Patents Assigned to Delphi Technologies, Inc.
  • Patent number: 6260330
    Abstract: A method for the folding of an airbag for motor vehicles which comprises the steps that an airbag to be folded is fixed in a housing with its closed end at an upper part of the housing and is fastened with its open end at a base element lying opposite to the upper part in such a manner that the base element seals off the interior of the airbag against the inner space of the housing; that the housing and the base element are moved relative to one another; and that the pressure within the airbag and/or the housing is varied during the relative movement. An apparatus for the folding of an airbag, in particular for carrying out the folding method in accordance with the invention.
    Type: Grant
    Filed: June 22, 1999
    Date of Patent: July 17, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Joachim Borowski, Johannes-Alexander Varcus
  • Patent number: 6260578
    Abstract: A spud assembly for a fuel tank in a vehicle includes a flange tower adapted to be at least partially disposed in a fill spout of a fuel tank. The spud assembly also includes a bead flange extending from the flange tower for engagement with a tank filler neck tube to retain the tank filler neck tube thereto. The spud assembly further includes a check valve disposed within the flange tower to allow fuel to enter the fuel tank from the tank filler neck tube and prevent fuel from exiting the fuel tank to the tank filler neck tube.
    Type: Grant
    Filed: August 12, 1999
    Date of Patent: July 17, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Bruce Albert Kuehnemund, Darrel B. Smith, Gary Francis Stack
  • Patent number: 6262489
    Abstract: A method and assembly for mounting an IC semiconductor device to a substrate using flip chip technology. The assembly generally entails a flip chip having a first surface, an oppositely-disposed second surface, an integrated circuit that includes a vertical device on the first surface, and an electrical contact for the vertical device on the second surface. The flip chip is bonded with first solder connections to a first conductor pattern on a substrate, so that the first solder connections electrically and mechanically connect the flip chip to the substrate. The assembly further includes an electrical contact member that is positioned so that the flip chip is between the contact member and the substrate. The contact member is electrically and mechanically connected to a second conductor pattern on the substrate with second solder connections. A third solder connection electrically and mechanically connects the contact member to the electrical contact on the second surface of the flip chip.
    Type: Grant
    Filed: November 8, 1999
    Date of Patent: July 17, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Mark Anthony Koors, Robert Vajagich, Charles I Delheimer, Scott David Brandenburg, Gary Eugene Oberlin
  • Patent number: 6262544
    Abstract: A method of operating a four quadrant motor involves (a) monitoring a motor voltage magnitude request signal which varies between zero and a maximum value and (b) monitoring a motor direction request input. In step (c), based upon the request signal and input monitored in steps (a) and (b), a voltage request reference signal is established. In a step (d) a current magnitude request signal is monitored and in a step (e) a first current request reference signal and a second current request reference signal are established based upon the signal monitored in step (d). In a step (f) a voltage across a current sense resistor of a bus connected for powering the motor is monitored and in a step (g) a sense resistor reference signal is established based upon the signal monitored in step (f). In a step (h) the first current request reference signal is compared with a feedback current signal and in a step (i) the second current request reference signal is also compared with the feedback current signal.
    Type: Grant
    Filed: February 28, 2000
    Date of Patent: July 17, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Robert John Disser, Bruce Allen Heaston
  • Patent number: 6260437
    Abstract: A steering wheel attachment assembly and a method of assembling the steering wheel attachment to a steering wheel shaft is presented. More particularly, a back mounting plate for attachment to a steering wheel module. The back mounting plate includes a through which extends from a first side of the back mounting plate to a center opening. Integrally formed within the back mounting plate is a hub which is disposed in the center opening. The hub includes an opening formed in the center thereof which receives one end of the steering wheel shaft. The hub further includes a side bore and trough combination permit an assembler to gain access to the steering shaft disposed within the hub opening. The steering wheel shaft is securely but removably coupled to the back mounting plate by an interface lock and a taper lock with the hub.
    Type: Grant
    Filed: April 8, 1999
    Date of Patent: July 17, 2001
    Assignee: Delphi Technologies, Inc.
