Patents Assigned to Disco Corporation
  • Publication number: 20220148905
    Abstract: Provided is a back grinding adhesive sheet which can adequately protect protrusions provided to a semiconductor wafer, and with which back grinding can be adequately performed. The present invention provides a back grinding adhesive sheet for a semiconductor wafer having protrusions, the back grinding adhesive sheet comprising a non-adhesive cushion layer, and an adhesive layer provided on the cushion layer. The adhesive layer has an opening with a smaller diameter than the diameter of the semiconductor wafer, and the outer edge of the semiconductor wafer is adhered to the adhesive layer such that the protrusions on the semiconductor wafer are positioned inside the opening. The protrusions are protected by the cushion layer when the semiconductor wafer is in the state of being adhered to the adhesive layer. The adhesive sheet satisfies at least one of the following conditions (1)-(2).
    Type: Application
    Filed: February 21, 2020
    Publication date: May 12, 2022
    Applicants: DISCO CORPORATION, DENKA COMPANY LIMITED
    Inventors: Karl Heinz Priewasser, Tomoya Tsukui, Tomoyuki Kanai, Takeshi Saito
  • Patent number: 11328956
    Abstract: A wafer processing method includes a modified layer forming step of applying a laser beam of a wavelength having transmitting property to a wafer with a focusing point of the laser beam positioned inside the wafer at positions corresponding to division lines, thereby to form modified layers, and a back side grinding step of holding the wafer on a chuck table of a grinding apparatus, grinding a back side of the wafer to thin the wafer, and dividing the wafer into individual device chips from cracks that are generated from the modified layers formed inside the wafer along the division lines to the division lines formed on a front side of the wafer. In the modified layer forming step, in a case where triangular chips each having a surface area smaller than the device chips are to be formed, the application of the laser beam is stopped in a region where the triangular chips are to be formed.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: May 10, 2022
    Assignee: DISCO CORPORATION
    Inventors: Masaru Nakamura, Hisayuki Yamaoka
  • Patent number: 11325204
    Abstract: A processing apparatus includes: a chuck table that is configured to be capable of rotation in a state of supporting the workpiece; a processing unit including a spindle to which a processing tool for grinding or polishing is mounted and a drive source that rotates the spindle; a measuring unit that measures distribution of thickness of the workpiece; a laser beam applying unit that has an adjustor for adjusting power of a laser beam applied to the workpiece; and a control unit including a power setting section that sets the power of the laser beam applied to an arbitrary region of the workpiece based on the distribution of the thickness of the workpiece measured by the measuring unit, and an adjustor control section that controls the adjustor of the laser beam applying unit such as to realize the power of the laser beam set by the power setting section.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: May 10, 2022
    Assignee: DISCO CORPORATION
    Inventor: Keiji Nomaru
  • Patent number: 11325804
    Abstract: A tape attaching method for attaching a tape to a workpiece includes a placing step of placing the workpiece with respect to the tape, which has a base material and an adhesive layer on the base material, in such a manner that the adhesive layer is in contact with an attached face of the workpiece, and a close contact step of causing, after the placing step is performed, a ball to roll in contact with the base material of the tape, thereby to bring the tape in close contact with the workpiece.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: May 10, 2022
    Assignee: DISCO CORPORATION
    Inventors: Jinyan Zhao, Shigenori Harada
  • Patent number: 11328945
    Abstract: A wafer forming apparatus includes a conveying tray having an ingot accommodating section that accommodates a semiconductor ingot and a wafer accommodating section that accommodates a wafer formed from the semiconductor ingot, a belt conveyor unit that conveys the conveying tray to each processing apparatus, a cassette rack on which cassettes accommodating the wafers are placed correspondingly to the conveying trays, and a transferring unit that transfers the wafer from the wafer accommodating section of the conveying tray to the cassette placed on the cassette rack. The conveying tray is provided with an identification mark. The cassette rack or the cassette corresponding to the conveying tray is provided with the same identification mark as the identification mark provided on the conveying tray.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: May 10, 2022
    Assignee: DISCO CORPORATION
    Inventors: Kentaro Iizuka, Ryohei Yamamoto
  • Patent number: 11325205
    Abstract: In a laser processing apparatus, a height of a focusing lens in a processing unit can be changed according to a change in height of an upper surface of a wafer, thereby changing a vertical position of a focal point of a laser beam inside the wafer. Accordingly, the laser beam can be applied to the wafer as feeding the wafer in a condition where the focal point is set at a vertical position spaced a fixed distance from the lower surface of the wafer. As a result, a modified layer can be formed inside the wafer at a uniform height from the lower surface of the wafer.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: May 10, 2022
    Assignee: DISCO CORPORATION
    Inventor: Atsushi Ueki
  • Patent number: 11325284
