Abstract: An apparatus and method for laser probing of a DUT at very high temporal resolution is disclosed. The system includes a CW laser source, a beam optics designed to point two orthogonally polarized beams at the same location on the DUT, optical detectors for detecting the reflected beams, collection electronics, and an oscilloscope. The beam optics defines a common-path polarization differential probing (PDP) optics. The common-path PDP optics divides the laser beam into two beams of orthogonal polarization. Due to the intrinsic asymmetry of a CMOS transistor, the interaction of the beams with the DUT result in different phase modulation in each beam. This difference can be investigated to study the response of the DUT to the stimulus signal.

Abstract: An optical coupling apparatus for a dual column charged particle beam tool allowing both optical imaging of an area of an integrated circuit, as well as localized heating of the integrated circuit to form silicide. In one embodiment, optical paths from a whitelight source and a laser source are coupled together by way of first and second beam splitters so that a single optical port of the dual column tool may be utilized for both imaging and heating. In another embodiment, a single laser source is employed to provide both illumination for standard microscopy-type imaging, as well as localized heating. In a third embodiment, a single laser source provides heating along with localized illumination for confocal scanning microscopy-type imaging.

Abstract: Column for simultaneously producing a focused particle beam and a focused light beam and method for treating a sample using the column. The column has lateral walls, an input electrode having a particle aperture for emitting a particle beam, an electrostatic lens, an optical focusing device within the lens, and a deflection optical mirror. The method comprises locating the sample below the column, passing the particle beam through entry aperture and exit aperture of the lens to be focused on a selected location on the sample, and injecting an optical beam into the lens through the entry aperture. The lens incorporates convex and concave optical mirrors. The optical beam is injected into the lens to reflect from the convex optical mirror towards the concave optical mirror and then reflect from the concave optical mirror to exit from the exit aperture to be focused on the selected location on the sample.

Abstract: A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a spray chamber that, during operation, is urged in a sealing manner onto a sealing plate holding the integrated circuit under test. The atomized mist cools the integrated circuit and then condenses on the spray chamber wall. The condensed fluid is pumped out of the chamber and is circulated in a chiller, so as to be recirculated and injected again into the micro-spray heads. The pressure inside the spray chamber may be controlled to provide a desired boiling point.

Abstract: An IREM image of an IC is obtained. The emission intensity at each emission site is measured/calculated and is compared to reference intensity. The calculated intensity may be plotted against reference intensities. In general, the majority of the plotted intensities would lie in a given range within a straight line. However, for devices that exhibit an abnormal emission, the plot would result in an easily observable deviation from the line. The calculated intensity is used to make a determination of logical “1” or “0” for each device, which is automatically stored together with the corresponding test vector. The calculated logical states are then tabulated and compared against tabulation of reference logical states.

Abstract: Enhanced algorithms are provided for finding circuit edit locations which utilize automated conversions from circuit schematic to physical layout design. The enhanced algorithms further include a user interface enabling the user to provide preferences, limitations, and constraints in order to bias the search to be conducted, as well as using the provided design data in order to locate the best positions for particular edit schemes, including net cuts and net joins.

Abstract: A method, system and apparatus are presented for real time analysis of images in a focused beam system. In various embodiments, marker positions are displayed as graphical elements on the image of a sample being processed. Selected characteristics of all or a portion of the pixels in the image are used to determine the positions. The marker positions are used to detect the occurrence of an event such as an endpoint. In some embodiments attributes of the of the graphic elements change based on the occurrence of selected events and in further embodiments an action is initiated.

Abstract: A method and apparatus for defining a circuit operation, such as a charged particle beam operation to perform a circuit edit and define a probe point. Circuit operation definition is performed in a front-end environment with access to integrated circuit computer aided design tools providing logic level and layout level information concerning the integrated circuit. The front-end environment incorporates circuit operation optimization methods to identify optimal locations for a circuit operation. A back-end environment, such as a charged particle tool computing platform, is adapted to receive one or more files, which may include a truncated layout file with circuit operation location information, for use in further defining a circuit operation and/or performing the circuit operation.

Abstract: A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a spray chamber that, during operation, is urged in a sealing manner onto a sealing plate holding the integrated circuit under test. The atomized mist cools the integrated circuit and then condenses on the spray chamber wall. The condensed fluid is pumped out of the chamber and is circulated in a chiller, so as to be re-circulated and injected again into the micro-spray heads. The pressure inside the spray chamber may be controlled to provide a desired boiling point.

Abstract: A bi-convex solid immersion lens is disclosed, having a top and bottom convex surfaces. The radius of curvature of the bottom surface is larger than that of the top surface. A conical sloped side-wall connects the top and bottom surface.