    Inventor: Paul Marion Landis
  • Patent number: 6260541
    Abstract: A hydraulic lash adjuster is provided for interfacing between a piezoelectric element and a control valve in a piezoelectric actuated fuel injector. The hydraulic lash adjuster includes an inner plunger having an axial passage for storing a working fluid therein, and an outer body having a socket dimensioned to receive the inner plunger. The inner plunger is movably coupled into the socket of the outer body so as to form a working chamber between a bottom outer surface of the inner plunger and a bottom surface of the socket in the outer body. The hydraulic lash adjuster further includes a feed valve assembly disposed in the passage of the inner plunger for providing the working fluid from the passage to the working chamber, thereby minimizing the volume of the working chamber.
    Type: Grant
    Filed: April 26, 2000
    Date of Patent: July 17, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Giulio Angel Ricci-Ottati, Russell Harmon Bosch
  • Patent number: 6260675
    Abstract: A novel and improved magnetorheological fluid damper is provided which effectively secures a flux ring to a piston core in a manner which prevents relative axial and radial movement between the flux ring and the core throughout operation. The damper includes crimp portions formed on each end of the flux ring for engaging respective end plates positioned at each end of the piston core to secure the end plates and thus the flux ring to the piston core. One of the end plates may, in turn, function to maintain a piston rod in connection with the piston core. Specifically, each end plate functions as a spring device by being elastically deformed during a crimping process causing the end plates to apply a spring force against the flux ring. One of the end plates may also apply another spring force to the piston rod. A crimping method is also provided which effectively and efficiently permits crimping in a simple manner.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: July 17, 2001
    Assignee: Delphi Technologies, Inc.
    Inventor: John H. Muhlenkamp
  • Patent number: 6260678
    Abstract: A base valve assembly fore regulating the flow of fluid through a twin tube fluid vehicle damper is provided. The base valve assembly has opposing compression and rebound surfaces. Inner and outer annular seats extend from the compression surface and define an annular channel therebetween. At least one fluid passageway connects the annular channel and the rebound surface for providing fluid communication therebetween. A connector secures a blow-off valve to the cylinder end. The blow-off valve has a hollow cylindrical portion with a flange extending transversely from an end thereof. The flange is adjacent the annular seats when the blow-off valve is in a closed position. The blow-off valve is movable from the closed position to an open position away from the compression surface. A helical spring is interposed between the connector and the blow-off valve for biasing the blow-off valve to the closed position.
    Type: Grant
    Filed: August 31, 1999
    Date of Patent: July 17, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Jamshid Kargar Moradmand, Robert Alan Neal, William R. Nunke
  • Patent number: 6257062
    Abstract: An angular accelerometer having a substrate, a plurality of fixed electrodes supported on the substrate and each including fixed capacitive plates, and a rotational inertia mass including a plurality of movable capacitive plates arranged to provide a capacitive coupling with the fixed capacitive plates. The rotational inertia mass is rotationally movable relative to the fixed electrodes in response to angular acceleration. The angular accelerometer further includes support members for supporting the rotational inertia mass and biasing the rotational inertia mass relative to the fixed electrodes during rotational movement of the rotational inertia mass.
    Type: Grant
    Filed: October 1, 1999
    Date of Patent: July 10, 2001
    Assignee: Delphi Technologies, Inc.
    Inventor: David Boyd Rich
  • Patent number: 6259608
    Abstract: A method for controlling the height, shape and placement of solder connections of a surface mount circuit device, such as a flip chip, by way of controlling the extent to which solder is able to flow on a conductor during reflow, but without the conventional use of a solder mask in a manner that results in a portion of the mask remaining beneath the device. Each conductor is defined to include a bond pad and a reduced-width portion adjacent the bond pad. The width of each reduced-width portion is sufficiently narrower than the width of its adjacent bond pad to impede the flow of molten solder onto the reduced-width portion from a solder bump registered with the bond pad. As a result, when reflow soldering a circuit device to the circuit board, molten solder substantially remains on the bond pads and, for a given solder bump size, the bond pads determine the shape and height of the resulting solder connections.
