Abstract: An image sensor assembly and a method for assembling. The assembly includes: a ceramic package; at least one wall raised from the ceramic package, one of the walls for dividing a first surface region and a second surface region of the ceramic package; a frame supported by the ceramic package; a first set of fiducial markers and a second set of fiducial markers visible on the frame; a first die for placement onto the first surface region, the first die including an image sensor and respective fiducial markers for alignment with the first set of fiducial markers; a second die for placement onto the second surface region, the second die including an image sensor and respective fiducial markers for alignment with the second set of fiducial markers; and at least one optical filter each associated with one of the dice and supported by at least one of the walls.

Abstract: An apparatus comprising a variable aperture for controlling electromagnetic radiation and related systems and methods are described. In one aspect, a variable aperture to control electromagnetic radiation comprises a first substrate, a second substrate, an attenuation fluid, at least one charging electrode, and at least one displacing electrode. The second substrate is located opposite the first substrate and spaced apart from the first substrate to form a gap between the first substrate and the second substrate. The attenuation fluid is located in the gap and configured to absorb electromagnetic radiation of a predetermined wavelength. The at least one charging electrode is in electrical contact with the attentional fluid. The at least one displacing electrode is located on a surface of the first substrate facing the gap or on a surface of the second substrate facing the gap.

Abstract: A method of making a device having a component with a planar surface bonded to a supporting frame with openings therein by an adhesive layer cured by actinic rays, wherein part of the adhesive layer lies in the shadow of opaque portions of the supporting frame, involves bringing the component and supporting frame together with a layer of adhesive applied between them. The part of the adhesive layer in the shadow of the opaque portions is cured by directing actinic rays obliquely through the openings so that they are reflected internally into the part of the adhesive layer in the shadow of the opaque portions.

Abstract: A device has planar components forming part of a stack on a support frame, such as a substrate and upper layer, for example a fiber optic scintillator/fiber optic plate, bonded together by an adhesive layer of well-defined thickness. The device is made by providing a trench in a peripheral recess extending in a marginal portion of the support frame. Excess adhesive is applied to one of the planar components, which are then brought together such that the adhesive layer of well-defined thickness is formed between the two components and surplus adhesive is collected in the trench.

Abstract: An apparatus for compressing a video image file is disclosed. The image file includes line segments having a length of M pixels of N bits and a header of H bits. Each pixel is represented by t bits. The apparatus includes a circuit configured to read a first number of unencoded pixel values in a first line segment and read a second number of unencoded pixel values of a second line segment are read. The first and second line segments preceded by a header of H bits and each pixel value is represented by t bits. The differences between each of the first and second unencoded pixel values is determined. The differences between each of the first and second unencoded pixel values encoded only using a smallest number of bits t for a given number of bits for each pixel value in the segment, wherein t is defined as an integer between 1 and N.

Abstract: Stand-offs are attached around the periphery of the fiber optic plate (FOP) to ensure a certain minimum thickness between the FOP and the imaging sensor to reduce shear stress and the risk of delamination due to shear stress in an X or Gamma ray detector. A coupling material fills the gap between the FOP and the imaging sensor.

Abstract: A device has planar components forming part of a stack on a support frame, such as a substrate and upper layer, for example a fiber optic scintillator/fiber optic plate, bonded together by an adhesive layer of well-defined thickness. The device is made by providing a trench in a peripheral recess extending in a marginal portion of the support frame. Excess adhesive is applied to one of the planar components, which are then brought together such that the adhesive layer of well-defined thickness is formed between the two components and surplus adhesive is collected in the trench.

Abstract: A radiation imaging device having a moisture impermeable metal layer compressed against a scintillator layer by compressible layer that is mechanically compressed against the scintillator layer. The metal layer is attached to the scintillator substrate by an adhesive ring surrounding the perimeter of the scintillator substrate. The adhesive can further include moisture getter particles. Preferably the metal layer is comprised of aluminum with a thickness between 25 ?m and 100 ?m to allow the layer to be flexible as free of pinholes to prevent ingress of moisture. The compressible layer can be compressed by the housing to maintain the metal layer in contact with the scintillator layer. The metal layer not only provides moisture protection for the scintillator but also increases the output of the scintillator by reflecting photons generated by the scintillator layer toward the photodetector array of the radiation imaging device.

Abstract: Wirebond protection is provided for imaging tiles in which the imaging sensor and PCB are mounted side-by-side on a tile carrier for use in X or Gamma Ray indirect imaging detectors without use of a “glob top” encapsulant. A glass cap comprising a bead of adhesive material and a lid is formed to provide an enclosed open-air cavity around the wire bonds. As such, any expansion of the bead material does not produce mechanical stress on the wire bonds.

