Abstract: An edge position detecting apparatus for detecting a position of an edge of a disk-shaped workpiece includes a chuck table having a holding surface for holding the workpiece thereon, a laser displacement gage having a laser applying unit including a light source, for applying a linear laser beam shaped into a linear shape perpendicular to a direction of travel from the light source toward the holding surface, across the edge of the workpiece, and a beam detecting unit including a plurality of photoelectric transducers arrayed at predetermined spaced intervals along a direction for detecting a reflection of the linear laser beam, a moving mechanism for moving the laser displacement gage and the chuck table relatively to each other along the longitudinal direction, and a calculating unit for calculating the position of the edge on the basis of information of a change in an amount of the detected reflection.

Abstract: A thermocompression bonding method for thermocompression bonding a sheet to a workpiece, where the method includes a stacking step of placing the sheet between a flat plate and the workpiece to form a stack in which the sheet is held between the workpiece and an entire surface of the flat plate and a thermocompression bonding step of thermocompression bonding the sheet to the workpiece while planarizing the sheet with the flat plate by heating the sheet and applying an external force to the stack, after performing the stacking step.

Abstract: A method of grinding a workpiece includes a holding step of holding the workpiece on a flat holding surface of a holding table and a grinding step of rotating a grinding wheel to turn grindstones along an annular track while rotating the holding table, and bringing the grindstones into grinding contact with an upper surface of the workpiece to thereby grind the workpiece. The grinding step includes the step of bringing the grindstones into grinding contact with the upper surface of the workpiece in a state where the annular track is closest to the holding surface in an area between a point above a center of the holding surface and a point above an outer circumferential end of the holding surface.

Abstract: When processing of all the wafers accommodated in a first cassette mounted on a first cassette stage is ended, the last wafer is conveyed out from a holding surface of a chuck table, and the holding surface becomes vacant, the wafer accommodated in a second cassette mounted on a second cassette stage is immediately conveyed onto the holding surface, by control by a conveyance control section. When the wafer to be held by the holding surface is changed from the wafer conveyed out from the first cassette to the wafer conveyed out from the second cassette, processing conditions are changed over to the processing conditions corresponding to the second cassette stage, by changeover control by a changeover section.

Abstract: A linear gauge includes a contact member having a lower tip to be positioned facing a workpiece; an air slider including a cylinder surrounding the contact member with a clearance left between them, and configured to eject air such that the contact member is supported movably in a vertical direction; a scale that detects a height position of the contact member; a casing accommodating therein the contact member, the air slider, and the scale; an evacuation portion formed in an upper portion of the cylinder such that the ejected air is evacuated into the casing; and a communication channel communicating an inlet, which is formed in an upper portion of the contact member, and an outlet, which is formed in the lower tip of the contact member, with each other inside the contact member.

Abstract: A setting method of a protective component includes a resin supply step of supplying a thermoplastic resin to a flat support surface of a support table, and a protective component forming step of shaping the thermoplastic resin into a sheet shape through pressing and spreading the thermoplastic resin along the support surface while heating and softening the thermoplastic resin to form a protective component of the thermoplastic resin in the sheet shape on the support surface. The setting method includes also a protective component bonding step of bringing a front surface that is one surface of the workpiece into tight contact with one surface of the protective component in the sheet shape and heating the protective component in tight contact to bond the protective component to the workpiece, and a post-bonding cooling step of cooling the protective component heated in the protective component bonding step.

Abstract: A mechanism for detecting the inside of a workpiece includes a wavelength delaying unit for outputting each pulse of a pulsed laser beam emitted from a laser oscillator with time differences imparted to respective wavelengths, and a ring generating unit for generating a ring-shaped pulsed laser beam from the pulsed laser beam with the time differences imparted to the respective wavelengths and diffracting the ring-shaped pulsed laser beam into ring-shaped laser beams ranging from small to large at the respective wavelengths. When the ring-shaped laser beams with the time differences imparted to the respective wavelengths are applied to the workpiece, they produce an interference wave of ultrasonic waves in the workpiece, and vibrations are produced at a position where the interference wave of the ultrasonic waves is converged. A laser beam is applied to an upper surface of the workpiece at a position aligned with the center of the vibrations.