    Type: Grant
    Filed: April 5, 1999
    Date of Patent: July 10, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Carl Frederick Berardinelli, Thomas M. Otto, Galen J. Reeder
  • Patent number: 6256557
    Abstract: A serial data communication system and protocol for communicating data on a serial data bus in a vehicle. The serial data communication system includes a serial data bus connected to a plurality of electronic devices in a vehicle. Each of the electronic devices includes an encoder for encoding bits of information and a decoder for receiving data and decoding the received serial data. The present invention provides for a communication protocol for communicating data on the serial data bus including the steps of providing serial data to be transmitted onto the serial data bus in the vehicle. The serial data is encoded with a pulse width varying as a function of a time, and the time-based variable pulse width is assigned to groupings of at least two data bits to code each of the data bit groupings. A series of coded data bit groupings are transmitted onto the serial data bus in the vehicle, and the electronic devices may receive and decode the encoded data signals to decipher the data.
    Type: Grant
    Filed: November 25, 1998
    Date of Patent: July 3, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Andres Eduardo Avila, Victor Mendez, Kevin Joseph Hawes
  • Patent number: 6256215
    Abstract: An improved low-cost gate drive circuit drives the bridge transistors of a multiple power supply bridge circuit with a single logic level voltage. In general, the single logic level voltage is referenced to a first power supply and provides gate drive voltages for bridge transistors associated with a second power supply. The logic level voltage is bootstrapped to a first by-pass capacitor to provide a first gate drive voltage for a high-side transistor associated with the first power supply, and the charge on the first by-pass capacitor is consecutively bootstrapped to second and third by-pass capacitors to provide second and third gate drive voltages for bridge transistors associated with the second power supply.
    Type: Grant
    Filed: August 10, 2000
    Date of Patent: July 3, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Alfred H. Barrett, Joel F. Downey, Richard F. Rouser
  • Patent number: 6254979
    Abstract: A low friction, low contact resistance coating for electrical terminal members, especially members made of copper base alloys and low carbon steel alloys and plastics, is formed of a coarse electroplate of tin or silver characterized by grains having an average dimension in the range of about 0.5 to 10 micrometers where such grains carry very small particles of polytetrafluoroethylene or the like having average diameters in the range up to about 0.30 micrometers.
    Type: Grant
    Filed: June 3, 1998
    Date of Patent: July 3, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: George Albert Drew, Mark S. Ricketts, Bryan A. Gillispie, Yang-Tse Cheng, Robert A. Suchanek
  • Patent number: 6253017
    Abstract: The fiber optic connector with an optical attenuator includes a first end assembly, a second end assembly and an alignment sleeve. The first end assembly includes a bushing with a central bore and an optical fiber passing through the central bore. The second end assembly includes a bushing with a central bore and an optical fiber passing through the central bore. The alignment sleeve receives the first and second end assemblies and holds the two optical fibers in axial alignment. The alignment sleeve also holds a thin plastic or glass optical attenuator disc with a selected optical density between the two end assemblies. When the connector is held in a connector housing assembly, the axially aligned optical fibers have their ends in contact with opposite sides of the optical attenuator disc. A spring bias the optical fiber ends toward the optical attenuator disc. An optical attenuator disc with a different optical density can replace the disc in the alignment sleeve to change attenuation.
    Type: Grant
    Filed: August 4, 1999
    Date of Patent: June 26, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: James Thomas Hartley, Stephen Wesley Wall
  • Patent number: 6251501
    Abstract: A solder bumping method and structure for producing fine-pitch solder bump and which eliminate conventional process compatibility requirements for under bump metallurgy (UBM) and solder bump formation. The method generally entails forming an input/output pad on the surface of a semiconductor device, and then forming a metal layer on the input/output pad that will serve as the UBM of the solder bump. A plating seed layer is then formed on the UBM and on the surrounding surface of the device, after which a mask is formed on the plating seed layer and a via is formed in the mask to expose a portion of the plating seed layer overlying the UBM, and preferably portions of the plating seed layer not overlying the UBM. A solder material is then deposited on the portion of the plating seed layer exposed within the via.
