Abstract: The present disclosure provides a power supply module used in a smart terminal and a power supply module assembly structure, the power supply module includes a substrate having first and second surfaces opposite to each other; a power passive element, an active element and a plurality of first conductive parts disposed at the substrate; the power passive element being independently disposed on the first surface of the substrate as a whole; wherein a maximum height of the power passive element disposed on the first surface of the substrate is greater than a sum of a maximum height of an element disposed on the second surface of the substrate and an half of the thickness of the substrate.

Abstract: The present disclosure mainly provides a clamping circuit, coupled to a first end and a second end of a switching transistor through a first node and a second node, comprising: an RCD circuit, comprising a first resistor and a first capacitor connected in parallel between the second node and a third node, and a diode having a negative electrode coupled to the third node; and a first stabilivolt diode, having a negative electrode coupled to the first node and a positive electrode coupled to a positive electrode of the diode at a fourth node.

Abstract: A bidirectional power factor correction (PFC) module is coupled to an AC power source, an energy storage unit, and a DC bus. The bidirectional PFC module includes a bridge arm assembly and a control unit. The bridge arm assembly includes a first bridge arm, a first inductor, a second inductor, and a second bridge arm. The control unit provides a plurality of control signals to control the first bridge arm and the second bridge arm to make the bidirectional PFC module operate in an AC power supply mode, a DC power supply mode, or a power feed mode.

Abstract: A power chip, includes a metal region; a wafer region. The wafer region includes at least one first partition, forming a first power switch; and at least one second partition, forming a second power switch. The first power switch and the second power switch are electrically connected, a total number of the at least one first partition and the at least one second partition is not less than 3, and the at least one first partition and the at least one second partition are disposed alternatively along a curve.

Abstract: The present disclosure relates to a switching power supply, an over-temperature control and protection method, and a power control method. The switching power supply includes: a converter module including at least one main power switch; a direction detection module configured to obtain installation direction information of the switching power supply; and a process module configured to perform a preset operation in accordance with the installation direction information of the switching power supply. The present disclosure may realize power control of the switching power supply and meet over-temperature protection requirements under various installation directions.

Abstract: The present disclosure provides a high-voltage transformer and an electronic power apparatus. The high-voltage transformer includes a magnetic core, a secondary coil unit, and a primary coil unit. The secondary coil unit includes a secondary winding; and the primary coil unit includes a primary winding and an insulating portion. The insulating portion forms at least one through hole. At least one primary winding encircle at least one through hole and is wrapped by the insulating portion and fixed in the insulating portion. The magnetic core passes through at least one through hole. A shielding layer is formed on a surface of the insulating portion, and the shielding layer is used for connecting a safety ground.

Abstract: Disclosed is a power supply system, including: a high-voltage input power distribution cabinet, a high-low voltage conversion cabinet, and a low-voltage output and control cabinet, the high-low voltage conversion cabinet is provided with at least one high-voltage chamber provided with a high-voltage bus bar, at least one low-voltage chamber provided with a low-voltage bus bar, an insulating partition between the high-voltage chamber and the low-voltage chamber and a plurality of power supply modules; each of the power supply modules bridges the high-voltage and low-voltage chambers and includes a high-voltage cavity, a low-voltage cavity and an isolation unit, the high-voltage and low-voltage cavities are respectively disposed corresponding to the high-voltage and low-voltage chambers and electrically connected to the high-voltage and low-voltage bus bars respectively, and the isolation unit is connected to one end of the high-voltage cavity and one end of the low-voltage cavity.

Abstract: The present disclosure relates to a power module and a manufacturing method thereof. The power module includes: a group of switch elements, a molding part and a connector. The group of switch elements includes at least one pair of switch elements. The molding part molds the group of switch elements. The connector includes a signal terminal and a power terminal respectively electrically connected to the signal end and power end of the group of switch elements, and both fanned out from the molding part. The power terminal includes a positive power terminal, a negative power terminal and an output power terminal. The positive power terminal and the negative power terminal are respectively a first metal layer and a second metal layer which are at least partially stacked, and an insulating layer is disposed between the first metal layer and the second metal layer.

Abstract: An N-phase power converter has N phases with outputs connected in parallel and outputs connected in parallel. The converter comprises: N switch units, wherein each phase of the N-phase power converter comprises one of the N switch units; and an integrated inductor unit, comprising M inductor subunits, wherein M is a natural number greater than or equal to 2, each inductor subunit comprises i inductors, i is a natural number greater than or equal to 2, N>M×i or N=M×i, M×i of the inductors in the integrated inductor unit are respectively coupled to M×i of the N switch units, wherein: the i inductors of each of the inductor subunit are inverse-coupled to each other, the coupling coefficient between the M inductor subunits is less than the coupling coefficient between the i inductors in each of the inductor subunits.

Abstract: A power chip includes: a first power switch, formed in a wafer region and having a first and a second metal electrodes; a second power switch, formed in the wafer region and having a third and a fourth metal electrodes, wherein the first and second power switches respectively constitute an upper bridge arm and a lower bridge arm of a bridge circuit, and the first and second power switches are alternately arranged along a first direction; and a metal region, at least including a first metal layer, a second metal layer and a third metal layer that are stacked, each metal layer including a first to a third strip electrodes, and strip electrodes with the same voltage potential in two adjacent metal layers are electrically coupled, wherein a routing direction of the strip electrode in the first metal layer is substantially perpendicular to the first direction.

