Abstract: A magnetic assembly includes a magnetic core and a winding. The magnetic core comprises an upper cover, a lower cover and at least one core column provided between the upper cover and the lower cover, the core column presents a prismatic shape and has at least two lateral surfaces, the lateral surfaces intersect with each other to form at least two longitudinal ridges, and the longitudinal ridge extends along the longitudinal direction of the core column. The winding, winding around the core column, a first semi-conductive component is provided between the core column and the winding at the position corresponding to the longitudinal ridge.

Abstract: The power distribution device includes a power regulating device and a first auxiliary power distribution component. The power regulating device has a first output end connected to an AC power grid and a second output end. The first auxiliary power distribution component has a first movable end electrically connected to a load, a first fixed end electrically connected to the AC power grid and a second fixed end electrically connected to the second output end, and a ground line of the second fixed end is grounded. When the AC power grid is normal, the first movable end is connected to the first fixed end, such that the AC power grid supplies power to the load. And when the AC power grid is abnormal, the first movable end is connected to the second fixed end, such that the power regulating device supplies power to the load through the second output end.

Abstract: An insulated housing, in a cylindrical structure, includes an inner metal layer, an insulating layer and an outer metal coating. The insulating layer is positioned between the inner metal layer and the outer metal coating. In any end of the cylindrical structure, both a distance from the end of the inner metal layer to the end of the cylindrical structure and a distance from the end of the outer metal coating to the end of the cylindrical structure are not equal to zero, and the distance from the end of the inner metal layer to the end of the cylindrical structure is larger than the distance from an end of the outer metal coating to the end of the cylindrical structure. The inner metal layer is composed of one first metal cylinder and two second metal cylinders respectively disposed on the both ends of the first metal cylinder.

Abstract: A hybrid drive circuit (100, 100?) drives a first characteristic transistor and a second characteristic transistor coupled in parallel to the first characteristic transistor according to an input signal (Sin). The hybrid drive circuit (100, 100?) includes a first turn-on path (Pc1), a first turn-off path (Ps1), a second turn-on path (Pc2), and a second turn-off path (Ps2). The first turn-on path (Pc1) and the second turn-on path (Pc2) produce a first delay time to delay turning on the first characteristic transistor. The first turn-off path (Ps1) and the second turn-off path (Ps2) produce a second delay time to delay turning off the second characteristic transistor.

Abstract: The present disclosure provides an alternatingly-switched parallel circuit, an integrated power module and an integrated power package. The alternatingly-switched parallel circuit includes a first bridge arm and a second bridge arm at least partly formed in a chip containing a plurality of first cell groups and a plurality of second cell groups. The plurality of first cell groups are configured to form the first upper bridge-arm switch and the plurality of second cell groups are configured to form the second upper bridge-arm switch, or the plurality of first cell groups are configured to form the first lower bridge-arm switch and the plurality of second cell groups are configured to form the second lower bridge-arm switch. The plurality of first cell groups and the plurality of second cell groups are switched on and off alternatingly.

Abstract: A frame structure includes a frame body and at least one vibration absorbing structure. The vibration absorbing structure has a support column and at least one cantilever. The cantilever has a cantilever body, a first end portion and a second end portion. One end of the support column is connected to a wall surface of the frame body. The first end portion of the cantilever is connected to the support column. The cantilever body and the second end portion extend outwardly and swing freely on the wall surface of the frame body. When the cantilever body and the second end portion are swinging, they are not in contact with any peripheral member and the frame structure.

Abstract: An inverting apparatus comprises: a DC port; an AC port; five switches; a first capacitor coupled between the first terminal of the second switch and the second terminal of the fourth switch; and a free-wheeling element coupled between the second terminal of the third switch and the second terminal of the fifth switch; wherein the five switches are controlled so that the device can switch among a plurality of operating modes and transmit active or reactive power to a power grid.

Abstract: A fan includes a fan frame, an impeller, and at least a supporting member. The fan frame includes a bottom plate and a cover plate spaced from the bottom plate. The bottom plate and the cover plate together define a first accommodating space. The cover plate has an air inlet disposed in an axial direction. A side of the fan frame is provided with at least an air outlet. The impeller is disposed in the first accommodating space and includes a hub and a plurality of blades. A cross-sectional area of the hub increases gradually along a direction from the cover plate to the bottom plate. The blades are disposed around the periphery of the hub. The supporting member is disposed between the bottom plate and the cover plate for supporting the cover plate.

Abstract: An isolated resonant converter is provided, including a first side circuit, a second side circuit, and a resonant tank circuit. The resonant tank circuit includes a first resonant capacitor, a second resonant capacitor, and an integrated magnetic element. The integrated magnetic element includes a first side winding, a second side winding and a spaced groove provided between the first side winding and the second side winding. And the spaced groove stores leakage inductance energy, thereby forming at least part of resonant inductance required. Therefore, a number and volume of magnetic elements in the resonant converter are reduced.