    Type: Grant
    Filed: March 29, 1999
    Date of Patent: June 26, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: William David Higdon, Shing Yeh
  • Patent number: 6250537
    Abstract: A self-cleaning soldering thimble assembly includes a thimble and a scraper disposed therein. The scraper is supported by two support rods that extend through the bottom of the thimble. The thimble slides along the support rods. When the thimble is dipped into a solder pot to refill the thimble with solder, the support rods abut the bottom of the solder pot, and the thimble continues to slide down the support rods causing the scraper to scrape away dross on the thimble.
    Type: Grant
    Filed: March 6, 2000
    Date of Patent: June 26, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Miguel I. Avila, Oscar Vazquez
  • Patent number: 6247465
    Abstract: A system is provided for preventing spark-on-make in an internal combustion engine, using manifold pressure information. The system includes a pressure sensor and a controller. The pressure sensor is adapted to detect pressure in an intake manifold and provide an output signal indicative of that pressure. The controller is at least indirectly connected to the pressure sensor and is adapted to delay initiation of ignition dwell in a coil by a period of time sufficient to avoid spark-on-make, in response to the output signal from the sensor. Preferably, the pressure sensor is a manifold absolute pressure (MAP) sensor. The controller preferably is implemented by suitably programming or otherwise configuring an electronic engine control unit (ECU). Also provided is a method for preventing spark-on-make in an internal combustion engine.
    Type: Grant
    Filed: February 11, 2000
    Date of Patent: June 19, 2001
    Assignee: Delphi Technologies, Inc.
    Inventor: Douglas Lynn Sprunger
  • Patent number: 6247973
    Abstract: A power distribution system for a motor vehicle having a left tail light assembly, a license plate light assembly and a right tail light assembly includes a power distribution block that has a plurality of bus strips embedded in the distribution block with each of the bus strips having at least one tab terminal that projects into an integral input connector socket and at least one tab terminal that projects into at least one of first, second and third output connector sockets. A spliceless chassis wiring harness is plugged into the input connector socket for energizing lights in the left tail light assembly, the license plate light assembly and the right tail light assembly via three spliceless output wiring harnesses operatively associated with the respective output connector sockets and the light assemblies. The power distribution system may also include optional right and left side marker light assemblies that are operatively associated with the second output connector socket.
    Type: Grant
    Filed: August 24, 1999
    Date of Patent: June 19, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Charanjit S. Chawa, Joseph A. Bertucci
  • Patent number: 6247943
    Abstract: An electrical connection between a high voltage terminal and a spark plug head. A case contains a high voltage terminal connected to a high voltage source. A connector portion extends from a bottom portion of the case, which in turn is secured to an insulator boot for attachment to the spark plug. The high voltage terminal has a nipple extending within the connector portion. A barrel shaped coil spring is snapped over the nipple and positively retained thereto. The head of the spark plug is inserted within the connector portion and engages the barrel shaped coil spring. The barrel shape of the coil spring offers a smaller height with an increased working length thereby providing a larger tolerance between the high voltage terminal and the spark plug head.
    Type: Grant
    Filed: August 31, 1999
    Date of Patent: June 19, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Viorel Moga, Mark Albert Paul, Brian DeWayne Lively
  • Patent number: 6248052
    Abstract: The invention relates to a method for the folding of an inflatable airbag for motor vehicles which comprises the steps that an airbag to be folded is fastened with its open end at a carrier; that a preferably substantially cylindrical piston is pushed forward into the airbag through an opening in the carrier and against the closed end of the airbag; and that the carrier and the piston are introduced into a sleeve, with the airbag being pressed together irregularly. The invention also relates to a folding apparatus for carrying out this folding method.
    Type: Grant
    Filed: July 14, 1999
    Date of Patent: June 19, 2001
    Assignee: Delphi Technologies, Inc.
    Inventors: Peter Kleeberger, Christian Strasser, William Thomas Shaw