Abstract: The present disclosure provides a semiconductor chip power supply system, including: a semiconductor chip including: a first data processing function area and a first power converter control area, the first data processing function area and the first power converter control area being formed on a first semiconductor substrate of the semiconductor chip; and a first power converter power stage located outside the first semiconductor substrate and electrically connected to the first power converter control area and the first data processing function area; wherein the first power converter control area controls the first power converter power stage to supply power to the first data processing function area.

Abstract: The present disclosure provides an assembly structure for providing power for a chip and an electronic device using the same. The assembly structure includes: a circuit board, configured to provide a first electrical energy; a chip; a power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the chip, the circuit board and the power converting module are stacked; and a connection component, configured to electrically connect the circuit board and the power converting module. The present disclosure assembles a power converting module with a circuit board and a chip in a stacking manner, which may shorten a current path between the power converting module and the chip, reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource.

Abstract: A package structure is provided. The package structure includes a substrate, a plurality of active components, a plurality of separated metal parts and an encapsulation material. The substrate has a first surface and a second surface. Each active component has a first surface and a second surface. Each metal part has a first surface and a second surface. The first surface of each active component is connected to the first surface of the substrate. The first surface of one metal part is connected to the second surface of one active component. Each metal part extends to connect to the first surface of the substrate. The encapsulation material covers the first surface of the substrate and surrounds the active components and the metal parts. The second surface of each metal part and the second surface of the substrate are exposed from the encapsulation material.

Abstract: The present disclosure provides a power supply module used in a smart terminal and a power supply module assembly structure, the power supply module includes a substrate having first and second surfaces opposite to each other; a power passive element, an active element and a plurality of first conductive parts disposed at the substrate; the power passive element being independently disposed on the first surface of the substrate as a whole; wherein a maximum height of the power passive element disposed on the first surface of the substrate is greater than a sum of a maximum height of an element disposed on the second surface of the substrate and an half of the thickness of the substrate.

Abstract: A magnetic dev ice includes a core structure, at least one inductor winding and at least two transformer windings. The core structure includes at least one inductor column and at least two transformer columns. The at least one inductor winding respectively winds around the at least one inductor column. The at least two transformer windings, wind around the at least two transformer columns respectively, and the transformer winding includes primary winding and secondary winding. Wherein the magnetic flax directions on adjacent transformer columns are opposite to each other when providing a current in the corresponding primary windings simultaneously.

Abstract: The disclosure provides a system of providing power to a chip on a mainboard, including: a preceding-stage power supply, located on a mainboard, and configured to receive a first DC voltage and to provide a second DC voltage, wherein the first DC voltage is greater than the second DC voltage; and a first post-stage power supply and a second post-stage power supply, located on the mainboard, to receive the second DC voltage, the first post-stage power supply is disposed at a first side of the chip, the second post-stage power supply is disposed at a second side of the chip, the first post-stage power supply provides a third DC voltage to the chip, the second DC voltage is greater than the third DC voltage, the second post-stage power supply provides a fourth DC voltage to the chip, and the second DC voltage is greater than the fourth DC voltage.

Abstract: A power module and a power device having the power module are disclosed. The power device includes a main board. The power module is inserted in the main board and includes a PCB, a magnetic element, a primary winding circuit and at least one secondary winding circuit. The magnetic element is provided on the PCB and includes a core structure, a primary winding and at least one secondary winding. The core structure has a first side and a second side opposite to each other, and a third side and a fourth side opposite to each other. The primary winding circuit is provided on the PCB and positioned in the vicinity of the first or second side of the core structure. The secondary winding circuit is provided on the PCB and positioned in the vicinity of the third or fourth side of the core structure.

Abstract: A dimmer control circuit for controlling a phase cut dimmer includes: a rectifier circuitry, configured to rectify the output voltage of the phase cut dimmer to output a rectified voltage; an input voltage detecting circuitry, configured to output a detected voltage according to the rectified voltage; a processor, configured to output a control signal when the detected voltage meets a preset condition; and a constant current circuitry, configured to output or stop outputting a preset current to the rectifier circuitry in response to the control signal; wherein the preset current has a value greater than a holding current of the phase cut dimmer.

Abstract: A system of providing power including: a preceding-stage power supply module, a post-stage power supply module and a load, connected in sequence; a projection on the mainboard of a smallest envelope area formed by contour lines of the preceding-stage power supply module and the load at least partially overlaps with a projection of the post-stage power supply module; the preceding-stage power supply module includes a plurality of sets of preceding-stage output pins and preceding-stage ground pins alternately arranged to form a first rectangular envelope area, and the load is disposed on a side of a long side of the first rectangular envelope area; and the load comprises a load input pin and a load ground pin forming a second rectangular envelope area, and a center line of the first rectangular envelope area and the second rectangular envelope area is perpendicular to the long side of the first rectangular envelope area.