Abstract: A protective member forming apparatus includes an ultraviolet radiation applying table that supports a workpiece on a support surface of a support plate thereof through which ultraviolet rays are transmittable, a delivery unit that holds a resin sheet to which the workpiece is fixed, to unload the workpiece from the ultraviolet radiation applying table, a resin supply unit that supplies an ultraviolet-curable liquid resin to the resin sheet placed on the support surface, a pressing unit that presses the workpiece from a reverse side thereof toward the liquid resin supplied to the resin sheet placed on the support surface, and an ionizer unit that ejects ionized air to the support surface of the ultraviolet radiation applying table.

Abstract: A processing apparatus includes a table base to which a jig table is removably secured, a cutting unit, a moving assembly for moving the table base between a processing area and a mounting/dismounting area, and a delivery assembly for delivering the jig table from a temporary rest area onto the table base while applying a negative pressure to a second suction channel of the jig table. The delivery assembly includes a pair of grippers for gripping both sides of the jig table, a suction pipe connected to the second suction channel of the jig table that is gripped by the grippers, and a lifting and lowering unit for positioning the suction pipe selectively in an operative position where the suction pipe is connected to the second suction channel and a lifted position where the suction pipe is spaced from the second suction channel.

Abstract: There is provided an inclination adjusting mechanism including an annular upper plate that has an upper surface for connecting a table and a lower surface inclined relative to the upper surface, an annular lower plate that has an upper surface parallel to the lower surface of the upper plate and a lower surface parallel to the upper surface of the upper plate and facing an upper surface of a base, an upper rotating mechanism that rotates the upper plate, a lower rotating mechanism that rotates the lower plate, a first bearing provided between the lower surface of the upper plate and the upper surface of the lower plate, a second bearing provided between the lower surface of the lower plate and the upper surface of the base, and a connecting mechanism that connects the upper plate, the lower plate, and the base.

Abstract: A processing apparatus includes a holding unit holding a workpiece, a processing unit processing the workpiece held by the holding unit, a feeding mechanism for feeding the holding unit, and a control unit controlling the feeding mechanism. The holding unit has a chuck table for holding the workpiece and a base for detachably supporting the chuck table. The chuck table includes a plurality of kinds of chuck tables, one of which being selected according to the size or shape of the workpiece. The base is capable of mounting the chuck table selected from the plural kinds of chuck tables. The control unit functions to set feeding conditions including acceleration of the feeding mechanism according to the kind of the chuck table mounted on the base and to control the feeding mechanism under the feeding conditions according to the chuck table.

Abstract: A wafer having on one side a device area with a plurality of devices is processed by providing a protective film and applying the protective film, for covering the devices on the wafer, to the one side of the wafer, so that a front surface of the protective film is in direct contact with the one side of the wafer. The protective film is heated during and/or after applying the protective film to the one side of the wafer, so that the protective film is attached to the one side of the wafer, and the side of the wafer opposite to the one side is processed. Further, the invention relates to a method of processing such a wafer in which a liquid adhesive is dispensed only onto a peripheral portion of a protective film and/or only onto a peripheral portion of the wafer.

Abstract: A blade holding jig for holding a washer-type cutting blade via an annular retainer flange includes an annular flange holding portion configured to hold a first annular surface of the retainer flange under suction, and an annular non-contact suction portion arranged on an outer peripheral portion of the flange holding portion and configured to produce a negative pressure by ejection of a fluid toward the outer peripheral portion of the retainer flange held by the flange holding portion and to draw up the cutting blade toward the retainer flange. The cutting blade drawn up toward the retainer flange by the non-contact suction portion is held on the retainer flange by a suction force acting from the flange holding portion via a plurality of through holes disposed extending from a second annular surface to the first annular surface of the retainer flange.

