Abstract: A process for fabricating a capacitance type tri-axial accelerometer comprises of preparing a wafer having an upper layer, an intermediate layer and a lower layer, etching the lower layer of the wafer to form an isolated proof mass having a core and four segments extending from the core, etching the upper layer of the wafer to form a suspension and four separating plates, etching away a portion of the intermediate layer located between the four segments of the proof mass and the plates of the upper layer, and disposing an electrical conducting means to pass through the intermediate layer from the suspension to the core of the proof mass.

Abstract: A holder includes a main body on which a plurality of circuit lines are laid out. The main body is integrally molded from a plastic material and can be formed thereon with a circuit layout by a specific process, such as a laser activated and chemical plating process. The main body includes a chamber having an opening formed at the top side of the main body, a base surface, and a stepped wall. Each of the circuit lines is arranged on the stepped wall of the chamber stereoscopically. Thus, the holder does not need to make a hole running therethrough to reach electrical connection between surfaces of different heights. Besides, the circuit lines are arranged stereoscopically, so they can extend to the top and bottom sides of the holder. Therefore, the holder can be applied to not only the traditional package but an upside-down package.

Abstract: A MEMS sensor capable of sensing acceleration and pressure includes a frame, a proof mass and flexible bridges connected between the frame and the proof mass in such a way that the proof mass is moveably suspended inside the frame. The proof mass is provided with a pressure sensing diaphragm and a sealed chamber corresponding to the diaphragm such that the proof mass is not only served as a moveable sensing element for acceleration measurement but also a pressure sensing element.

Abstract: A method for separating a semiconductor wafer into chips includes the steps of sandwiching a soluble spacer between a wafer and a substrate to form a laminate, etching the wafer into a plurality of chips attached on the spacer, positioning the laminate in a chamber of an apparatus in a way that the etched wafer faces a stage of the apparatus, and introducing a solvent into the chamber to dissolve the soluble spacer so as to facilitate the chips to be supported on the stage.

Abstract: A method for separating a semiconductor wafer into chips includes the steps of sandwiching a soluble spacer between a wafer and a substrate to form a laminate, etching the wafer into a plurality of chips attached on the spacer, positioning the laminate in a chamber of an apparatus in a way that the etched wafer faces a stage of the apparatus, and introducing a solvent into the chamber to dissolve the soluble spacer so as to facilitate the chips to be supported on the stage.

Abstract: A highly thermally conductive interface means comprises a plurality of non-particulate solid components and a liquid bonding paste. The non-particulate solid components are made of high heat-conducting materials and dispersedly disposed on interfaces between heat sources and heat sinks. The liquid bonding paste is applied on interfaces between heat sources and heat sinks and filled into gaps formed among each of said non-particulate solid components so that the heat sources, heat sinks and each of said non-particulate solid components are bonded together.

Abstract: A microelectromechanical sensor device package includes a substrate, a microelectromechanical sensor device and a cap. The substrate has a surface on which a circuit pattern having a plurality of first conductive contacts is provided. The device is mounted on the surface of the substrate and has an active surface on which a plurality of second conductive contacts are provided. A plurality of bonding wires are used to electrically connect the first conductive contacts to the second conductive contacts respectively. The cap is made of an electrically insulating material and attached on the surface of the substrate in a way that the cap covers the microelectromechanical sensor device and a space is formed between the cap and the microelectromechanical sensor device.

Abstract: A bulb for an electric lamp having a light-emitting element includes a light transmittable shell body for housing the light-emitting element. The light transmittable shell body includes an accommodation for receiving the light-emitting element of the electric lamp, and an inner surface surrounding the accommodation. On the inner surface of the light transmittable shell body a plurality of light-guiding portions are provided for guiding the light emitted from the light-emitting element towards an outside of the light transmittable shell body.

Abstract: A method includes the steps of preparing a tray having at least one chamber with an opening facing upward; placing at least one electronic component in the chamber; filling the chamber with a liquid that does not react with the at least one electronic component; and sealing the chamber. In light of this, when the electronic component having any kind of shape is placed in the chamber, the space for movement of the electronic component is limited, so that the electronic component is not subject to damage incurred by collision during transportation. In light of this, the chances of damaging the electronic component during transportation can be effectively decreased.

Abstract: A chip packaging structure without leadframe includes a bare chip having one surface provided with a plurality of contacts, and an adhesive and a fixing layer sequentially attached to the surface of the bare chip with the contacts, and a plurality of lead wires sandwiched between the adhesive and the fixing layer. Each of the lead wires has an inner end electrically connected to one of the contacts on the bare chip via an inner connecting window area provided on the adhesive layer corresponding to the contacts on the bare chip, and an outer end extended to one of multiple outer connecting window areas provided on the fixing layer to electrically connect to one of many external conducting bodies implanted in and exposed from the outer connecting window areas, such that no leadframe is needed to enable further reduced volume and decreased packaging cost of the whole chip packaging structure.

Abstract: A transistor structure includes at least one chip; a packaging insulating layer, a first adhesive layer, a conducting layer, and a second adhesive layer sequentially provided on one side of the chip having electrical contacts thereon, so that the conducting layer is bonded between the first and the second adhesive layer; and a leadframe bonded to an outer side of the second adhesive layer. The conducting layer may be a metal sheet, a metal film, or a type of conducting fiber. The leadframe is connected to the electrical contacts on the chip via lead wires, and at least one of the electrical contacts on the chip is connected to the conducting layer via a conductor, so that the conducting layer is able to isolate electrical noises and reduce electromagnetic interferences, improve rates of transmission and heat release, strengthen chip packaging structure, and serve as a common grounding circuit.

Abstract: A chip packaging structure adapted to reduce EMI includes a chip having contacts provided on one side thereof, and a leadframe having a plurality of leads arranged in a predetermined manner and provided at a bottom side with a conducting protrusion each for electrically connecting to external elements. The leadframe is fixedly attached to one side of the chip having the contacts provided thereon, and the leads are electrically connected at inner ends to the contacts via lead wires. An adhesive layer is applied to one side of the leadframe having the protrusions to thereby adhere a conducting layer to the leadframe with the protrusions downward extended through multiple through holes on the conducting layer; and at least one of the contacts on the chip is electrically connected to the conducting layer for the latter to serve as a ground or a power plane.