Abstract: A device chip for mounting on a board is provided. The device chip includes a top surface, an undersurface located on an opposite side from the top surface and having a larger area than the top surface, a slope inclined with respect to the top surface and the undersurface and exposed to the top surface side, a circuit portion on the top surface side, the circuit portion including an electronic circuit, and a wiring portion on which wiring electrically connecting the circuit portion and the board to each other is to be formed, the wiring portion including the slope in a part of the wiring portion.
Abstract: Apparatus for forming a protective member on a wafer includes a stage for mounting a sheet, the stage having a frame and a chuck table supported to and surrounded by the frame, the frame having a plurality of air supply holes opening to the upper surface of the frame. A holding unit is adapted to be moved to a position opposed to the stage for holding the wafer, and a resin supply unit supplies a liquid resin to the upper surface of the sheet placed on the stage. The liquid resin is formed into the protective member. A sheet pressing pad vertically movably supported so as to be opposed to the sheet is placed on the stage. The sheet pressing pad comes into contact with a part of the sheet placed on the stage in an area inside the air supply holes, thereby pressing the sheet.
Abstract: A cutting apparatus includes a blade changing unit demounting an old cutting blade from a blade mount and mounting a new cutting blade to the blade mount. The blade changing unit includes a blade holder for holding a support base of each cutting blade and a moving portion for moving the blade holder in the axial direction of a boss portion of the blade mount in the condition where each cutting blade is held by the blade holder, thereby mounting the new cutting blade to the boss portion or demounting the old cutting blade from the boss portion. The cutting apparatus further includes a control unit controlling the blade changing unit. The control unit measures a signal indicating a force applied to the moving portion in mounting or demounting, and determines the condition of the blade changing unit and blade mount according to the signal measured by the measuring portion.
Abstract: An automated workpiece conveying vehicle included in a conveyance system that conveys a workpiece to each of a plurality of processing apparatuses is provided. The automated workpiece conveying vehicle includes: a workpiece support part that supports the workpiece; a traveling mechanism provided on the workpiece support part; a vibration detection unit that detects vibration of the workpiece support part and records the vibration as vibration data; and a receiver that receives a control signal transmitted from a control unit included in the conveyance system, the control signal instructing conveyance of the workpiece to the processing apparatus.
Abstract: A laser beam applying unit of a laser processing apparatus includes a laser oscillator adapted to emit a laser beam, a condenser adapted to focus the laser beam emitted from the laser oscillator and to thereby apply the laser beam to the workpiece held by a holding unit, and a liquid layer former disposed at a lower end portion of the condenser and adapted to form a layer of a liquid on an upper surface of the workpiece. The liquid layer former includes a casing having a bottom wall that forms a gap between itself and the upper surface of the workpiece, a liquid supply section adapted to supply the liquid to the casing, and a transparent section that is formed at the bottom wall adjacently to the jet port and that permits transmission of the laser beam therethrough.
Abstract: A cutting blade mounting mechanism for mounting a cutting blade to a tip portion of a spindle includes: a blade mount mounted to the tip portion of the spindle; and an air supply unit supplying air to the blade mount. The blade mount includes: a columnar boss section inserted into a through-hole provided in an annular base of the cutting blade; a flange section projecting in a radial direction from a side of a base end of the boss section and having a support surface supporting the cutting blade; and an ejector type blade suction section having a first air passage connecting a supply port supplied with air from the air supply unit and a discharge port discharging air, and a second air passage connecting a suction port opening to a side of the support surface of the flange section and the first air passage.
Abstract: A wafer holding apparatus for holding a wafer having undulation. The wafer holding apparatus includes a holding portion having a holding surface for holding the wafer, the holding portion being composed of a plurality of piezoelectric elements having suction holes selectively connected to a vacuum source, the piezoelectric elements having front end surfaces collected to form the holding surface. The wafer holding apparatus further includes a frame member supporting the holding portion and a control unit controlling a voltage to be applied to each of the piezoelectric elements according to the undulation of the wafer, whereby the wafer is held on the holding surface in the condition where the undulation of the wafer is followed by undulation produced on the holding surface due to a change in a length of each of the piezoelectric elements.