Abstract: A test device and a method are provided in the invention. The test device includes a first connection interface, a storage device, a processor and a second connection interface. The first connection interface is coupled to a device under test (DUT) and obtains power information from the DUT according to a first instruction. The storage device stores the power information. The processor is coupled to the first connection interface and storage device, when the first connection interface is coupled to the DUT, sends the first instruction to the first connection interface, receives the power information from the first connection interface, and stores the power information in the storage device. The second connection interface is coupled to an external controlling system, sends the power information to the external controlling system and receives a test instruction from the external controlling system to test the DUT.

Abstract: The present disclosure provides a semiconductor chip power supply system, including: a semiconductor chip including: a first data processing function area and a first power converter control area formed on a first semiconductor substrate of the semiconductor chip; and a first power converter power stage located outside the first semiconductor substrate and electrically connected to the first power converter control area and the first data processing function area; wherein the first power converter control area controls the first power converter power stage to supply power to the first data processing function area, and the first power converter control area adjusts the output voltage of the first power converter power stage according to information corresponding to a working status of the first data processing function area.

Abstract: A power chip includes: a first power switch, formed in a wafer region and having a first and a second metal electrodes; a second power switch, formed in the wafer region and having a third and a fourth metal electrodes, wherein the first and second power switches respectively constitute an upper bridge arm and a lower bridge arm of a bridge circuit, and the first and second power switches are alternately arranged; and a metal region, at least including a first metal layer and a second metal layer that are stacked, each metal layer including a first to a third electrodes, and electrodes with the same voltage potential in the metal layers are electrically coupled.

Abstract: The present disclosure provides a power module and a method for manufacturing the power module. The power module includes a chip, a passive element and connection pins. The connection pins are provided on a pin-out surface of the power module, and are electrically connected to at least one of a chip terminal of the chip and the passive element; a projection of the chip on the pin-out surface of the power module does not overlap with a projection of the passive element on the pin-out surface of the power module, and an angle between the terminal-out surface of the chip and the pin-out surface of the power module is greater than 45° and less than 135°.

Abstract: A magnet module is disclosed. The magnet module includes a sintered magnet structure, a magnetic permeable casing and a fixing member. The sintered magnet structure is disposed in the magnetic permeable casing. The fixing member has a plurality of locking units, and the sintered magnet structure and the magnetic permeable casing are fixed by the locking units of the fixing member.

Abstract: Disclosed is a power supply system, including: a high-voltage input power distribution cabinet, a high-low voltage conversion cabinet, and a low-voltage output and control cabinet, the high-low voltage conversion cabinet is provided with at least one high-voltage chamber provided with a high-voltage bus bar, at least one low-voltage chamber provided with a low-voltage bus bar, an insulating partition between the high-voltage chamber and the low-voltage chamber and a plurality of power supply modules; each of the power supply modules bridges the high-voltage and low-voltage chambers and includes a high-voltage cavity, a low-voltage cavity and an isolation unit, connecting terminals of the high-voltage and low-voltage cavities are respectively disposed corresponding to the high-voltage and low-voltage chambers and electrically connected to the high-voltage and low-voltage bus bars respectively, and the isolation unit is connected to one end of the high-voltage cavity and one end of the low-voltage cavity.

Abstract: A waveform conversion circuit for converting a control signal of a control node ranging from a high voltage level to a low voltage level of a reference node into a driving signal of a first node is provided. The waveform conversion circuit includes a first resistor, a unidirectional conducting device, and a voltage clamp unit. The first resistor is coupled between the control node and the first node. The unidirectional conducting device unidirectionally discharges the first node to the control node. The voltage clamp unit is coupled between the first node and the reference node and is configured to clamp a driving signal.

Abstract: The present disclosure provides a wireless power transmitting module and an installation method thereof, wherein the wireless power transmitting module comprises: an insulating bracket, a first side of which has a first central space; a coil, disposed around the first central space; and a circuit component, at least a part of which is located in the first central space, electrically connected to the coil. The present disclosure makes full use of the central blank space of the coil, and places the circuit component at the center of the coil, thereby realizing a miniaturized structure, improving space utilization and greatly reducing volume.

Abstract: A modular power supply system, includes: a main controller, configured to output a main control signal; N local controllers, wherein each of the local controllers is configured to receive the main control signal to output at least one local control signal; and N power units, in one-to-one correspondence with the N local controllers, wherein each of the power units includes a first end and a second end, the second end of each of the power units is connected to the first end of an adjacent one of the power units, each of the power units includes M power converters, and each of the power converters is configured to operate according to the local control signal output by a corresponding local controller, wherein each of the power units further includes: M sampling circuits, configured to sample positive DC bus voltages and negative DC bus voltages of the M power converters respectively.

Abstract: The disclosure provides a system of providing power to a chip on a mainboard, including: a first power supply, located on the mainboard, and configured to receive a first voltage and to provide a second voltage; and a second power supply and a third power supply, located on the mainboard, wherein the second power supply and the third power supply are electrically connected to the first power supply; so as to receive the second voltage, the second power supply is disposed at a first side of the chip, the third power supply is disposed at a second side of the chip, the second power supply provides a third voltage to the chip, and the third power supply provides a fourth voltage to the chip.