Patents Assigned to Danfoss Silicon Power GmbH
  • Patent number: 10794390
    Abstract: The Modular turbo compressor shaft (4) comprise a tubular bearing portion (5) having a first axial end portion and a second axial end portion; an impeller portion (6) arranged at the first axial end portion of the tubular bearing portion (5); and a driving portion (7) arranged at the second axial end portion of the tubular bearing portion (5). The tubular bearing portion (5) is made of a hard material, and the impeller portion (6) and/or the driving portion (7) are made of relatively soft material compared to the hard material of the tubular bearing portion (5). The impeller portion (6) and/or the driving portion (7) are at least partially extending into the tubular bearing portion (5) and are firmly connected to the tubular bearing portion (5).
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: October 6, 2020
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Patrice Bonnefoi, Arnaud Daussin, Yves Rosson
  • Patent number: 10607962
    Abstract: A method for manufacturing semiconductor chips (2, 3) having arranged thereon metallic shaped bodies (6), having the following steps: arranging a plurality of metallic shaped bodies (6) on a processed semiconductor wafer while forming a layer arranged between the semiconductor wafer and the metallic shaped bodies (6), exhibiting a first connection material (4) and a second connection material (5), and processing the first connection material (4) for connecting the metallic shaped bodies (6) to the semiconductor wafer without processing the second connecting material (5), wherein the semiconductor chips (2, 3) are separated either prior to arranging the metallic shaped bodies (6) on the semiconductor wafer or after processing the first connection material (4).
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: March 31, 2020
    Assignee: DANFOSS SILICON POWER GMBH
    Inventors: Frank Osterwald, Martin Becker, Holger Ulrich, Ronald Eisele, Jacek Rudzki
  • Patent number: 10483229
    Abstract: Sintering device for sintering at least one electronic assembly, having a lower die and an upper die which is slidable towards the lower die, or a lower die which is slidable towards the upper die. The lower die forms a support for the assembly to be sintered and the upper die includes a receptacle for a pressure pad for exerting pressure directed towards the lower die, and a delimitation wall which laterally surrounds the pressure pad. The delimitation wall having an outer delimitation wall and an inner delimitation wall surrounded by the outer delimitation wall, the inner delimitation wall mounted so as to be slidable towards the outer delimitation wall and so as to be slid in the direction of the lower die such that, following the placing of the inner delimitation wall on the lower die, the pressure pad is displaceable in the direction of the lower die.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: November 19, 2019
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Frank Osterwald, Ronald Eisele, Martin Becker, Lars Paulsen, Jacek Rudzki, Holger Ulrich
  • Patent number: 10438924
    Abstract: A method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module by sintering, the method comprising the steps of: applying a layer of unsintered sinter material to a predetermined bonding surface of the first component, arranging the second component on the surface layer of unsintered sinter material, attaching the second component to the first component by applying pressure and/or temperature on a locally delimited partial area within the predetermined bonding surface, processing the first and/or second component and/or other components of the power semiconductor module, and complete-area sintering of the sinter material.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: October 8, 2019
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Martin Becker, Ronald Eisele, Frank Osterwald, Jacek Rudzki, Holger Ulrich
  • Patent number: 10403566
    Abstract: A power module (10) having a leadframe (20), a power semiconductor (30) arranged on the leadframe (20), a base plate (40) for dispersing heat generated by the power semiconductor (30) and a potting compound (50) surrounding the leadframe (20) and the power semiconductor (30), that physically connects the power semiconductor (30) and/or the leadframe (20) to the base plate (40).
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: September 3, 2019
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Ronald Eisele, Frank Osterwald
  • Patent number: 10381283
    Abstract: The present invention discloses a power semiconductor module, comprising: a substrate; a semiconductor provided on a top side of the substrate; and a package formed on the semiconductor and the substrate, wherein the package has openings at a top side thereof, through which terminal contacts of the semiconductor and the substrate are exposed outside and accessible from outside.