Abstract: Disclosed herein is a water jet processing apparatus including a chuck table that holds a workpiece by a holding surface, a high-pressure water injection unit having a high-pressure water nozzle that injects high-pressure water along planned dividing lines of the workpiece to remove burrs, a processing feed unit that carries out processing feed of the chuck table in an X-direction, and an indexing feed unit that carries out indexing feed of the high-pressure water nozzle in a Y-direction. The water jet processing apparatus also includes a movement unit that moves the high-pressure water nozzle in a Z-direction, an alignment unit that images the workpiece, a cassette placement region in which a cassette that houses plural workpieces is placed, and a conveying unit that conveys the workpiece between the cassette and the chuck table.
Abstract: A conveyance system for conveying a workpiece to each of a plurality of processing apparatuses includes a conveyance passage, an automated conveying vehicle for travelling on the conveyance passage, the automated conveying vehicle including a workpiece storage member, travelling mechanisms, and a receiver, a stock unit including a storage member holding base and a receiver, and a storage member conveying unit for conveying the workpiece storage member between a region of the conveyance passage above the stock unit and the storage member holding base or between a region of the conveyance passage above the processing apparatus and the inside of the processing apparatus.
Abstract: A conveyance system for conveying a workpiece to each of a plurality of processing apparatuses includes a conveyance passage disposed in a space directly above one processing apparatus of the plurality of processing apparatuses, an automated conveying vehicle for traveling on the conveyance passage, the automated conveying vehicle including a workpiece storage member having a housing space for housing a workpiece therein, a traveling member having a storage space for storing the workpiece storage member therein, a traveling mechanism mounted on the traveling member, a lifting and lowering mechanism disposed in the traveling member for lifting and lowering the workpiece storage member while suspending the workpiece storage member from above, and a receiver for receiving control signals.
Abstract: Disclosed herein is a processing apparatus including a wafer testing unit for testing whether or not a wafer carried from a cassette mount unit is a wafer corresponding to a processing condition. The wafer testing unit measures characteristics of the carried wafer by a measuring section, and a determining section of a control unit compares actual measurements of the wafer characteristics measured by the measuring section with setpoints of wafer characteristics corresponding to the processing condition, to thereby determine conformability of the carried wafer. When it is determined by the determining section that the carried wafer is a wafer corresponding to the processing condition, the wafer is carried to a processing unit and processed. When it is determined by the determining section that the carried wafer is not a wafer corresponding to the processing condition, an error is notified by a notifying section.
Abstract: A grinding apparatus includes: a holding table for holding a workpiece thereon; a grinding unit including a grinding wheel for grinding the workpiece held on the holding table, the grinding wheel including a grinding stone made of abrasive grains and grains of photocatalyst bonded by a vitrified bonding material; a grinding water supply unit configured to supply grinding water to the grinding stone when the workpiece held on the holding table is ground by the grinding unit; and a light applying unit disposed adjacent to the holding table and configured to apply light to a grinding surface of the grinding stone while the workpiece held on the holding table being ground.
Abstract: A thickness measuring apparatus including a thickness measuring unit for measuring the thickness of a plate-shaped workpiece. The thickness measuring unit includes a white light source for emitting white light, a dispersing mechanism for producing time differences corresponding to wavelengths of light components of the white light to thereby generate spectral light, a two-dimensional image sensor having a photodetecting area for detecting the return light, the photodetecting area including a plurality of pixels, a storing section for storing the intensity of the return light detected by the plural pixels according to wavelength with time difference, a waveform table previously storing a plurality of kinds of sample spectral interference waveforms respectively corresponding to different thicknesses of the workpiece, and a thickness deciding section for deciding the thickness at an X-Y coordinate position in a two-dimensional area of the workpiece.