Abstract: A polishing apparatus includes a holding table having a holding surface that holds a wafer, a polishing unit in which a polishing pad having an opening at the center of a polishing surface that polishes the wafer is mounted to a spindle and is rotated, a slurry supply unit that supplies slurry to the polishing surface of the polishing pad, and an air supply unit that shuts an upper end of a penetrating path penetrating through the axial center of rotation of the polishing pad and the spindle and supplies air into the penetrating path.

Abstract: A laser oscillator support table includes a base, a fixed plate supported over the base with intermediary of a Z-axis direction movement unit, and a Y-axis direction moving plate mounted on the fixed plate, movable orthogonal to an X-axis direction. An optical path direction of the beam emitted from a laser oscillator supported by the laser oscillator support table is defined as the X-axis direction. The laser oscillator support table further includes a rotating plate that is mounted on the Y-axis direction moving plate rotatably around a rotation center pin fixed to the Y-axis direction moving plate and supports the laser oscillator, a Y-axis direction movement unit that moves the Y-axis direction moving plate in the Y-axis direction, and a rotational movement unit that rotates the rotating plate around the rotation center pin in a plane parallel to a plane formed by the X-axis direction and the Y-axis direction.

Abstract: A control unit of processing apparatus includes a processing condition storing section that stores processing condition data of the processing apparatus and a display control section that causes a display part to display a processing condition screen relating to the processing condition data. The display control section causes the processing condition screen to display function objects that allow identification of functions to be executed on the basis of the processing condition data by the processing apparatus.

Abstract: A protective sheet sticking apparatus includes a cutting unit that cuts a protective sheet stuck to a wafer along an outer circumference of the wafer while bringing a cutting part of a cutting blade into contact with the outer circumference of the wafer. The cutting unit has a cutting blade support part that supports the cutting blade rotatably in such a manner that the direction of a cutting edge of the cutting part is adjustable from the outside in the radial direction of the wafer to the inside. The cutting blade support part includes a first biasing spring that makes biasing to cause the cutting part to be oriented toward the inside and a second biasing spring that makes biasing to cause the cutting part to be oriented toward the outside in order to prevent the cutting part from being oriented toward the inside by a predetermined angle or larger.

Abstract: Edge trimming is performed on a wafer while a cleaning liquid is supplied to the center of a face side of the wafer and the wafer is rotated to form a film of the cleaning liquid that covers the face side of the wafer. The film of the cleaning liquid prevents the face side of the wafer from being dried, lowering the probability that swarf will be introduced into devices on the face side of the wafer. In addition, the consumption of the cleaning liquid can be reduced compared with a step of performing edge trimming on the wafer while supplying a curtain of cleaning liquid to the entire face side of the wafer.

Abstract: A wafer manufacturing method includes a wafer preparing step of preparing a wafer including a semiconductor device formed in each of a plurality of regions demarcated by a plurality of streets intersecting each other, a support substrate fixing step of fixing the wafer to a support substrate, a removing step of removing, from the wafer, a defective device region including a semiconductor device determined to be a defective product among a plurality of the semiconductor devices formed in the wafer, and a fitting step of fitting, into a removed region formed by removing the defective device region from the wafer, a device chip including a semiconductor device as a non-defective product having same functions as those of the semiconductor device determined to be a defective product and having a size capable of being fitted into the removed region, and fixing the device chip to the support substrate.

Abstract: A peeling method for peeling off a substrate provided over a front surface of a support plate through a peel layer from the support plate after dividing the substrate into a plurality of small pieces, the peeling method comprising: a first holding step of holding the support plate by a first holding unit; a dividing step of causing a cutting blade to cut into the substrate, or applying a laser beam of such a wavelength as to be absorbed in the substrate to the substrate, along division lines set on the substrate, to divide the substrate into the plurality of small pieces; a start point region forming step of blowing a fluid to the peel layer exposed at an end portion of a small piece among the plurality of small pieces, to form a start point region which will serve as a start point when peeling off the small piece from the support plate; a second holding step of holding the small piece by a second holding unit; and a peeling step of relatively moving the first holding unit and the second holding unit in direc