    Type: Grant
    Filed: July 4, 2016
    Date of Patent: August 13, 2019
    Assignee: DANFOSS SILICON POWER GMBH
    Inventors: Frank Osterwald, Ronald Eisele, Holger Ulrich
  • Patent number: 10332858
    Abstract: An electronic sandwich structure which has at least a first and a second part to be joined, which are sintered together by means of a sintering layer. The sintering layer is formed as a substantially uninterrupted connecting layer, the density of which varies in such a way that at least one region of higher density and at least one region of lower density alternate with one another. A method for forming a sintering layer of an electronic sandwich structure, in which firstly a sintering material layer is applied substantially continuously to a first part to be joined as a connecting layer, this sintering material layer is subsequently dried and, finally, alternating regions of higher density and of lower density of the connecting layer are produced by sintering the first part to be joined with the sintering layer on a second part to be joined.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: June 25, 2019
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Martin Becker, Ronald Eisele, Jacek Rudzki, Frank Osterwald
  • Patent number: 10306800
    Abstract: The present invention discloses a cooling trough comprising an unflat surface, surrounding an opening of the cooling trough, configured with a height essentially decreasing inwardly. At least one supporting line, running around the opening of the cooling trough, is formed on the unflat surface. The at least one supporting line contacts a baseplate of a power module after the baseplate is attached to the unflat surface of the cooling trough. In addition, the present invention also discloses a cooler comprising the cooling trough and a power module assembly comprising the cooler.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: May 28, 2019
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Franke Wulf-Toke, Ronald Eisele, Reiner Hinken, Frank Osterwald, Klaus Olesen, Lars Paulsen
  • Patent number: 10079219
    Abstract: A power semiconductor contact structure for power semiconductor modules, which has at least one substrate 1 and a metal molded body 2 as an electrode, which are sintered one on top of the other by means of a substantially uninterrupted sintering layer 3a with regions of varying thickness. The metal molded body 2 takes the form here of a flexible contacting film 5 of such a thickness that this contacting film is sintered with its side 4 facing the sintering layer 3a onto the regions of varying thickness of the sintering layer substantially over the full surface area. A description is also given of a method for forming a power semiconductor contact structure in a power semiconductor module that has a substrate and a metal molded body.
    Type: Grant
    Filed: October 12, 2015
    Date of Patent: September 18, 2018
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Martin Becker, Ronald Eisele, Frank Osterwald, Jacek Rudzki
  • Patent number: 9786627
    Abstract: The invention relates to a method for connecting a power semi-conductor chip having upper-sided potential surfaces to thick wires or strips, consisting of the following steps: Providing a metal molded body corresponding to the shape of the upper-sided potential surfaces, applying a connecting layer to the upper-sided potential surfaces or to the metal molded bodies, and applying the metal molded bodies and adding a material fit, electrically conductive compound to the potential surfaces prior to the joining of the thick wire bonds to the non-added upper side of the molded body.
    Type: Grant
    Filed: September 10, 2012
    Date of Patent: October 10, 2017
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Martin Becker, Ronald Eisele, Frank Osterwald, Jacek Rudzki
  • Publication number: 20170216920
    Abstract: Sintering tool (10) with a cradle for receiving an electronic subassembly (BG) to be sintered, characterized by at least one support bracket (20), arranged at two locations opposite the cradle, for fixing a protective film (30) covering the electronic subassembly (BG).
    Type: Application
    Filed: September 9, 2015
    Publication date: August 3, 2017
    Applicant: Danfoss Silicon Power GMBH
    Inventors: Frank Osterwald, Martin Becker, Lars Paulsen, Jacek Rudzki, Holger Ulrich, Ronald Eisele
  • Patent number: 9613929
    Abstract: The invention relates to a power semiconductor chip (10) having at least one upper-sided potential surface and contacting thick wires (50) or strips, comprising a connecting layer (I) on the potential surfaces, and at least one metal molded body (24, 25) on the connecting layer(s), the lower flat side thereof facing the potential surface being provided with a coating to be applied to the connecting layer (I) according to a connection method, and the material composition thereof and the thickness of the related thick wires (50) or strips arranged on the upper side of the molded body used according to the method for contacting are selected corresponding to the magnitude.
    Type: Grant
    Filed: April 11, 2016
    Date of Patent: April 4, 2017
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Martin Becker, Ronald Eisele, Frank Osterwald, Jacek Rudzki
  • Patent number: 9318421
    Abstract: The invention relates to a power semiconductor chip (10) having at least one upper-sided potential surface and contacting thick wires (50) or strips, comprising a connecting layer (I) on the potential surfaces, and at least one metal molded body (24, 25) on the connecting layer(s), the lower flat side thereof facing the potential surface being provided with a coating to be applied to the connecting layer (I) according to a connection method, and the material composition thereof and the thickness of the related thick wires (50) or strips arranged on the upper side of the molded body used according to the method for contacting are selected corresponding to the magnitude.