Abstract: A method of processing a wafer includes a grinding step of grinding a reverse side of a wafer that has first insulating films covering via electrodes, an electrode protruding step of protruding the via electrodes covered with the first insulating films from the reverse side by supplying a first etching gas turned to a plasma, an insulating film forming step of covering the reverse side with a second insulating film, a via electrode exposing step of supplying a second etching gas turned to a plasma to expose the via electrodes after having formed a resist film having openings overlapping the via electrodes, and an electrode forming step of forming electrodes connected to the via electrodes.
Abstract: A laser processing apparatus includes a branching unit configured to branch a laser beam to a first optical path and a second optical path, a condenser configured to condense the branched laser beams on a processing face of a workpiece, an output power measuring unit configured to measure the output power of the laser beam emitted from a laser beam generation unit and having passed through the condenser, and a blocking member positioning mechanism disposed between the condenser and the output power measuring unit and capable of positioning a blocking member between a first laser beam blocking position at which the blocking member blocks only the laser beam of the first optical path from between the branched laser beams and a retracted position at which the blocking member blocks none of the laser beams.
Abstract: A method of processing a wafer includes a grinding step of grinding a wafer that has first insulating films covering via electrodes, from a reverse side thereof, an electrode protruding step of protruding the via electrodes covered with the first insulating films from the reverse side by way of etching, a distorted layer forming step of forming a distorted layer on the reverse side of the wafer, an insulating film forming step of forming a second insulating film on the reverse side of the wafer, and an electrode forming step of removing the first insulating films and the second insulating film from the regions where they overlap the via electrodes, and forming reverse-side electrodes connected to the via electrodes.
December 2, 2019
Date of Patent:
March 23, 2021
Yoshiteru Nishida, Hidekazu Iida, Kenta Chito, Youngsuk Kim
Abstract: A laser beam oscillated by a laser oscillator is condensed by a condenser. The condenser includes: a concave lens; a convex lens disposed at a predetermined interval from the concave lens, and disposed at a position such that aberration of a condensing point in the atmosphere is zero; and an actuator that generates an aberration at the condensing point in the atmosphere by changing the distance of the convex lens with respect to the concave lens. The actuator generates the aberration in the atmosphere such that the aberration of the condensing point is zero within a workpiece.
Abstract: A wafer processing method is used in processing a wafer including a device area and a peripheral marginal area surrounding the device area. The device area has a plurality of devices and an electrode connected to each device. The wafer processing method includes the steps of cutting a first area of the peripheral marginal area, fixing the front side of the wafer through an adhesive to a carrier substrate, grinding a back side of the wafer, supplying a chemical solution to the back side of the wafer to thereby etch the wafer such that the electrode projects from the back side of the wafer, forming an insulating film on the back side of the wafer, cutting a second area of the peripheral marginal area, the second area being not in contact with the adhesive, thereby removing the second area, and polishing the insulating film.
Abstract: A cutting apparatus includes a cutting unit that cuts a workpiece included in a frame unit, an ultraviolet ray irradiation unit that irradiates the frame unit with ultraviolet rays, and a control unit. The control unit includes a processing mode registration section in which commands to be output to components. The processing mode registration section registers therein a command in a cutting apparatus mode that causes the cutting unit to cut the workpiece and a command in an ultraviolet ray irradiation apparatus mode that causes the ultraviolet ray irradiation unit to irradiate the frame unit with ultraviolet rays.
Abstract: A diamond substrate producing method includes a belt-shaped separation layer forming step of applying a laser beam to a diamond ingot as relatively moving the ingot and a focal point of the laser beam in a -direction perpendicular to a (110)-plane, thereby forming a belt-shaped separation layer extending in the -direction inside the ingot, an indexing step of relatively moving the ingot and the focal point in an indexing direction parallel to a (001)-plane and perpendicular to the -direction, a planar separation layer forming step of repeating the belt-shaped separation layer forming step and the indexing step to thereby form a planar separation layer parallel to the (001)-plane inside the ingot, the planar separation layer being composed of a plurality of belt-shaped separation layers arranged side by side in the indexing direction, and a separating step of separating a substrate from the diamond ingot along the planar separation layer.