanized rubber: (i) a combination of a rubber composition containing a radical-generating agent, and a resin composition containing a thermoplastic resin having at least two active atoms (a hydrogen atom or a sulfur atom) on the average per molecule, each atom having an orbital interaction energy coefficient S of not less than 0.Type: ApplicationFiled: April 10, 2009Publication date: August 6, 2009Applicant: Daicel-Evonik Ltd.Inventor: Toru IKUTA
-
Patent number: 7553912Abstract: A resin comprises a resin containing a vulcanization-activating agent, or crosslinkable group-containing resin (e.g., a resin having an unsaturated bond). Moreover, a composite dispersion may be formed by a combination of a specific resin and rubber [e.g., (a) a combination of a resin, and an unvulcanized rubber containing a vulcanizing agent and a vulcanization-activating agent at a specific ratio; (b) a combination of a polyamide-series resin, and an unvulcanized rubber containing a vulcanizing agent and a polyalkenylene at a specific ratio; (c) a combination of a resin and a silicone-series unvulcanized rubber; and (d) a combination of a polyphenylene ether-series resin containing a polyalkenylene, and an unvulcanized rubber containing a sulfur or sulfur-containing organic compound as a vulcanizing agent].Type: GrantFiled: July 4, 2003Date of Patent: June 30, 2009Assignee: Daicel-Evonik Ltd.Inventors: Toru Ikuta, Hajime Komada, Mitsuteru Mutsuda
-
Patent number: 7534494Abstract: In a molded composite article formed by directly joining a resin member comprising a polyamide-series resin to a resin member comprising a thermoplastic polyurethane-series resin, as the polyamide-series resin, a polyamide-series resin having an amino group of not less than 10 mmol/kg is used. The molded composite article may be produced by heating at least any one of the polyamide-series resin and the thermoplastic polyurethane-series resin to join to the other resin.Type: GrantFiled: December 1, 2003Date of Patent: May 19, 2009Assignee: Daicel-Evonik Ltd.Inventors: Naoki Wakita, Mitsuteru Mutsuda, Hiroaki Arita, Hajime Komada, Toru Ikuta