    Type: Grant
    Filed: September 10, 2012
    Date of Patent: April 19, 2016
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Martin Becker, Ronald Eisele, Frank Osterwald, Jacek Rudzki
  • Patent number: 9287232
    Abstract: The invention relates to a method for producing a connection between a semiconductor component and semiconductor component and semiconductor module resistant to high temperatures and temperature changes by means of a temperature impinging process, wherein a metal powder suspension is applied to the areas of the semiconductor module to be connected later; the suspension layer is dried, outgassing the volatile components and generating a porous layer; the porous layer is pre-sealed without complete sintering taking place throughout the suspension layer; and, in order to obtain a solid electrically and thermally conductive connection of a semiconductor module to a connection partner from the group of: substrate, further semiconductor or interconnect device, the connection is a sintered connection generated without compression by increasing the temperature and made of a dried metal powder suspension that has undergone a first transport-safe contact with the connection partner in a pre-compression step and has bee
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: March 15, 2016
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Mathias Kock, Ronald Eisele
  • Patent number: 9040338
    Abstract: Method of manufacturing sinterable electrical components for jointly sintering with active components, the components in planar shape being provided with at least one planar lower face meant for sintering, and an electrical contact area on the face opposite to the sintering face being available in the form of a metallic contact face, whose upper side is contactable by means of a commonly known method of the group: wire bonding or soldering or sintering or pressure contacting, the component being a temperature sensor, whose lower face is provided with a sinterable metallization on a ceramic body, said ceramic body having two electrical contact faces for continued electrical connection.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: May 26, 2015
    Assignee: Danfoss Silicon Power GmbH
    Inventor: Ronald Eisele
  • Publication number: 20140230989
    Abstract: The invention relates to a method for connecting a power semi-conductor chip having upper-sided potential surfaces to thick wires or strips, consisting of the following steps: Providing a metal moulded body corresponding to the shape of the upper-sided potential surfaces, applying a connecting layer to the upper-sided potential surfaces or to the metal moulded bodies, and applying the metal moulded bodies and adding a material fit, electrically conductive compound to the potential surfaces prior to the joining of the thick wire bonds to the non-added upper side of the moulded body.
    Type: Application
    Filed: September 10, 2012
    Publication date: August 21, 2014
    Applicant: DANFOSS SILICON POWER GMBH
    Inventors: Martin Becker, Ronald Eisele, Frank Osterwald, Jacek Rudzki
  • Publication number: 20140225247
    Abstract: The invention relates to a power semiconductor chip (10) having at least one upper-sided potential surface and contacting thick wires (50) or strips, comprising a connecting layer (I) on the potential surfaces, and at least one metal moulded body (24, 25) on the connecting layer(s), the lower flat side thereof facing the potential surface being provided with a coating to be applied to the connecting layer (I) according to a connection method, and the material composition thereof and the thickness of the related thick wires (50) or strips arranged on the upper side of the moulded body used according to the method for contacting are selected corresponding to the magnitude.
    Type: Application
    Filed: September 10, 2012
    Publication date: August 14, 2014
    Applicant: DANFOSS SILICON POWER GMBH
    Inventors: Martin Becker, Ronald Eisele, Frank Osterwald, Jacek Rudzki
  • Patent number: 8802564
    Abstract: A method of manufacturing a semiconductor component includes the steps of manufacturing of a wafer, applying structures of components on the wafer to form a wafer assembly, applying a metal coating on the wafer, removing the metal coating in non-contact areas of the components, applying surrounds on the edge areas of the components, arranging the wafer on a foil held by a clamping ring, separating the components of the wafer compound carried by the foil from one another, arranging a covering mask on the areas of the separated components carried by the foil which are not to be coated, applying a metal coating on the separate components covered with the mask, removal of the mask, and removal of the components from the foil and further processing the separate components wherein that applying a metal coating on the separate components covered by the mask takes place by means of thermal spraying.
    Type: Grant
    Filed: May 1, 2012
    Date of Patent: August 12, 2014
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Mathias Kock, Ronald Eisele
  • Patent number: 8546923
    Abstract: Method for manufacturing a rigid power module with a layer that is electrically insulating and conducts well thermally and has been deposited as a coating, the structure having sprayed-on particles that are fused to each other, of at least one material that is electrically insulating and conducts well thermally, having the following steps: manufacturing a one-piece lead frame; populating the lead frame with semiconductor devices, possible passive components, and bonding corresponding connections, inserting the thus populated lead frame into a compression mold so that accessibility of part areas of the lead frame is ensured, pressing a thermosetting compression molding compound into the mold while enclosing the populated lead frame, coating the underside of the thus populated lead frame by thermal spraying in at least the electrically conducting areas and overlapping also the predominant areas of the spaces, filled with mold compound.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: October 1, 2013
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Ronald Eisele, Mathias Kock, Teoman Senyildiz
  • Patent number: 8490681
    Abstract: The invention provides a fluid cooling system comprising a heat exchanger with an outer wall forming a chamber with an inlet and an outlet for circulating a heat exchange medium in the chamber. The chamber has an opening towards the component which is to be cooled, and to protect the component, the opening is closed by a flexible wall which is attached to the outer wall. To protect the cover and the component against overload, the flexible wall is attached to an inner wall inside the chamber. The cooling system could be applied to electronic systems, e.g. for cooling a DCB substrate or similar electronic components.
    Type: Grant
    Filed: March 9, 2005
    Date of Patent: July 23, 2013
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Ronald Eisele, Klaus Kristen Olesen