Abstract: Provided is an image capturing apparatus for capturing an image of a target object by optically scanning the target object by moving in a predetermined scanning direction. The apparatus includes a light-receiving device that is disposed on a light-receiving surface of the image capturing apparatus and accumulates an electric charge according to an amount of light received from a light detection window, a length of which in the scanning direction is shorter than a length in the scanning direction of an area defined as one pixel of the target object; and an output device that outputs the electric charge accumulated by the light-receiving device when the light-receiving device has completed the optical scanning of the area defined as one pixel.

Abstract: An improved complementary metal oxide semiconductor image sensor for time delay and integration imaging is provided that utilizes rolling shutter pixels. Columns of rolling shutter pixels in the CMOS image array are provided with a space between adjacent pixels to provide synchronization with movement of the subject in the along track direction. Preferably, the physical offset between the pixels is 1/Nth of a pixel pitch for a column having N rows.

Abstract: A system and method for limiting fixed pattern noise (FPN) in a time delay and integration (TDI) mode of operation of a complementary metal oxide semiconductor (CMOS) imaging device is disclosed. The system and method provide for each line time, selecting a pixel for each column of photosensitive elements in the along track direction to capture dark information such that the selected pixel does not correspond to a portion of a scene that was previously selected to capture dark information in a current TDI period. The dark information for the selected pixels is captured and summed for each column of photosensitive elements. This sum is then used during a next TDI time period to subtract FPN effects from the output of the corresponding column. This allows the dark sum information to be constantly updated while the image sensor is in use while only decreasing the responsitivity by (N?1)/N relative to an N pixel column of a traditional TDI operation.

Abstract: A CMOS time delay and integration image sensor is disclosed having analog sampling stages coupled to the column bus that correspond to a pixel in the column. The analog sampling stages have a first memory element that stores the pixels reset level signal and a second memory element that stores an output signal of a previous analog sampling stage in the column. The analog sampling stage integrates the signal of the previous analog sampling stage with the sampled photosignal of the corresponding pixel and subtracts the reset level. The analog sampling stage architecture provides global shuttering and correlated double sampling and only requires a single analog to digital conversion for each TDI line time.

Abstract: A method of making a high resolution camera includes assembling, imaging and processing. The assembling includes assembling on a carrier a plurality of sensors. Each sensor is for imaging a portion of an object. The plurality of sensors are disposed so that the portions imaged by adjacent sensors overlap in a seam leaving no gaps between portions. The imaging images a predetermined known pattern to produce from the plurality of sensors a corresponding plurality of image data sets. The processing processes the plurality of image data sets to determine offset and rotation parameters for each sensor by exploiting overlapping seams.

Abstract: A device and method for continuous vertical clocking a charge-coupled device image sensor operating in a time delay and integration and binning mode of operation is disclosed. The method includes providing a charge-coupled device image sensor with a continuous charge transfer signal to a vertical charge-coupled device register for shifting charge continuously to more closely approximate the speed of movement of the target object of capture by the image sensor in order to eliminate artifacts in the TDI imaging direction. The control module of the CCD image sensor provides the continuous charge transfer signal to the vertical charge-coupled device register.

Abstract: An infrared imaging device that groups two or more active radiation detectors with at least one shielded radiation detector for cancelling the self-heating effect from the active radiation detectors is disclosed. A power supply is coupled to the group containing active and at least one shielded radiation detector to provide power to the group synchronously so that the active and shielded radiation detectors will be subjected to the same self-heating effect. A readout module subtracts a reference signal received from the shielded radiation detectors from each of the active signals received from each of the active radiation detectors. The infrared imaging device can have one or more shielded radiation detectors for each row of active radiation detectors in an infrared imaging array.

Abstract: An improved complementary metal oxide semiconductor image sensor for time delay and integration imaging is provided that utilizes rolling shutter pixels. Columns of rolling shutter pixels in the CMOS image array are provided with a space between adjacent pixels to provide synchronization with movement of the subject in the along track direction. Preferably, the physical offset between the pixels is 1/Nth of a pixel pitch for a column having N rows.

Abstract: An assembly includes a first packaged device that contains a first image sensor having first fiducial marks thereon. On a portion of the first packaged device at a predetermined location relative to the first fiducial marks is adhesive, and a first connection body is fixed within the adhesive and registered at the predetermined location relative to the first fiducial marks. The first connection body is mated into the first counter hole formed in a plate at a predetermined location.

Abstract: A method and system of constructing and assembling a radiological imaging sensor having a transparent crystalline substrate plate, such as a glass or sapphire plate, for use in assembling the radiological imaging sensor using either a clear fiber optic plate of a dark fiber optic plate with ultraviolet curable adhesives. The transparent glass substrate plate may further include at least one crystalline sapphire strip disposed in an aperture therewithin. Flexible cable connections are provided by wire bonding to the imaging die substrate.

Abstract: An imaging system may include: at least one photon sensing pixel; at least one digital counting circuit; and at least one processing core programmed to apply at least one image processing algorithm to at least one pixel sample of the at least one digital counting circuit.