    Abstract: A protective member forming method for forming a protective member on a surface on one side of a wafer includes a resin state recognizing step of heating a thermoplastic resin in contact with the surface on the one side of the wafer while propagating an ultrasonic vibration between a resin placing surface of a stage and a wafer holding surface and recognizing whether or not the thermoplastic resin sandwiched between the surface on the one side of the wafer held on the wafer holding surface and the resin placing surface has been unified. When the thermoplastic resin is recognized to have been unified, the thermoplastic resin is spread out onto a whole area of the surface on the one side of the wafer, followed by cooling the thermoplastic resin to cure the thermoplastic resin.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: May 10, 2022
    Assignee: DISCO CORPORATION
    Inventor: Yoshinobu Saito
  • Publication number: 20220135848
    Abstract: Provided is an adhesive sheet for backgrinding which enables sufficient backgrinding while protecting protrusions provided on a semiconductor wafer. The present invention provides an adhesive sheet for the backgrinding of a semiconductor wafer that has protrusions, said adhesive sheet being characterized by comprising a non-adhesive cushion layer and an adhesive layer provided on the cushion layer, with a curable resin and a support film being layered on the cushion layer side for use, wherein the viscosity of the curable resin prior to curing is 100-3000 mPa·s, the Shore D hardness of the curable resin layer subsequent to curing is 5-72, and at least one of conditions (1) and (2) is satisfied. (1) When punched in the shape of a dumbbell in accordance with JIS Z1702 and stretched by 25% at a tensioning speed of 300 mm/min with a gauge length of 40 mm, the cushion layer has a tensile stress of 2-30 N/10 mm. (2) The cushion layer is composed of a thermoplastic resin that has a melting point of 60-110° C.
    Type: Application
    Filed: February 21, 2020
    Publication date: May 5, 2022
    Applicants: DISCO CORPORATION, DENKA COMPANY LIMITED
    Inventors: Karl Heinz Priewasser, Tomoya Tsukui, Tomoyuki Kanai, Takeshi Saito
  • Patent number: 11321550
    Abstract: A processing apparatus includes a chuck table, a processing unit configured to process a workpiece held on the chuck table, a height measuring unit fitted to the processing unit, the height measuring unit measuring, as height data, heights at a plurality of coordinates of the holding surface measured while a moving unit is moved, a reading unit capable of reading an information medium, and a control unit. The chuck table includes an information medium on which identifying information distinguishing the chuck table is recorded. The control unit includes a height data recording section configured to record the height data and the identifying information in association with each other, and a processing control section configured to control a height of the processing unit during processing on the basis of the height data associated with the identifying information read by the reading unit.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: May 3, 2022
    Assignee: DISCO CORPORATION
    Inventor: Satoshi Hanajima
  • Patent number: 11322404
    Abstract: A wafer processing method includes applying a laser beam of such a wavelength as to be transmitted through a wafer to the wafer from a back surface of the wafer, with a focal point of the laser beam positioned at a predetermined point inside the wafer, to form division start points along streets, the division start point including a modified layer and a crack extending from the modified layer to a front surface of the wafer; and grinding the back surface of the wafer by a grinding wheel having a plurality of grindstones in an annular pattern, to thin the wafer and divide the wafer into individual device chips. In forming the division start points, a chuck table is heated to a predetermined temperature, whereby the cracks formed inside the wafer to extend from the modified layers to the front surface of the wafer are grown.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: May 3, 2022
    Assignee: DISCO CORPORATION
    Inventor: Masaru Nakamura
  • Patent number: 11322386
    Abstract: A transfer apparatus holdes a plate-shaped workpiece under suction in a noncontact condition and transfers the workpiece. The transfer apparatus includes a base, a Bernoulli transfer pad fixed to the base for spraying air toward the workpiece to produce a vacuum, and a moving unit for moving the base. The Bernoulli transfer pad includes a cylindrical pad body. The pad body has a lower surface as a holding surface to which a fluid spraying portion opens and an annular pad mounting portion for mounting an annular pad. When the annular pad is mounted on the annular pad mounting portion, the holding surface is increased in a radial direction of the pad body to thereby increase a suction force for sucking the workpiece.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: May 3, 2022
    Assignee: DISCO CORPORATION
    Inventor: Bin Go
  • Patent number: 11322476
    Abstract: A manufacturing method of a semiconductor package includes a groove forming step of cutting a semiconductor package substrate from an upper surface side along division lines in a cut-in-depth range of at least such a depth as to cause a ground line included in a wiring substrate to be exposed in a processing groove to such a depth that the semiconductor package substrate is not fully cut with a first cutting blade, thereby forming the processing groove having a first width at least on an upper surface of a sealing material, a shielding layer forming step of forming a shielding layer on a side surface of the processing groove, a bottom surface of the processing groove, and the upper surface of the sealing material with a conductive material from an upper side of the sealing material, and a dividing step of, cutting the semiconductor package substrate into individual semiconductor packages.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: May 3, 2022
    Assignee: DISCO CORPORATION
    Inventors: Byeongdeck Jang, Youngsuk Kim