Abstract: An apparatus and method are disclosed for hard-docking of a tester head to a DUT, while permitting the angular alignment of a specimen to be inspected to the optical axis of an optical testing tool. In one example, a system for orthogonal alignment of a specimen to an optical axis of a collection optics is provided. The system comprises a self-leveling tabletop; a specimen holder coupled to the tabletop and held at a fix orientation; collection optics coupled to the tabletop; a plunger coupled to the tabletop and operable to maintain the leveling orientation of the tabletop; a control valve sensing the leveling orientation of the tabletop and coupled to the plunger to control the operation of the plunger; and an aligner coupled to the tabletop and operable to change the alignment of the optical axis of the collection optics with respect to the specimen without changing the fixed orientation of the specimen holder.

Abstract: Systems and methods consistent with principles of the present invention allow contactless measurements of voltage characteristics of dynamic electrical signals in integrated circuits. The invention utilizes a signal analysis circuit, such as a voltage comparator, disposed with the circuit under test, which is optically coupled with the external timing measurement equipment. The signal analysis circuit changes its state depending on the characteristics of the measured electrical signal applied thereto. The changes in the condition of the signal analysis circuit are sensed by the external timing measurement equipment provided outside the circuit under test. To this end, the signal analysis circuit is optically coupled with the external measurement equipment registering specific changes in the condition of the signal analysis circuit.

Abstract: A system for probe-less non-invasive detection of electrical signals from integrated circuit devices is disclosed. The system includes an illumination source, collection optics, imaging optics, and a photon sensor. In a navigation mode, the light source is activated and the imaging optics is used to identify the target area on the chip and appropriately position the collection optics. Once the collection optics is appropriately positioned, the light source is deactivated and the photon sensor is used to detect photons emitted from the chip. No mention of cooling (active device measurement capability) and advanced optics to detect the features (SIL).

Abstract: A plurality of images, including a first image and a second image having a higher resolution than the first image, are aligned by generating an oversampled cross correlation image that corresponds to relative displacements of the first and second images, and, based on the oversampled cross correlation image, determining an offset value that corresponds to a misalignment of the first and second images. The first and second images are aligned to a precision greater than the resolution of the first image, based on the determined offset value. Enhanced results are achieved by performing another iteration of generating an oversampled cross correlation image and determining an offset value for the first and second images. Generating the oversampled cross correlation image may involve generating a cross correlation image that corresponds to relative displacements of the first and second images, and oversampling the cross correlation image to generate the oversampled cross correlation image.

Abstract: A system for probing a DUT is provided, the system comprising a tunable or CW laser source, a modulator for modulating the output of the laser source, a beam optics designed to point a probing beam at a designated location on the DUT, optical detector for detecting the reflected beam, and collection and signal processing electronics. The system deciphers perturbations in the reflected beam by detecting beat frequency between operation frequency of the DUT and frequency of the modulation. In an alternative embodiment, the laser is CW and the modulation is applied to the optical detector.

Abstract: Localized trenches or access holes are milled in a semiconductor substrate to define access points to structures of an integrated circuit intended for circuit editing. A conductor is deposited, such as with a focused ion beam tool, in the access holes and a localized heat is applied to the conductor for silicide formation, especially at the boundary between a semiconductor structure, such as diffusion regions, and the deposited conductor. Localized heat may be generated at the target location through precise laser application, current generation through the target location, or a combination thereof.

Abstract: A system, apparatus, and method for analyzing photon emission data to discriminate between photons emitted by transistors and photons emitted by background sources. The analysis involves spatial and/or temporal correlation of photon emissions. After correlation, the analysis may further involve obtaining a likelihood that the correlated photons were emitted by a transistor. After correlation, the analysis may also further involve assigning a weight to individual photon emissions as a function of the correlation. The weight, in some instances, reflecting a likelihood that the photons were emitted by a transistor. The analysis may further involve automatically identifying transistors in a photon emission image.

Abstract: A plurality of images, including a first image and a second image having a higher resolution than the first image, are aligned by generating an oversampled cross correlation image that corresponds to relative displacements of the first and second images, and, based on the oversampled cross correlation image, determining an offset value that corresponds to a misalignment of the first and second images. The first and second images are aligned to a precision greater than the resolution of the first image, based on the determined offset value. Enhanced results are achieved by performing another iteration of generating an oversampled cross correlation image and determining an offset value for the first and second images. Generating the oversampled cross correlation image may involve generating a cross correlation image that corresponds to relative displacements of the first and second images, and oversampling the cross correlation image to generate the oversampled cross correlation image.