  • Patent number: 11318625
    Abstract: A ring frame holding mechanism holds under suction a lower surface of a ring frame when the ring frame is set at a target position, by using a positioning unit. In positioning the ring frame, air is discharged through a suction cup in a table to thereby form an air layer between the upper surface of the table and the lower surface of the ring frame. This air layer brings the ring frame and the suction cup into a noncontact state and also depresses the suction cup downward so that the upper end of the suction cup becomes flush with the table. Accordingly, the ring frame can be floated over the suction cup, so that the ring frame can be easily moved horizontally. That is, the ring frame can be easily set to the target position and the occurrence of improper positioning can be suppressed.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: May 3, 2022
    Assignee: DISCO CORPORATION
    Inventors: Masahiro Wada, Naohisa Watanabe
  • Patent number: 11322403
    Abstract: A wafer processing method includes: cutting a device layer stacked on a semiconductor substrate along division lines to form cut grooves; positioning a focal point of a laser beam having a transmission wavelength to the semiconductor substrate inside an area of the semiconductor substrate corresponding to a predetermined one of the division lines and applying the laser beam to the wafer from a back surface of the wafer, thereby forming a plurality of modified layers inside the wafer along all of the division lines; and grinding the back surface of the wafer to be thinned, causing a crack to grow from each of the modified layers formed inside the area of the semiconductor substrate corresponding to the predetermined one of the division lines to the front surface side of the wafer, thereby dividing the wafer into individual device chips.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: May 3, 2022
    Assignee: DISCO CORPORATION
    Inventor: Masaru Nakamura
  • Patent number: 11322376
    Abstract: A peeling apparatus includes a holding table for holding a plate-shaped workpiece having an upper surface and a lower surface, the upper surface being covered with a protective member. The lower surface of the workpiece is held on the holding table. A peeling mechanism peels off the protective member from the workpiece, and a recovery box is set in the peeling apparatus for recovering the protective member. The recovery box has an upper opening from which the protective member is put into the recovery box. The peeling apparatus further includes a removing mechanism for allowing the protective member to be put into the recovery box from the upper opening, and also allowing the protective member recovered into the recovery box to be removed from the recovery box, while operating the peeling mechanism to peel off the protective member.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: May 3, 2022
    Assignee: DISCO CORPORATION
    Inventor: Fumiaki Ito
  • Patent number: 11322406
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyester sheet, then picking up each device chip from the polyester sheet.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: May 3, 2022
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Patent number: 11322383
    Abstract: A protective film agent for laser dicing that includes a solution in which at least a water-soluble resin, an organic solvent, and an ultraviolet absorber are mixed and in which the content of sodium (Na) of the solution is equal to or lower than 100 ppb in weight ratio. Preferably, the solution further includes an antioxidant.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: May 3, 2022
    Assignee: DISCO CORPORATION
    Inventors: Senichi Ryo, Yukinobu Ohura, Hiroto Yoshida, Tomoaki Endo
  • Patent number: 11319214
    Abstract: A waste liquid treating apparatus includes a waste liquid accommodating unit for waste water discharged from a processing apparatus. A waste liquid filter unit filters the waste liquid in that tank to purify the waste liquid into fresh water. A fresh water reservoir tank reserves the fresh water obtained by filtering the waste liquid by the waste liquid filter unit. A pure water producing unit purifies the fresh water reserved in the fresh water reservoir tank into pure water, and a temperature control unit controls the pure water obtained by purifying the fresh water by the pure water purifying unit to a predetermined temperature. A bubble water seal type pump sucks at least bubbles generated in the waste liquid filter unit, and a sealing water reservoir tank reserves the bubbles sucked by the bubble water seal type pump as a waste liquid.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: May 3, 2022
    Assignee: DISCO CORPORATION
    Inventors: Tadaomi Matsumoto, Masaru Saito
  • Patent number: 11322407
    Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: May 3, 2022
    Assignee: DISCO CORPORATION
    Inventors: Shigenori Harada, Minoru Matsuzawa, Hayato Kiuchi, Yoshiaki Yodo, Taro Arakawa, Masamitsu Agari, Emiko Kawamura, Yusuke Fujii, Toshiki Miyai, Makiko Ohmae
  • Patent number: 11318573
    Abstract: A transfer jig for use in transferring a new cutting blade as a replacement component to the processing unit, in a cutting apparatus including a chuck table holding a workpiece, a processing unit having a spindle and a cutting blade detachably mounted on the spindle, a cutting blade changing unit changing the cutting blade, and a transfer mechanism supplying the workpiece to the processing unit. The transfer jig has a plurality of receiving portions each adapted to receive the new cutting blade and the cutting blade changed by the cutting blade changing unit. The transfer jig is adapted to be transferred by the transfer mechanism transferring the workpiece.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: May 3, 2022
    Assignee: DISCO CORPORATION
    Inventor: Kazuki Terada